KR950034369U - Fixing device for lead frame position in semiconductor manufacturing mold - Google Patents

Fixing device for lead frame position in semiconductor manufacturing mold

Info

Publication number
KR950034369U
KR950034369U KR2019940010043U KR19940010043U KR950034369U KR 950034369 U KR950034369 U KR 950034369U KR 2019940010043 U KR2019940010043 U KR 2019940010043U KR 19940010043 U KR19940010043 U KR 19940010043U KR 950034369 U KR950034369 U KR 950034369U
Authority
KR
South Korea
Prior art keywords
fixing device
lead frame
semiconductor manufacturing
frame position
manufacturing mold
Prior art date
Application number
KR2019940010043U
Other languages
Korean (ko)
Other versions
KR200161815Y1 (en
Inventor
오용영
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019940010043U priority Critical patent/KR200161815Y1/en
Publication of KR950034369U publication Critical patent/KR950034369U/en
Application granted granted Critical
Publication of KR200161815Y1 publication Critical patent/KR200161815Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR2019940010043U 1994-05-06 1994-05-06 Lead frame position fixing apparatus KR200161815Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940010043U KR200161815Y1 (en) 1994-05-06 1994-05-06 Lead frame position fixing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940010043U KR200161815Y1 (en) 1994-05-06 1994-05-06 Lead frame position fixing apparatus

Publications (2)

Publication Number Publication Date
KR950034369U true KR950034369U (en) 1995-12-18
KR200161815Y1 KR200161815Y1 (en) 1999-12-01

Family

ID=19382681

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940010043U KR200161815Y1 (en) 1994-05-06 1994-05-06 Lead frame position fixing apparatus

Country Status (1)

Country Link
KR (1) KR200161815Y1 (en)

Also Published As

Publication number Publication date
KR200161815Y1 (en) 1999-12-01

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
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Payment date: 20080820

Year of fee payment: 10

EXPY Expiration of term