KR960008896B1 - Vacuum dryer and drying method using the apparatus - Google Patents
Vacuum dryer and drying method using the apparatus Download PDFInfo
- Publication number
- KR960008896B1 KR960008896B1 KR92023279A KR920023279A KR960008896B1 KR 960008896 B1 KR960008896 B1 KR 960008896B1 KR 92023279 A KR92023279 A KR 92023279A KR 920023279 A KR920023279 A KR 920023279A KR 960008896 B1 KR960008896 B1 KR 960008896B1
- Authority
- KR
- South Korea
- Prior art keywords
- pure water
- control terminal
- robot arm
- drying method
- vacuum dryer
- Prior art date
Links
- 238000001035 drying Methods 0.000 title 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The device dries the remaining pure water on a wafer surface completely and rapidly in the manufacturing of semiconductors and prevents photosensitive film damages. The device includes a developing solution nozzle(24), a pure water nozzle(25), a spinner(21), a process chamber(1), an input conveyer roller(2), the first robot arm(3), heating means(4,5), a hot gas control terminal(6), a vacuum control terminal(7), the second robot arm(8) and an output conveyer roller(9).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR92023279A KR960008896B1 (en) | 1992-12-04 | 1992-12-04 | Vacuum dryer and drying method using the apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR92023279A KR960008896B1 (en) | 1992-12-04 | 1992-12-04 | Vacuum dryer and drying method using the apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940015445A KR940015445A (en) | 1994-07-20 |
KR960008896B1 true KR960008896B1 (en) | 1996-07-05 |
Family
ID=19344692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR92023279A KR960008896B1 (en) | 1992-12-04 | 1992-12-04 | Vacuum dryer and drying method using the apparatus |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960008896B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100848249B1 (en) * | 2002-12-16 | 2008-07-24 | 동부일렉트로닉스 주식회사 | Apparatus and method of develop in photolithography |
KR100921289B1 (en) * | 2006-03-22 | 2009-10-09 | 가부시끼가이샤 도시바 | Liquid droplet spraying apparatus and method for manufacturing applied object |
-
1992
- 1992-12-04 KR KR92023279A patent/KR960008896B1/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100848249B1 (en) * | 2002-12-16 | 2008-07-24 | 동부일렉트로닉스 주식회사 | Apparatus and method of develop in photolithography |
KR100921289B1 (en) * | 2006-03-22 | 2009-10-09 | 가부시끼가이샤 도시바 | Liquid droplet spraying apparatus and method for manufacturing applied object |
US7921801B2 (en) | 2006-03-22 | 2011-04-12 | Kabushiki Kaisha Toshiba | Droplet jetting applicator and method for manufacturing coated body |
Also Published As
Publication number | Publication date |
---|---|
KR940015445A (en) | 1994-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050621 Year of fee payment: 10 |
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LAPS | Lapse due to unpaid annual fee |