KR960015838A - Wafer automatic feeding method and apparatus - Google Patents

Wafer automatic feeding method and apparatus Download PDF

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Publication number
KR960015838A
KR960015838A KR1019940028218A KR19940028218A KR960015838A KR 960015838 A KR960015838 A KR 960015838A KR 1019940028218 A KR1019940028218 A KR 1019940028218A KR 19940028218 A KR19940028218 A KR 19940028218A KR 960015838 A KR960015838 A KR 960015838A
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South Korea
Prior art keywords
wafer
handler
automatic feeding
feeding device
predetermined
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KR1019940028218A
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Korean (ko)
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KR0137828B1 (en
Inventor
박성열
김기현
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황인길
아남산업 주식회사
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Priority to KR1019940028218A priority Critical patent/KR0137828B1/en
Publication of KR960015838A publication Critical patent/KR960015838A/en
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Publication of KR0137828B1 publication Critical patent/KR0137828B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

소정의 공정을 행하기 위하여, 자동으로 웨이퍼를 공급함으로써 생산성을 향상할 수 있는 웨이퍼의 자동 공급방법 및 그 장치에 관한 것으로, 소정 형상의 프레임을 포함하는 본체(20)와, 이 본체(20)의 일측부에 설치되어 소정의 반도체 제조공정을 실시하는 웨이퍼 홀더(10)와, 다수개의 웨이퍼 프레임(51)을 수납하고 있는 매거진(50)을 포함하는 반도체 웨이퍼의 이송장치에 있어서, 승강구동 및 직선이동이 가능하고, 상기 웨이퍼 홀더(10)와 매거진(50) 사이에 설치되는 핸들러(30)와, 이 핸들러(30)는 소정형상의 이송물을 처킹하기 위한 처킹장치를 구비하고 있으며, 상기 본체(20)의 양측부에 무한궤도 형상으로 회전하는 회전체와, 이 회전체는 다수 개의 구동풀리(46) 및 종동풀리(48)를 포함하는 구성으로 되어 있기 때문에, 수작업에 따른 오차 발생을 방지하여 반도체 제조 공정시의 정도를 향상시키고, 웨이퍼의 손상을 피할 수 있으며, 오퍼레이터를 필요로 하지 않게 되어 효율적인 전력의 운용을 꾀할 수 있다.A method and apparatus for automatically supplying a wafer capable of improving productivity by automatically supplying wafers for carrying out a predetermined process, the main body 20 including a frame of a predetermined shape, and the main body 20 In the transfer device of a semiconductor wafer comprising a wafer holder (10) provided at one side of the substrate for carrying out a predetermined semiconductor manufacturing process, and a magazine (50) containing a plurality of wafer frames (51), lifting and driving It is possible to move linearly, the handler 30 is provided between the wafer holder 10 and the magazine 50, and the handler 30 is provided with a chucking device for chucking the feed of a predetermined shape, Since the rotating body rotates in an orbit shape on both sides of the main body 20, and the rotating body includes a plurality of driving pulleys 46 and driven pulleys 48, it is possible to prevent errors caused by manual work. room To improve the degree of semiconductor manufacturing process, and avoids damage to the wafer, it is not required for the operator can be achieved the operation of an efficient power.

Description

웨이퍼의 자동 공급방법 및 그 장치Wafer automatic feeding method and apparatus

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 주요 구성을 나타내는 일부절단 평면도,1 is a partially cutaway plan view showing a main configuration of the present invention,

제2도는 (a) 및 (b)는 본 발명의 작동상태를 나타내는 일부절단 평면도,2 is a partially cutaway plan view showing an operating state of the present invention (a) and (b),

제3도는 (a) 및 (b)는 본 발명의 작동상태를 나타내는 단면도.3 is a cross-sectional view showing the operating state of (a) and (b) of the present invention.

