KR950021455U - Wafer ring for high adhesive tape - Google Patents
Wafer ring for high adhesive tapeInfo
- Publication number
- KR950021455U KR950021455U KR2019930031729U KR930031729U KR950021455U KR 950021455 U KR950021455 U KR 950021455U KR 2019930031729 U KR2019930031729 U KR 2019930031729U KR 930031729 U KR930031729 U KR 930031729U KR 950021455 U KR950021455 U KR 950021455U
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive tape
- high adhesive
- wafer ring
- wafer
- ring
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019930031729U KR950021455U (en) | 1993-12-31 | 1993-12-31 | Wafer ring for high adhesive tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019930031729U KR950021455U (en) | 1993-12-31 | 1993-12-31 | Wafer ring for high adhesive tape |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950021455U true KR950021455U (en) | 1995-07-28 |
Family
ID=60919377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019930031729U KR950021455U (en) | 1993-12-31 | 1993-12-31 | Wafer ring for high adhesive tape |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR950021455U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100369388B1 (en) * | 1999-12-10 | 2003-01-24 | 앰코 테크놀로지 코리아 주식회사 | wafer mount frame for manufacturing semiconductor package |
-
1993
- 1993-12-31 KR KR2019930031729U patent/KR950021455U/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100369388B1 (en) * | 1999-12-10 | 2003-01-24 | 앰코 테크놀로지 코리아 주식회사 | wafer mount frame for manufacturing semiconductor package |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69500752D1 (en) | Wafer carrier | |
DE69403432T2 (en) | tape | |
DE69512687T2 (en) | COMPONENT CARRIER TAPE | |
DE69414277T2 (en) | Semiconductor wafer cassette | |
KR960702284A (en) | REFASTENABLE ADHESIVE TAPING SYSTEM | |
DE69400142D1 (en) | Carrier cassette for silicon wafers | |
DE69310708D1 (en) | Sealing tape | |
DE69428850D1 (en) | Tape cassette | |
KR950021455U (en) | Wafer ring for high adhesive tape | |
DE69418018D1 (en) | Tape cassette | |
DE69420643D1 (en) | Tape cassette | |
DE69401670D1 (en) | Sealing tape | |
DE69415197D1 (en) | Carrier film for photographic film | |
KR940023533U (en) | Wafer Chuck Structure | |
KR950004819U (en) | Wafer cassette | |
KR950002239U (en) | Wafer cassette | |
DE9314818U1 (en) | Self-adhesive hot-melt film | |
KR960025434U (en) | Wafer carrier | |
KR950015663U (en) | Wafer chuck | |
KR940023573U (en) | Wafer chuck | |
KR970025846U (en) | Wafer carrier | |
KR940023570U (en) | Structure of wafer holder | |
KR940020636U (en) | Adhesive Tape Case | |
KR940025561U (en) | Wafer bonding apparatus | |
KR950015662U (en) | Wafer holder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |