KR950021482U - Lead frame for semiconductor package and mold for package molding - Google Patents

Lead frame for semiconductor package and mold for package molding

Info

Publication number
KR950021482U
KR950021482U KR2019930028499U KR930028499U KR950021482U KR 950021482 U KR950021482 U KR 950021482U KR 2019930028499 U KR2019930028499 U KR 2019930028499U KR 930028499 U KR930028499 U KR 930028499U KR 950021482 U KR950021482 U KR 950021482U
Authority
KR
South Korea
Prior art keywords
package
mold
lead frame
molding
semiconductor package
Prior art date
Application number
KR2019930028499U
Other languages
Korean (ko)
Other versions
KR200148608Y1 (en
Inventor
안태원
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019930028499U priority Critical patent/KR200148608Y1/en
Publication of KR950021482U publication Critical patent/KR950021482U/en
Application granted granted Critical
Publication of KR200148608Y1 publication Critical patent/KR200148608Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
KR2019930028499U 1993-12-18 1993-12-18 Lead frame and resin molding of package KR200148608Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930028499U KR200148608Y1 (en) 1993-12-18 1993-12-18 Lead frame and resin molding of package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930028499U KR200148608Y1 (en) 1993-12-18 1993-12-18 Lead frame and resin molding of package

Publications (2)

Publication Number Publication Date
KR950021482U true KR950021482U (en) 1995-07-28
KR200148608Y1 KR200148608Y1 (en) 1999-06-15

Family

ID=19371677

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930028499U KR200148608Y1 (en) 1993-12-18 1993-12-18 Lead frame and resin molding of package

Country Status (1)

Country Link
KR (1) KR200148608Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100825799B1 (en) * 2007-01-03 2008-04-29 삼성전자주식회사 Semiconductor chip depressing a void during die attach process and semiconductor package including the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100825799B1 (en) * 2007-01-03 2008-04-29 삼성전자주식회사 Semiconductor chip depressing a void during die attach process and semiconductor package including the same

Also Published As

Publication number Publication date
KR200148608Y1 (en) 1999-06-15

Similar Documents

Publication Publication Date Title
EP0465143A3 (en) Molded hybrid ic package and lead frame therefore
KR950010192U (en) Mold press for molding semiconductor packages
KR950021482U (en) Lead frame for semiconductor package and mold for package molding
SG44381A1 (en) Leadframe processing for molded package arrangements
KR960003103U (en) Mold for molding semiconductor package
KR930010573U (en) Mold for forming semiconductor lead frame
KR950021402U (en) Structure of punch part of mold for lead molding of semiconductor package
KR940008668U (en) Lead frame for cavity cleaning of molds for molding semiconductor packages
KR950021465U (en) Molding free semiconductor package
KR960029741U (en) Mold for molding semiconductor package
KR940021340U (en) Upper mold die structure of mold for molding semiconductor package
KR970007238U (en) Lead Molding Device for Semiconductor Package
KR920013716U (en) Die for package molding
KR960035607U (en) Mold for package molding
KR940011119U (en) Lead frame for semiconductor package
KR940006489U (en) Lead frame for semiconductor package
KR950004830U (en) Lead frame for semiconductor package
KR960025512U (en) Lead frame for semiconductor package
KR960019169U (en) Lead frame for semiconductor package
KR970003278U (en) Book mold for semiconductor package molding
KR950028718U (en) Center Block of Mold for Molding Semiconductor Package
KR930022414U (en) Location pin fixing device for mold for semiconductor package molding
KR970007232U (en) Lead Molding Device for Semiconductor Package
KR950021479U (en) Mold structure for cutting semiconductor package leads
KR940017916U (en) Mold device for package lead forming

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080222

Year of fee payment: 10

EXPY Expiration of term