Claims (10)

적정한 간격으로 상하 적층된 웨이퍼 프레임(51)을 핸들러(30)의 처킹수단으로 처킹하는 공정과, 처킹된 웨이퍼 프레임(51)을 좌우로 이송하는 공정과, 상기 웨이퍼 카세트(C)가 무한궤도 형상으로 회전하는 회전체상에 놓여지고, 미리 정해진 소정의 타입으로 이송되는 도중 및 그 사이에, 상기 핸들러(30)가 승하강하는 공정과, 상기 핸들러(30)가 상기 웨이퍼 프레임(51)을 웨이퍼 홀더(10)에 공급하는 공정과 소정의 공정이 종료된 웨이퍼 프레임(51)을 상기 웨이퍼 홀더(10)로부터 빼내는 공정을 포함하는 것을 특징으로 하는 웨이퍼의 자동 공급방법.Chucking the wafer frames 51 stacked up and down at appropriate intervals by the chucking means of the handler 30, transferring the chucked wafer frames 51 to the left and right, and the wafer cassette C is in an endless track shape. The handler 30 moves up and down on the rotating body which is placed on a rotating body which is rotated at a predetermined speed and is transferred to a predetermined type, and the handler 30 moves the wafer frame 51 to the wafer. And a step of removing the wafer frame (51) from the wafer holder (10) after the step of supplying the holder (10) and the predetermined step is completed. 소정 형상의 프레임을 포함하는 본체(20)와, 이 본체(20)의 일측부에 설치되어 소정의 반도체 제조공정을 실시하는 웨이퍼 홀더(10)와, 다수 개의 웨이퍼 프레임(51)을 수납하고 있는 매거진(50)을 포함하는 반도체 웨이퍼의 이송장치에 있어서, 승강구동 및 직선이동이 가능하고, 상기 웨이퍼 홀더(10)와 매거진(50) 사이에 설치되는 핸들러(30)와, 이 핸들러(30)는 소정 형상의 이송물을 처킹하기 위한 처킹장치를 구비하고, 있으며, 상기 본체(20)의 양측부에 무한궤도 형상으로 회전하는 회전체와, 이 회전체는 다수 개의 구동풀리(46) 및 종동풀리(48)를 포함하는 것을 특징으로 하는 웨이퍼의 자동 공급장치.A main body 20 including a frame of a predetermined shape, a wafer holder 10 provided on one side of the main body 20 to perform a predetermined semiconductor manufacturing process, and a plurality of wafer frames 51 are housed therein. In a semiconductor wafer transfer apparatus including a magazine (50), a lifter and a linear movement are possible, and a handler (30) provided between the wafer holder (10) and the magazine (50), and the handler (30). Is provided with a chucking device for chucking a feed of a predetermined shape, the rotating body to rotate in an orbit shape on both sides of the main body 20, the rotating body is a plurality of drive pulleys 46 and driven Automatic feeder of the wafer, characterized in that it comprises a pulley (48). 제2항에 있어서, 상기 처킹장치는, 상호 방향을 달리하는 적어도 2개의 집게(32)로 구성하는 것을 특징으로 하는 웨이퍼의 자동 공급장치.3. The automatic feeding device of a wafer according to claim 2, wherein the chucking device comprises at least two tongs (32) which are mutually different from each other. 제2항에 있어서, 상기 집게(32)는 공압 실린더 또는 솔레노이드 구동장치에 의하여 처킹/언처킹하는 것을 특징으로 하는 웨이퍼의 자동 공급장치.3. The automatic feeding device of a wafer according to claim 2, wherein the tongs are chucked / unchucked by a pneumatic cylinder or a solenoid drive. 제2항에 있어서, 상기 매거진(50)은, 리니어 샤프트 및 리니어 베어링으로 이루어지는 상하구동수단 및 정밀 위치조절을 위한 가이드 로울러 및 가이드 레일을 갖추고 있는 것을 특징으로 하는 웨이퍼의 자동 공급장치.3. The automatic feeding device of a wafer according to claim 2, wherein the magazine (50) is provided with a vertical driving means consisting of a linear shaft and a linear bearing, and a guide roller and a guide rail for precise position adjustment. 제2항에 있어서, 상기 웨이퍼 프레임(51)의 대향하는 바깥 테두리부에는, 직선부, (54)가 형성되는 것을 특징으로 하는 웨이퍼의 자동 공급장치.3. The wafer automatic feeding device according to claim 2, wherein a straight portion (54) is formed at an opposite outer edge portion of the wafer frame (51). 제2항에 있어서, 상기 회전체는 단면이 원형인 링벨트(40),(42)인 것을 특징으로 하는 웨이퍼의 자동 공급장치.3. The automatic feeding device of a wafer according to claim 2, wherein the rotating body is a ring belt (40, 42) having a circular cross section. 제2항에,있어서, 상기 회전체의 구동 메카니즘에는, 소정 갯수의 아이들링 로울러를 포함하는 것을 특징으로 하는 웨이퍼의 자동 공급장치.The automatic feeding device of a wafer according to claim 2, wherein the driving mechanism of the rotating body includes a predetermined number of idling rollers. 제2항에 있어서, 상기 핸들러(30)는, 모터에 의하여 미리 설정된 소정의 속도 및 시간으로 회전하는 리드 스크류(22)에 의하여 직선왕복운동을 함과 동시에 본체에 설치된 가이드(34)에 의하여 미끄럼 안내되는 것을 특징으로 하는 웨이퍼의 자동 공급장치.3. The handler (30) according to claim 2, wherein the handler (30) is linearly reciprocated by a lead screw (22) which rotates at a predetermined speed and time set by a motor and is slid by a guide (34) installed in the main body. Automatic feeding device of the wafer, characterized in that guided. 제7항에 있어서, 상기 링벨트(40),(42)는 모터(M)에 연결된 구동축(44)을 통하여 동일한 회전수로 회전하도록 되어 있는 것을 특징으로 하는 웨이퍼의 자동 공급장치.8. The wafer automatic feeding device according to claim 7, wherein the ring belt (40) and (42) are configured to rotate at the same rotational speed through a drive shaft (44) connected to the motor (M). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940028218A 1994-10-31 1994-10-31 Handling method for wafer and apparatus thereof KR0137828B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940028218A KR0137828B1 (en) 1994-10-31 1994-10-31 Handling method for wafer and apparatus thereof

