KR950021429A - 반도체 장치 및 그 재생 방법 - Google Patents

반도체 장치 및 그 재생 방법 Download PDF

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Publication number
KR950021429A
KR950021429A KR1019940037225A KR19940037225A KR950021429A KR 950021429 A KR950021429 A KR 950021429A KR 1019940037225 A KR1019940037225 A KR 1019940037225A KR 19940037225 A KR19940037225 A KR 19940037225A KR 950021429 A KR950021429 A KR 950021429A
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KR
South Korea
Prior art keywords
circuit board
semiconductor device
temperature
electrode
semiconductor
Prior art date
Application number
KR1019940037225A
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English (en)
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KR0178564B1 (ko
Inventor
가즈히데 도이
나오히꼬 히라노
Original Assignee
사또 후미오
가부시끼가이샤 도시바
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Application filed by 사또 후미오, 가부시끼가이샤 도시바 filed Critical 사또 후미오
Publication of KR950021429A publication Critical patent/KR950021429A/ko
Application granted granted Critical
Publication of KR0178564B1 publication Critical patent/KR0178564B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

반도체 칩의 돌기 전극과 회로 기판의 접속이 그 조반되는 온/오프 동작을 갖고 있어도 장기적으로 확실히 행할 수 있는 장기 신뢰성이 높은 반도체 장치를 제공한다. 칩이 접속 전극(돌기 전극)을 회로 기판에 직접 접속하는 반도체 장치에 있어서, 회로 기판 내 또는 외에 온도 조절 수단을 설치한다. 온도 조절 수단은 가열 장치, 냉각 장치, 가열/냉각장치 중 어느 하나의 장치로 구성되고, 반도체 장치의 사용 중 칩과 회로 기판의 열 팽창의 차를 감소시키도록 회로 기판의 온도를 제어한다. 열 팽창 차가 실질적으로 없으므로 돌기 전극에 열응력이 집중되지 않는다.

Description

반도체 장치 및 그 재생 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1 실시예의 반도체 장치의 단면도,
제2도는 제1 실시예의 반도체 장치의 단면도,
제3도는 제1 실시예의 반도체 장치의 단면도,
제4도는 본 발명에 관한 칩의 평면도 및 그 A-A'선에 따른 부분의 단면도.

Claims (4)

  1. 회로기판, 상기 회로 기판에 형성된 온도 조절 수단 및 접속 전극을 갖고. 이 접속 전극을 통해 상기 회로 기판에 접속된 반도체 소자를 구비하고, 상기 온도 조절 수단에 의해 온도 변화에 상기 회로 기판과 반도체 소자의 신장 또는 축소의 차를 작게 하는 것을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 상기 온도 조절 수단은 가열 수단 또는 냉각 수단 또는 가열 수단 및 냉각 수단으로 구성되는 것을 특징으로 하는 반도체 장치.
  3. 제1항 또는 제2항에 있어서, 상기 회로 기판 또는 반도체 소자에는 온도를 검지하는 온도 센서가 장착되어 있거나 또는 내장되어 있는 것을 특징으로 하는 반도체 장치.
  4. 상기 접속 전극이 저융점 금속으로 구성되는 제1항 내지 제3항에 기재된 반도체 장치에 있어서, 이 반도체 장치를 복수 회수 또는 소정 시간 사용한 후에 상기 접속 전극을 상기 온도 조절 수단으로 어닐하는 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940037225A 1993-12-28 1994-12-27 반도체 장치 및 그 제조 방법 KR0178564B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35283793A JP3224930B2 (ja) 1993-12-28 1993-12-28 半導体装置の再生方法
JP93-352837 1993-12-28

Publications (2)

Publication Number Publication Date
KR950021429A true KR950021429A (ko) 1995-07-26
KR0178564B1 KR0178564B1 (ko) 1999-04-15

Family

ID=18426781

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940037225A KR0178564B1 (ko) 1993-12-28 1994-12-27 반도체 장치 및 그 제조 방법

Country Status (3)

Country Link
US (1) US5645123A (ko)
JP (1) JP3224930B2 (ko)
KR (1) KR0178564B1 (ko)

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GB2330289A (en) 1997-10-13 1999-04-14 Ericsson Omc Limited Heated printed circuit board
US6121576A (en) * 1998-09-02 2000-09-19 Micron Technology, Inc. Method and process of contact to a heat softened solder ball array
DE19851172A1 (de) * 1998-11-06 2000-05-11 Alcatel Sa Anordnung zur Erwärmung einer bestückten gedruckten Schaltung
US6288365B1 (en) * 1999-05-18 2001-09-11 Mcammond Matthew J. Soldering assembly
US6144013A (en) * 1999-07-01 2000-11-07 International Business Machines Corporation Local humidity control system for low temperature electronic module
US6327149B1 (en) * 2000-09-06 2001-12-04 Visteon Global Technologies, Inc. Electrical circuit board and method for making the same
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method
US6781056B1 (en) * 2003-02-28 2004-08-24 Motorola, Inc. Heater for temperature control integrated in circuit board and method of manufacture
CN100382666C (zh) * 2003-12-24 2008-04-16 华为技术有限公司 一种加热系统
NO20042771D0 (no) * 2004-06-30 2004-06-30 Thin Film Electronics Asa Optimering av driftstemperatur i et ferroelektrisk eller elektret minne
US7586064B1 (en) * 2006-07-13 2009-09-08 National Semiconductor Corporation Method and system for providing thermostatic temperature control in an integrated circuit
DE102007033003A1 (de) * 2007-07-16 2009-01-22 Robert Bosch Gmbh Bauelement mit wenigstens einem Halbleitersubstrat mit einer integrierten elektrischen Schaltung
FR2929070B1 (fr) * 2008-03-18 2010-03-12 Kontron Modular Computers Dispositif de prechauffage d'un composant refroidi par conduction et/ou par convection
JP2010238843A (ja) * 2009-03-31 2010-10-21 Fujitsu Ltd 電源制御装置、電子回路搭載装置及び電源制御方法
US8880765B2 (en) 2010-08-25 2014-11-04 Itron, Inc. Interface bus for utility-grade network communication devices
US8704630B2 (en) 2010-08-25 2014-04-22 Itron, Inc. Apparatus and methods for temperature-based control of communication device operations
JP2013243263A (ja) * 2012-05-21 2013-12-05 Internatl Business Mach Corp <Ibm> ３次元積層パッケージにおける電力供給と放熱（冷却）との両立
US8981259B2 (en) * 2012-07-24 2015-03-17 Mildef Crete Inc. Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
JP6417700B2 (ja) 2014-04-23 2018-11-07 富士通株式会社 半導体部品および電子機器
CN109742085B (zh) * 2018-11-30 2020-10-16 中国科学院微电子研究所 Soi器件及其制作方法

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US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US3887785A (en) * 1974-08-29 1975-06-03 Us Air Force Temperature controlled hybrid oven
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Also Published As

Publication number Publication date
KR0178564B1 (ko) 1999-04-15
JP3224930B2 (ja) 2001-11-05
US5645123A (en) 1997-07-08
JPH07201919A (ja) 1995-08-04

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