KR960006392U - 씨씨디 영상소자 - Google Patents

씨씨디 영상소자

Info

Publication number
KR960006392U
KR960006392U KR2019940016942U KR19940016942U KR960006392U KR 960006392 U KR960006392 U KR 960006392U KR 2019940016942 U KR2019940016942 U KR 2019940016942U KR 19940016942 U KR19940016942 U KR 19940016942U KR 960006392 U KR960006392 U KR 960006392U
Authority
KR
South Korea
Prior art keywords
video device
video
Prior art date
Application number
KR2019940016942U
Other languages
English (en)
Other versions
KR0123048Y1 (ko
Inventor
박찬
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019940016942U priority Critical patent/KR0123048Y1/ko
Priority to US08/425,445 priority patent/US5699114A/en
Priority to JP7195767A priority patent/JP2819263B2/ja
Publication of KR960006392U publication Critical patent/KR960006392U/ko
Application granted granted Critical
Publication of KR0123048Y1 publication Critical patent/KR0123048Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/762Charge transfer devices
    • H01L29/765Charge-coupled devices
    • H01L29/768Charge-coupled devices with field effect produced by an insulated gate
    • H01L29/76808Input structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14887Blooming suppression
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/148Charge coupled imagers
    • H01L27/14806Structural or functional details thereof
    • H01L27/14812Special geometry or disposition of pixel-elements, address lines or gate-electrodes
    • H01L27/14818Optical shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
KR2019940016942U 1994-07-08 1994-07-08 씨씨디 영상소자 KR0123048Y1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR2019940016942U KR0123048Y1 (ko) 1994-07-08 1994-07-08 씨씨디 영상소자
US08/425,445 US5699114A (en) 1994-07-08 1995-04-20 CCD apparatus for preventing a smear phenomenon
JP7195767A JP2819263B2 (ja) 1994-07-08 1995-07-10 Ccd映像素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940016942U KR0123048Y1 (ko) 1994-07-08 1994-07-08 씨씨디 영상소자

Publications (2)

Publication Number Publication Date
KR960006392U true KR960006392U (ko) 1996-02-17
KR0123048Y1 KR0123048Y1 (ko) 1998-10-01

Family

ID=19387945

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940016942U KR0123048Y1 (ko) 1994-07-08 1994-07-08 씨씨디 영상소자

Country Status (3)

Country Link
US (1) US5699114A (ko)
JP (1) JP2819263B2 (ko)
KR (1) KR0123048Y1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6087686A (en) * 1997-12-29 2000-07-11 Dalsa, Inc. Pixel with buried channel spill well and transfer gate
JP4132961B2 (ja) * 2002-05-16 2008-08-13 富士フイルム株式会社 固体撮像素子の製造方法
US7355228B2 (en) * 2004-10-15 2008-04-08 Omnivision Technologies, Inc. Image sensor pixel having photodiode with multi-dopant implantation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5262661A (en) * 1990-06-25 1993-11-16 Matsushita Electric Industrial Co., Ltd. Solid-state image pickup device, having increased charge storage and improved electronic shutter operation
JP3125303B2 (ja) * 1990-11-26 2001-01-15 日本電気株式会社 固体撮像素子
US5238864A (en) * 1990-12-21 1993-08-24 Mitsubishi Denki Kabushiki Kaisha Method of making solid-state imaging device
KR100259063B1 (ko) * 1992-06-12 2000-06-15 김영환 Ccd 영상소자
JPH07161958A (ja) * 1993-12-09 1995-06-23 Nec Corp 固体撮像装置
KR970011376B1 (ko) * 1993-12-13 1997-07-10 금성일렉트론 주식회사 씨씨디(ccd)형 고체촬상소자

Also Published As

Publication number Publication date
JP2819263B2 (ja) 1998-10-30
JPH0855976A (ja) 1996-02-27
KR0123048Y1 (ko) 1998-10-01
US5699114A (en) 1997-12-16

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050422

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee