KR950018263A - Molding epoxy resin composition - Google Patents

Abstract

The present invention relates to an epoxy resin composition for molds designed to be used for medium and large insulators as insulation fillers in the field of electrical and electronic fields. Compared to conventional insulators, electrical insulation and UV resistance are increased and cracks and shrinkage of cured products due to internal stresses are increased. Reducing it makes it possible to produce more reliable insulators.

The present invention solves problems such as shrinkage and cracks by increasing the flexibility of the cured product and relieving internal stress by using modified epoxy resin modified with fatty acid wax as a main resin, and rapid heat generation using various fillers and additives. It is possible to manufacture a molded article which is very useful as an insulating material in the electric and electronic field by suppressing and improving the prevention of impairment of workability due to toxic gases and the like.

Description

Molding epoxy resin composition

Since this is an open matter, no full text was included.

Claims (9)

Molecular weight 400-5000, epoxy equivalent 1.7-2.5eq prepared by modifying a basic epoxy resin, which is liquid at room temperature, containing at least two epoxy groups, at least one double bond and whose end group is a carboxyl group, and a fatty wax having a hydroxyl group in the molecule. 4-30wt% of modified epoxy resin with properties of 25,000 ~ 60,000cps / kg, epoxy equivalent 5.0-5.3eq / kg, 10-30wt% of bisphenolA epoxy resin with 2 epoxy groups with viscosity 10,000 ~ 15,000cps, epoxy 0.6-4wt% reactive diluent, equivalent to 2.5-5.0eq / kg, diglycidylether compound having 10 or more carbon atoms, inorganic fillers such as silica, aluminum hydroxide, alumina mica, wollastonite, calcium carbonate, clay %, 6-24wt% of acid anhydride curing agent cured at high temperature, 0.06-1.2wt% curing accelerator of metallic salt system, 0.02-1.2wt% of silane coupling agent, 0.02-0.6wt% anti-settling agent, antifoam 0.002-0.4wt % And other additives Molding epoxy resin composition as that sex characteristics. The epoxy resin composition according to claim 1, wherein the fatty acid wax is selected from stearic acid, palmitic acid, bedeline acid, lauric acid, oleic acid, hydrogenated castor oil, and derivatives thereof. The method of claim 1, wherein the basic epoxy resin used for the modification is selected from alicyclic epoxy resin, bisphenol-A epoxy resin, bisphenol A-D epoxy resin, glycinyl ether epoxy resin, polyfunctional epoxy resin Epoxy resin composition. The epoxy resin composition for molding according to claim 1, wherein the reactive diluent is selected from butylglycidyl ether, olefin oxide, phenylglycidyl ether, allylglycidyl ether, and difunctional naglycinyl ether. According to claim 1, the inorganic filler is particle size distribution 1-5㎛, oil absorption 18-24%, surface area 1.2-1.6m 2 / gr with respect to 100 parts by weight of silica follower particle size distribution 1-30㎛, oil absorption 16 Epoxy resin composition for casting, characterized in that the mixture of -18%, silica floor having a surface area of 0.7-0.9 m 2 / gr in a proportion of 20-300 parts by weight. The epoxy resin composition for molding according to claim 1, wherein the curing agent of the acid anhydride type is selected from methyltetrahydrophthalic hydride, phthalic hydride and tetrahydro phthalic hydride. The method of claim 1, wherein the silane coupling agent is 3-glyoxymethoxypropyltrimethoxysilane, the antisettling agent is selected from bentonic, mica, talc, and the antifoaming agent is selected from silicone oil, pine oil polyol, and terpene polymer. An epoxy resin composition for casting. It is liquid at room temperature and contains 100 parts by weight of a basic epoxy resin having two or more epoxy groups in the molecule and at least one double bond, and a fatty acid wax having a terminal group of carboxyl group and a molecular weight of 200-4000 having a hydroxyl group in the molecule 20-100 parts by weight 60 After mixing in a nitrogen atmosphere at -80 ° C, the catalyst was added to the reaction, followed by reaction at a vacuum of 2-5torr, a reaction temperature of 160-250 ° C, and a reaction time of 3-5 hours. Epoxy resin composition for casting, characterized in that represented by the following general formula 1 having a characteristic of viscosity 25,000-60,000cps. R ₁ : alkene containing 1 or more double bonds (1-20 carbon atoms) R ₂ : contains alkyl, aryl, alkyne or hydrogen having 1-15 carbon atoms The catalyst of claim 1, wherein the catalyst is brontrifluoride, stanic chloride, mercuric chloride, aluminum chloride, trimethylamine, triethylamine, tributylamine, tetramethylbutyldiamine, di-thi-butylperoxide, hydrogen peroxide Epoxy resin composition for casting, characterized in that selected from thi-butyl peroxide. ※ Note: The disclosure is based on the initial application.