KR950700608A - 기판 반송 시스템(substrate transportation system) - Google Patents

기판 반송 시스템(substrate transportation system)

Info

Publication number
KR950700608A
KR950700608A KR1019940702597A KR19940702597A KR950700608A KR 950700608 A KR950700608 A KR 950700608A KR 1019940702597 A KR1019940702597 A KR 1019940702597A KR 19940702597 A KR19940702597 A KR 19940702597A KR 950700608 A KR950700608 A KR 950700608A
Authority
KR
South Korea
Prior art keywords
transport system
substrate transport
substrate
transport
Prior art date
Application number
KR1019940702597A
Other languages
English (en)
Other versions
KR100281004B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR950700608A publication Critical patent/KR950700608A/ko
Application granted granted Critical
Publication of KR100281004B1 publication Critical patent/KR100281004B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019940702597A 1992-12-14 1993-12-13 기판 반송 시스템 KR100281004B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP92-353609 1992-12-14
JP35360992 1992-12-14
PCT/JP1993/001804 WO1994014191A1 (fr) 1992-12-14 1993-12-13 Dispositif de transfert de galette

Publications (2)

Publication Number Publication Date
KR950700608A true KR950700608A (ko) 1995-01-16
KR100281004B1 KR100281004B1 (ko) 2001-03-02

Family

ID=18432004

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940702597A KR100281004B1 (ko) 1992-12-14 1993-12-13 기판 반송 시스템

Country Status (6)

Country Link
US (1) US5515618A (ko)
EP (1) EP0626724B1 (ko)
JP (1) JP3239320B2 (ko)
KR (1) KR100281004B1 (ko)
DE (1) DE69329107T2 (ko)
WO (1) WO1994014191A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5680902A (en) * 1994-03-22 1997-10-28 Weatherford/Lamb, Inc. Wellbore valve
US5713711A (en) * 1995-01-17 1998-02-03 Bye/Oasis Multiple interface door for wafer storage and handling container
JPH1140770A (ja) * 1997-07-18 1999-02-12 Nec Corp 半導体装置の製造方法および半導体製造装置
US6151796A (en) * 1998-06-04 2000-11-28 Kem-Tec Japan Co., Ltd. Substrate drying device, drying method and substrate dried by the same
WO2001091928A1 (fr) * 2000-06-01 2001-12-06 Dainichi Shoji Kabushiki Kaisha Appareil de nettoyage d'un recipient de transfert d'un article incompatible avec la poussiere
DE102009038756A1 (de) 2009-05-28 2010-12-09 Semilev Gmbh Vorrichtung zur partikelfreien Handhabung von Substraten

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129211A (en) * 1976-09-07 1978-12-12 Monsanto Company Wafer packaging system
US4171740A (en) * 1976-09-07 1979-10-23 Monsanto Company Wafer packaging system
US4231164A (en) * 1978-08-31 1980-11-04 Eastman Kodak Company Apparatus and method for uniformly heating or cooling a moving web
SE435830B (sv) * 1980-10-17 1984-10-22 Kenogard Ab Sett att torka impregnerat cellulosamaterial, sasom trevirke, i vetskeformiga hogkokande torkmedier och anvendning av serskild behallare for denna torkningsmetod
JPS59195838A (ja) * 1983-04-21 1984-11-07 Toshiba Corp プロセスチユ−ブ装置
FI77483C (fi) * 1983-05-20 1989-03-10 Valmet Oy Foerfarande och anordning i pappers- eller kartongmaskiner foer formning av banan och/eller avvattning av banan samt prosessband foer tillaempning vid ifraogavarande foerfarande.
JPS60167414A (ja) * 1984-02-10 1985-08-30 Sumitomo Electric Ind Ltd 半導体の包装体
JPS60184678A (ja) * 1984-03-02 1985-09-20 Canon Inc 真空処理装置
JPS60236931A (ja) * 1984-05-09 1985-11-25 Toshiba Corp 防塵積降し装置
US4826360A (en) * 1986-03-10 1989-05-02 Shimizu Construction Co., Ltd. Transfer system in a clean room
JPH0767058B2 (ja) * 1987-03-26 1995-07-19 旭硝子株式会社 超音波遅延素子用ガラス媒体の表面処理方法
JPH03172221A (ja) * 1989-11-29 1991-07-25 Fuji Electric Co Ltd クリーン搬送装置
JPH03265137A (ja) * 1990-03-15 1991-11-26 Fujitsu Ltd 半導体基板のドライ洗浄方法
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
JP3351802B2 (ja) * 1991-01-01 2002-12-03 忠弘 大見 薄膜形成装置
JPH04341591A (ja) * 1991-05-20 1992-11-27 Sumitomo Heavy Ind Ltd スパッタリング洗浄装置
US5205991A (en) * 1991-07-30 1993-04-27 Corning Incorporated Manufacture of extruded ceramics
JP2777962B2 (ja) * 1993-08-31 1998-07-23 株式会社荏原製作所 ガス冷却・加湿・浄化用スプレー塔及び方法

Also Published As

Publication number Publication date
EP0626724A4 (en) 1995-04-19
JP3239320B2 (ja) 2001-12-17
KR100281004B1 (ko) 2001-03-02
DE69329107D1 (de) 2000-08-31
DE69329107T2 (de) 2001-03-22
US5515618A (en) 1996-05-14
EP0626724B1 (en) 2000-07-26
EP0626724A1 (en) 1994-11-30
WO1994014191A1 (fr) 1994-06-23

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Publication of correction
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Year of fee payment: 4

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