KR960015935U - Heat sink for hybrid integrated circuit printed board with improved adhesion and heat dissipation - Google Patents

Heat sink for hybrid integrated circuit printed board with improved adhesion and heat dissipation

Info

Publication number
KR960015935U
KR960015935U KR2019940028320U KR19940028320U KR960015935U KR 960015935 U KR960015935 U KR 960015935U KR 2019940028320 U KR2019940028320 U KR 2019940028320U KR 19940028320 U KR19940028320 U KR 19940028320U KR 960015935 U KR960015935 U KR 960015935U
Authority
KR
South Korea
Prior art keywords
integrated circuit
printed board
improved adhesion
hybrid integrated
circuit printed
Prior art date
Application number
KR2019940028320U
Other languages
Korean (ko)
Other versions
KR200156209Y1 (en
Inventor
신승태
Original Assignee
만도기계주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 만도기계주식회사 filed Critical 만도기계주식회사
Priority to KR2019940028320U priority Critical patent/KR200156209Y1/en
Publication of KR960015935U publication Critical patent/KR960015935U/en
Application granted granted Critical
Publication of KR200156209Y1 publication Critical patent/KR200156209Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR2019940028320U 1994-10-28 1994-10-28 Pcb cooling plate with enhanced mountability and cooling efficiency KR200156209Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940028320U KR200156209Y1 (en) 1994-10-28 1994-10-28 Pcb cooling plate with enhanced mountability and cooling efficiency

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940028320U KR200156209Y1 (en) 1994-10-28 1994-10-28 Pcb cooling plate with enhanced mountability and cooling efficiency

Publications (2)

Publication Number Publication Date
KR960015935U true KR960015935U (en) 1996-05-17
KR200156209Y1 KR200156209Y1 (en) 1999-09-01

Family

ID=19396658

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940028320U KR200156209Y1 (en) 1994-10-28 1994-10-28 Pcb cooling plate with enhanced mountability and cooling efficiency

Country Status (1)

Country Link
KR (1) KR200156209Y1 (en)

Also Published As

Publication number Publication date
KR200156209Y1 (en) 1999-09-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20030522

Year of fee payment: 5

LAPS Lapse due to unpaid annual fee