KR960025510U - 버어 압착장치 - Google Patents

버어 압착장치

Info

Publication number
KR960025510U
KR960025510U KR2019940035257U KR19940035257U KR960025510U KR 960025510 U KR960025510 U KR 960025510U KR 2019940035257 U KR2019940035257 U KR 2019940035257U KR 19940035257 U KR19940035257 U KR 19940035257U KR 960025510 U KR960025510 U KR 960025510U
Authority
KR
South Korea
Prior art keywords
crimping device
burr
burr crimping
crimping
Prior art date
Application number
KR2019940035257U
Other languages
English (en)
Other versions
KR0132461Y1 (ko
Inventor
김일수
Original Assignee
아남산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남산업주식회사 filed Critical 아남산업주식회사
Priority to KR2019940035257U priority Critical patent/KR0132461Y1/ko
Publication of KR960025510U publication Critical patent/KR960025510U/ko
Application granted granted Critical
Publication of KR0132461Y1 publication Critical patent/KR0132461Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019940035257U 1994-12-23 1994-12-23 버어 압착장치 KR0132461Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940035257U KR0132461Y1 (ko) 1994-12-23 1994-12-23 버어 압착장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940035257U KR0132461Y1 (ko) 1994-12-23 1994-12-23 버어 압착장치

Publications (2)

Publication Number Publication Date
KR960025510U true KR960025510U (ko) 1996-07-22
KR0132461Y1 KR0132461Y1 (ko) 1998-12-01

Family

ID=19402371

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940035257U KR0132461Y1 (ko) 1994-12-23 1994-12-23 버어 압착장치

Country Status (1)

Country Link
KR (1) KR0132461Y1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302154B1 (ko) * 1998-10-16 2001-11-22 박주환 금속제프레스절단물의버제거방법및장치
KR100840120B1 (ko) * 2008-01-24 2008-06-19 허용석 슬리팅 절단면 버어처리 및 보호막 형성을 위한연속처리방법과 연속처리장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100505102B1 (ko) * 1998-03-11 2005-10-19 삼성전자주식회사 반도체소자제조용잉킹장비

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302154B1 (ko) * 1998-10-16 2001-11-22 박주환 금속제프레스절단물의버제거방법및장치
KR100840120B1 (ko) * 2008-01-24 2008-06-19 허용석 슬리팅 절단면 버어처리 및 보호막 형성을 위한연속처리방법과 연속처리장치

Also Published As

Publication number Publication date
KR0132461Y1 (ko) 1998-12-01

Similar Documents

Publication Publication Date Title
DE69432921D1 (de) Schnittstelleneinrichtung
BR9508012A (pt) Aparelho
DE69518102D1 (de) Abnahmevorrichtung
DE69535329D1 (de) Lasttreibervorrichtung
DE69507602T2 (de) Verdünnungsvorrichtung
DE69712719T2 (de) Lötvorrichtung
DE69502822D1 (de) Feuchtigkeitsabsorbierendes gerät
NO970620D0 (no) Vakuum-planteanordning
DE69711568T2 (de) Lötvorrichtung
DK0771144T3 (da) Anti-pikkeindretning
KR960025510U (ko) 버어 압착장치
DE69514226T2 (de) Steckervorrichtung
IT1274103B (it) Dispositivo gommatore
DE69508399T2 (de) Crimpzange
DE69513520T2 (de) Steckervorrichtung
DE59501029D1 (de) Anschliessvorrichtung
DE69521454D1 (de) Verbindungsvorrichtung
KR960007018U (ko) 고기구이 장치
DE69504113D1 (de) Drahtziehvorrichtung
KR960002976U (ko) 조작장치
KR960011991U (ko) 원판 압착장치
DE69516518D1 (de) Steckervorrichtung
ITUD940209A0 (it) Congegno elettrico
IT1273847B (it) Dispositivo gommatore
KR960025285U (ko) 멀티트랩장치

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J201 Request for trial against refusal decision

Free format text: TRIAL AGAINST DECISION OF REJECTION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL

E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20010829

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee