KR960002550Y1 - Molding compound preheating apparatus - Google Patents
Molding compound preheating apparatus Download PDFInfo
- Publication number
- KR960002550Y1 KR960002550Y1 KR2019930002117U KR930002117U KR960002550Y1 KR 960002550 Y1 KR960002550 Y1 KR 960002550Y1 KR 2019930002117 U KR2019930002117 U KR 2019930002117U KR 930002117 U KR930002117 U KR 930002117U KR 960002550 Y1 KR960002550 Y1 KR 960002550Y1
- Authority
- KR
- South Korea
- Prior art keywords
- compound
- sensor
- preheater
- light receiving
- light emitting
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title claims description 30
- 238000000465 moulding Methods 0.000 title claims description 9
- 229940125782 compound 2 Drugs 0.000 claims description 15
- 230000032683 aging Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
내용 없음.No content.
Description
제1도는 종래의 장치를 나타낸 사시도1 is a perspective view showing a conventional device
제2도는 본 고안 장치의 요부를 나타낸 종단면도로서2 is a longitudinal sectional view showing the main part of the device
(a)는 콤파운드를 프리히터바에 올려놓은 초기상태도(a) shows the initial state of the compound on the preheater bar
(b)는 콤파운드가 예열완료된 상태도(b) is a state in which the compound is preheated
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 븐체 2 : 콤파운드1: object body 2: compound
3 : 프리히터바 4 : 기어3: preheater bar 4: gear
5 : 구동기어 6 : 덮개5: drive gear 6: cover
10 : 지지대 10a : 장공10: support 10a: long hole
11 : 발광센서 12 : 수광센서11: light emitting sensor 12: light receiving sensor
14 : 끈14: string
본 고안은 성형용 콤파운드의 예열장치에 관한 것으로서, 좀더 구체적으로는 콤파운드의 예열시 콤파운드가 일정점도 유지되게 예열되면 기기의 동작이 자동으로 중단될 수 있도록 한 것이다.The present invention relates to a preheating device for the molding compound, and more specifically, the preheating of the compound is preheated to maintain a certain point when preheating the compound so that the operation of the device can be automatically stopped.
일반적으로 몰드금형에 사용되는 콤파운드는 금형에서 성형전에 일정점도를 가지도록 예열시킨 다음 이를 금형내에 넣고 가압하여 일정형태로 성형하게 된다.In general, the compound used in the mold mold is preheated to have a certain viscosity before molding in the mold, and then put it in the mold to press to form a certain shape.
종래에는 콤파운드를 일정점도가 유지되게 예열시키기 위해 제1도에 도시한 바와 같이 본체(1)의 상부에 콤파운드(2)를 올려놓고 회전시키면서 예열하는 한쌍의 프리히터바(3)가 설치되어 있어 상기 프리히터바의 양단에 형성된 기어(4)와 맞물린 구동기어(5)가 회전됨에 따라 프리히터바(3)가 회전하도록 되어 있다.Conventionally, as shown in FIG. 1, a pair of preheater bars 3 are preheated while rotating the compound 2 on the upper part of the main body 1 so as to preheat the compound to maintain a constant viscosity. The preheater bar 3 rotates as the drive gear 5 engaged with the gear 4 formed at both ends of the preheater bar rotates.
그리고 본체(1)의 상부에는 콤파운드(2)의 예열시 외부와 밀폐시키는 덮개(6)가 개폐가능하게 설치되어 있고 본체(1)의 전면에 설치되는 콘트롤부(7)에는 예열시간을 셋팅시키는 예열시간 셋팅스위치(8)와 기기를 동작시키는 시작버튼(9)이 설치되어 있다.And the upper part of the main body (1) is provided with a cover (6) to be opened and closed to seal the outside when preheating the compound (2) and the control unit (7) installed on the front of the main body 1 to set the preheating time A preheating time setting switch 8 and a start button 9 for operating the device are provided.
따라서 예열시간 셋팅스위치(8)를 조절하여 콤파운드(2)의 예열시간을 셋팅시킨 다음 프리히터바(3)에 예열하고자 하는 콤파운드(2)를 올려놓고 덮개(6)를 닫는다.Therefore, the preheating time setting switch 8 is adjusted to set the preheating time of the compound 2, and then the compound 2 to be preheated is placed on the preheater bar 3 and the cover 6 is closed.
그후 콘트롤부(7)의 시작버튼(9)을 눌러주면 구동기어(5)가 회전되므로 구동기어(5)와 맞물린 기어(4)가 형성된 프리히터바(3)가 회전하면서 상기 프리히터바 상부에 얹혀진 콤파운드(2)를 예열시키게 된다.After that, when the start button 9 of the control unit 7 is pressed, the drive gear 5 is rotated, and thus the preheater bar 3 having the gear 4 engaged with the drive gear 5 rotates, thereby rotating the upper part of the preheater bar. The compound 2 placed on it is preheated.
그후 셋팅된 예열시간이 경과되면 기기의 동작은 중단되고 덮개(6)가 자동으로 열리게 되므로 예열완료된 콤파운드(2)를 꺼낼 수 있게 된다.After that, when the set preheating time has elapsed, the operation of the device is stopped and the cover 6 is automatically opened so that the preheated compound 2 can be taken out.
그러나 콤파운드(2)는 시효(Aging) 정도 또는 보관장소 및 보관상태에 따라 점도변화가 심하다.However, the compound (2) has a significant change in viscosity depending on the degree of aging (aging) or storage location and storage conditions.
즉 한상자내의 콤파운드라도 윗부분의 콤파운드와 아랫부분의 콤파운드를 동일시간으로 예열했을때 점도가 달라지게 되므로 몰딩작업시 점도불균일로 성형불량이 발생되었다.In other words, even when the compound in one box preheats the compound of the upper part and the compound of the lower part at the same time, the viscosity will be different, so the molding irregularity occurred due to the viscosity unevenness during the molding operation.
따라서 이를 방지하기 위해서는 예열시간을 수시로 셋팅시켜주어야 되었으므로 생산성이 저하되었음은 물론 초보작업자인 경우는 적정점도에 대한 경험부족으로 콤파운드의 점도를 정확히 조절할 수 없게 되는 문제점이 있었다.Therefore, in order to prevent this, it was necessary to set the preheating time from time to time, so that the productivity was lowered as well as the beginners had a problem in that the viscosity of the compound could not be precisely adjusted due to lack of experience in proper viscosity.
본 고안은 종래의 이와 같은 문제점을 해결하기 위해 안출한 것으로서, 콤파운드가 일정점도로 예열되면 기기의 동작이 중단됨과 동시에 덮개가 개방되도록하여 초보작업자인 경우에도 항상 일정점도를 유지하는 콤파운드를 얻을 수 있도록 하는데 그 목적이 있다.The present invention was devised to solve such a problem in the related art, and when the compound is preheated to a certain viscosity, the operation of the device is stopped and the cover is opened to obtain a compound that maintains a constant viscosity at all times even for a novice worker. The purpose is to make it.
상기 목적을 달성하기 위한 본 고안의 형태에 따르면, 본체에 양측으로 기어가 형성된 한쌍의 프리히터바를 설치하여 상기 프리히터바가 기어와 맞물린 구동기어에 의해 회전하면서 콤파운드를 예열시키도록 된 것에 있어서, 본체의 상부양측에 수직으로 지지대를 설치하고 상기 각 지지대에는 콤파운드의 감지여부에 따라 덮개를 개방시키는 발광센서와 수광센서를 설치하여 콤파운드의 지름이 감소되어 발광센서의 빛을 수광센서가 감지함에따라 덮개가 자동을 열리도록 하여서 원 성형용 콤파운드의 예열장치가 제공된다.According to an aspect of the present invention for achieving the above object, in the main body is provided with a pair of pre-heater bar formed with gears on both sides to preheat the compound while the pre-heater bar is rotated by the drive gear meshed with the gear, Install the support vertically on both sides of the upper part of the support, and each support is installed with a light emitting sensor and a light receiving sensor to open the cover according to whether the compound is detected, the diameter of the compound is reduced, the light as the light receiving sensor detects the light as the cover A preheating device for the compound for round molding is provided by allowing the automatic to be opened.
이하, 본 고안을 일실시예로 도시한 첨부된 도면 제2도를 참고로 하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, with reference to Figure 2 of the accompanying drawings showing an embodiment of the present invention in more detail as follows.
첨부도면 제2도는 본 고안 장치의 요부를 나다낸 종단면도로서, 본 고안은 본체(1)의 상부양측에 지지대(10)가 수직으로 설치되어 있고 상기 지지대(10)에 형성된 장공(10a)에는 프리히터바(3)에 얹혀진 콤파운드(2)의 감지여부에 따라 덮개(6)를 개방시키는 발광센서(11)와 수광센서(12)가 설치되어 있어 상기 발광센서(11)의 빛을 수광센서(12)가 감지함에 따라 덮개(6)가 자동으로 열리도록 되어 있다.2 is a longitudinal cross-sectional view of the main part of the device of the present invention, in which the support 10 is vertically installed on both upper sides of the main body 1, and the long hole 10a formed in the support 10 is provided in FIG. The light emitting sensor 11 and the light receiving sensor 12 are installed to open the lid 6 according to whether the compound 2 mounted on the preheater bar 3 is detected. As the 12 is detected, the lid 6 is opened automatically.
이때 지지대(10)의 장공(10a)에 설치되는 발광센서(11) 및 수광센서(12)는 예열되는 콤파운드(2)의 지름에 위치를 가변시킬 수 있도록 각 지지대(10)의 외측으로 노출되게 설치되어 풀리(13)에 감겨진 끈(14)가 고정되어 있다.In this case, the light emitting sensor 11 and the light receiving sensor 12 installed in the long hole 10a of the support 10 may be exposed to the outside of each support 10 so as to change the position at the diameter of the preheated compound 2. The string 14 provided and wound around the pulley 13 is fixed.
