KR19990019864U - Reversing device for package marking - Google Patents

Abstract

1. TECHNICAL FIELD OF THE INVENTION

Reversing device for package marking

2. The technical gist of the invention

The present invention provides an inverting device for package marking that improves productivity by reducing marking defects by preventing the marking from being formed on the surface where marking should not be performed by installing a separate device that automatically flips the semiconductor package. There is this.

3. Summary of solution of design

The present invention is a fixing means formed with a plurality of vacuum holes on the upper surface to fix the package delivered from the robot; Means for reversing the marking surface of the package mounted on the fixing means to face upward; And an elevating means for seating the package reversed by the reversing means on the conveyor.

4. Important uses of the devise

The present invention is to provide a device for automatically making the marking surface of the package facing upwards to minimize the defect rate during marking, thereby improving productivity and work efficiency.

Description

Reversing device for package marking

The present invention relates to a device for reversing the marking portion of the package in order to mark the manufacturer, part number, etc. on one side of the semiconductor package, and more specifically, by automatically reversing the semiconductor package before marking The present invention relates to a reversing device for marking a package that can prevent marking defects and improve marking quality.

In general, on a semiconductor package, it is required to list the manufacturer and part number of the package in order to promote the company that manufactured the package or to be responsible for the after-sales service in the event of a failure of the package.

A marking apparatus for a general semiconductor package for satisfying the above requirements includes a magazine in which a plurality of semiconductor packages are accommodated, a conveyor belt on which the semiconductor package is placed and moved to the next device, and a semiconductor package from the magazine. And a robot for taking out and placing it on the conveyor belt, and a device for marking the semiconductor package transferred from the conveyor belt.

Here, since the marking surface is directed downward when the package is manufactured from the manufacturing equipment, the operator directly inverts the package and accommodates it in the magazine so that the surface on which the marking should be formed faces upward.

Then, the robot adsorbs the package contained in the magazine, takes the package out of the magazine and places it on the conveyor belt so that subsequent marking work is performed.

However, in the above-described general semiconductor package marking apparatus, when the semiconductor package is accommodated in a magazine, the operator is required to turn the package upside down because the marking surface of the package is manually performed by the operator. Forgotten, there is a problem that the marking is not formed on the surface that is not to be formed, so that a lot of defective products are mass-produced, the productivity is significantly reduced.

Therefore, the present invention has been made in view of the above problems, and by installing a separate device for automatically inverting the semiconductor package on one side of the marking device, by preventing the marking from being formed on the surface which should not be formed, the marking is poor. The purpose of the present invention is to provide a reversing device for marking a package so that the productivity is improved by reducing it.

1 is a schematic diagram showing an operation process of a reversing device for marking a package according to the present invention.

Figure 2 is a stage shaping one embodiment configuration of the reversing device for marking the package according to the present invention.

* Explanation of symbols for the main parts of the drawings

10: magazine 11: semiconductor package

20: robot 30: reversing means

31: first support part 32: lifting cylinder

33: rotating cylinder 34: timing belt

35: second support 36: timing pulley

37: reverse axis 38: elevator

39: vacuum adsorption plate 39a: vacuum hole

In order to achieve the above object, the present invention, a fixing means formed with a plurality of vacuum holes on the upper surface to fix the package delivered from the robot; Means for reversing the marking surface of the package mounted on the fixing means to face upward; And an elevating means for seating the package reversed by the reversing means on the conveyor.

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2 as follows.

As shown in FIG. 1, the reversing apparatus for package marking according to the present invention includes a robot 20 for removing and moving the packages 11 one by one from a magazine 10 in which a plurality of semiconductor packages 11 are accommodated. Reversal means 30 receives the package 11 from the robot 20 and reverses the package 11 to face upward, and receives the package 11 from the reversing means 30 to form a marking. Conveyor belt 30 is provided for transmitting to the marking unit (not shown).

Here, the reversing means 30 will be described in detail with reference to FIG. 2 as follows.

As shown, the reversing apparatus of the present invention, is installed on one side of the conveyor belt 40, the first support portion 31 for supporting the entire reverse means 30, and on one side of the first support portion 31 The lifting cylinder 32 to be fixed, and the rotation cylinder 33 is installed above the lifting cylinder (32).

In addition, the other side of the first support part 31 is installed so as to be rotatable by the rotation cylinder 33 through the first support part 31 and the timing belt 34 perpendicular to the first support part 31 and And a second support part 35 supporting the timing belt 34, a timing pulley 36 installed inside one end of the timing belt 34 and rotating together with the belt 34, and the timing pulley ( 36, which is formed integrally with the rotating shaft, and includes an inverted shaft 37 which is installed in the axial direction. The lifting cylinder 32 supports the rotating cylinder 33 and the second support part 35 while being lifted. Also included is an elevator 38 installed through the first support portion 31 so as to be able to move in the vertical direction by the operation of the cylinder 32.

The vacuum suction plate 39 is fixed to one end of the reverse shaft 37 in the longitudinal direction of the timing belt 34, and the semiconductor package 11 is adsorbed on one side of the vacuum suction plate 39. A plurality of vacuum holes 39a are formed at predetermined intervals.

Then, the operation of the device for automatically reversing the semiconductor package 11 of the present invention configured as described above with reference to Figure 1 as follows.

First, in the magazine 10 in which the semiconductor package 11 produced in the semiconductor manufacturing equipment is transferred and received as it is, the robot 20 takes out the package 11 and places it on the vacuum adsorption plate 39. After the vacuum hole 39a of the vacuum suction plate 39 sucks air to suck the package 11, the rotation cylinder 33 rotates, and this rotational force is again passed through the timing pulley 36 to the timing belt 34. ), The reverse axis 37 and the vacuum adsorption plate 39a are rotated so that the package 11 is positioned above the conveyor belt 40, that is, the surface on which the marking of the package 11 is to be formed is upward. At this time, the lifting cylinder 32 is operated to move the second support part 35 on which the vacuum adsorption plate 39 is supported through the elevator 38 to move downward, and thus is positioned on the vacuum adsorption plate 39. When the package 11 is located in the vicinity of the conveyor belt 40, the vacuum suction The vacuum hole 39a of the plate 39 sucks air so that the package 11 is detached and falls on the conveyor belt 40. The subsequent process is performed in the same manner as the conventional marking process, and at the same time, the vacuum adsorption plate 39 is moved upward by the operation of the lifting cylinder 32, and then the vacuum hole 39a is positioned on the upper side by the operation of the rotary cylinder 33 so that the above process can be repeated.

The reversing means 30 is used using an external power source as a main power source.

The present invention described above is not limited to the above-described embodiments and drawings, and various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those who have

As described above, the reversing device for marking a package according to the present invention, when the package is mounted on the conveyor belt for marking, the surface to be automatically formed by the reversing means is placed in the upward direction Since it is, the marking on the surface that should not be marked on the package is prevented to prevent the occurrence of defective products, thereby improving the work efficiency and productivity.

In addition, since the surface on which the marking of the package is to be automatically performed by the reversing means is located in the upward direction, the time required for the marking work is reduced by eliminating the manual process of reversing the package, thereby further increasing the productivity.

Claims (4)

Fixing means formed with a plurality of vacuum holes on the upper surface to fix the package delivered from the robot; Means for reversing the marking surface of the package mounted on the fixing means to face upward; And Lifting means for seating the package reversed by the reverse means on the conveyor Reverse device for marking the package comprising a. The method of claim 1, The reversing means is A rotating cylinder mounted at a predetermined position on an upper surface of the support member; One side is connected to the fixing means and the other side reversing device for marking the package including a rotational force transmission means connected to the rotating cylinder. The method of claim 2, The rotational force transmission means A rotating shaft penetrating the center of the fixing means, A pulley mounted to the pivot shaft; One side is connected to the pulley and the other side reversing device for a package marking comprising a timing belt connected to the rotating cylinder. The method of claim 1, Reversing device for package marking the fixing means is a vacuum suction plate.