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Application Number Priority Date Filing Date Title
KR1019940028218A KR0137828B1 (en) 1994-10-31 1994-10-31 Handling method for wafer and apparatus thereof

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KR960015838A true KR960015838A (en) 1996-05-22
KR0137828B1 KR0137828B1 (en) 1998-06-01

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100565718B1 (en) * 1999-01-29 2006-03-29 엘지전자 주식회사 apparatus for receiving automatic conversion terrestrial wavel satellete wave in digital TV
KR100552282B1 (en) * 1997-12-31 2006-05-11 삼성전자주식회사 Automatic feeding device of glass substrate and method of using the same
KR100701642B1 (en) * 2004-05-27 2007-03-29 시마쯔 코포레이션 Substrate transferring apparatus and substrate processing apparatus having the same
KR100765189B1 (en) * 2006-11-30 2007-10-15 세메스 주식회사 Method of transferring a substrate, and method and apparatus of processing a substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100552282B1 (en) * 1997-12-31 2006-05-11 삼성전자주식회사 Automatic feeding device of glass substrate and method of using the same
KR100565718B1 (en) * 1999-01-29 2006-03-29 엘지전자 주식회사 apparatus for receiving automatic conversion terrestrial wavel satellete wave in digital TV
KR100701642B1 (en) * 2004-05-27 2007-03-29 시마쯔 코포레이션 Substrate transferring apparatus and substrate processing apparatus having the same
KR100765189B1 (en) * 2006-11-30 2007-10-15 세메스 주식회사 Method of transferring a substrate, and method and apparatus of processing a substrate

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Publication number Publication date
KR0137828B1 (en) 1998-06-01

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