이와 같이 구성된 본 고안의 작용효과를 설명하면 다음과 같다.Referring to the effect of the present invention configured as described above are as follows.
먼저 본체(1)로 부터 덮개(6)를 개방시킨 제2도의 (a)와 같은 상태에서 프리히터바(3)에 예열하고자 하는 콤파운드(2)를 얹어 놓은 다음 풀리(13)를 모터(도시는 생략함)에 의해 구동시키면 끈(14)에 고정된 발광센서(11) 및 수광센서(12)가 장공(10a)을 따라 승강되므로 콤파운드(2)의 지름 및 원하는 점도에 따라 각 센서의 위치를 설정하게 된다.First, the compound 2 to be preheated is placed on the preheater bar 3 in the same state as in FIG. 2 (a) in which the cover 6 is opened from the main body 1, and then the pulley 13 is mounted on a motor (not shown). If the light emitting sensor 11 and the light receiving sensor 12 fixed to the string 14 are lifted along the long hole 10a, the position of each sensor according to the diameter and the desired viscosity of the compound 2 is omitted. Will be set.
그후 개방되었던 덮개(6)를 덮은 다음 시작버튼(9)을 누르면 발광센서(11)의 빛이 콤파운드(2)에 의해 차단되어 수광센서(12)가 감지하지 못하여 구동기어(5)와 맞물린 기어(4)가 회전되므로 프리히터바(3)가 회전되고, 이에 따라 상기 프리히터바(3)에 얹혀진 콤파운드(2)도 함께 회전하면서 예열된다.After the cover 6 is opened and the start button 9 is pressed, the light of the light emitting sensor 11 is blocked by the compound 2 so that the light receiving sensor 12 does not detect the gear engaged with the driving gear 5. As the 4 is rotated, the preheater bar 3 is rotated, so that the compound 2 mounted on the preheater bar 3 is also preheated while rotating together.
이와 같은 동작으로 콤파운드(2)가 일정시간 예열되어 적절한 점도를 갖게 되면 제2도의 (b)와 같이 지름이 줄어들게 되므로 발광센서(11)의 빛을 수광센서(12)가 감지하게 되고, 이에 따라 구동기어(5)의 회전은 중단됨과 동시에 덮개(6)가 자동으로 개방되므로 예열된 콤파운드를 이용하여 성형작업을 할 수 있게 된다.In this operation, when the compound 2 is preheated for a predetermined time to have an appropriate viscosity, the diameter of the compound 2 is reduced as shown in (b) of FIG. 2, so that the light receiving sensor 12 detects the light of the light emitting sensor 11. The rotation of the drive gear 5 is stopped and at the same time the cover 6 is automatically opened so that the molding operation can be performed using the preheated compound.
이상에서와 같이 본 고안 장치는 셋팅된 시간동안 콤파운드를 예열하던 종래 장치와는 달리 일정점도를 갖을때까지 콤파운드를 예열시키도록 되어 있으므로 예열시간을 셋팅시킬 필요가 없게 되고, 또한 시효정도 및 보관조건에 따라 점도변화가 심하더라도 콤파운드를 항상 일정한 점도를 갖도록 예열시키게 되므로 생산성을 향상시키게 되는 효과를 가지게 된다.As described above, unlike the conventional apparatus which preheats the compound for a set time, the device of the present invention is configured to preheat the compound until it has a certain viscosity, so that the preheating time does not need to be set, and the aging degree and storage condition According to this, even if the viscosity change is severe, since the compound is always preheated to have a constant viscosity, it has the effect of improving productivity.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR2019930002117U KR960002550Y1 (en) | 1993-02-17 | 1993-02-17 | Molding compound preheating apparatus |
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KR2019930002117U KR960002550Y1 (en) | 1993-02-17 | 1993-02-17 | Molding compound preheating apparatus |
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KR940021339U KR940021339U (en) | 1994-09-24 |
KR960002550Y1 true KR960002550Y1 (en) | 1996-03-27 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980083065A (en) * | 1997-05-12 | 1998-12-05 | 배순훈 | How to control cold air in air curtain refrigerator |
KR19980083060A (en) * | 1997-05-12 | 1998-12-05 | 배순훈 | Cooling control device of air curtain refrigerator and its control method |
-
1993
- 1993-02-17 KR KR2019930002117U patent/KR960002550Y1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980083065A (en) * | 1997-05-12 | 1998-12-05 | 배순훈 | How to control cold air in air curtain refrigerator |
KR19980083060A (en) * | 1997-05-12 | 1998-12-05 | 배순훈 | Cooling control device of air curtain refrigerator and its control method |
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KR940021339U (en) | 1994-09-24 |
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