KR960002476B1 - Thermosetting epoxy resin compositions - Google Patents

Thermosetting epoxy resin compositions Download PDF

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KR960002476B1
KR960002476B1 KR1019910025733A KR910025733A KR960002476B1 KR 960002476 B1 KR960002476 B1 KR 960002476B1 KR 1019910025733 A KR1019910025733 A KR 1019910025733A KR 910025733 A KR910025733 A KR 910025733A KR 960002476 B1 KR960002476 B1 KR 960002476B1
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epoxy resin
parts
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epoxy
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KR930012972A (en
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장진원
최도형
이용웅
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고려화학주식회사
김충세
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

The epoxy resin compsn. for high voltage electrical parts comprises : 5-15 wt.pts of bisphenol-A type epoxy resin having 180-200 of epoxy euivalence, which is liquid at room temp.; 5-25 wt.pts of epoxy resin based reactive diluting agent contg. one or more benzene ring or cyclohexane ring in a molecular, selected from divinylbezene oxide contg two reactive epoxy gp., resorcinol diglycidylether, 2-glycidylether or diglycidylester; 35-70 wt.pts of complex inorganic filler comprising aluminum hydroxide, crystal silica and antimonium oxide; 50-150 wt.pts of dodecyl succinic anhydride (w.r.t 100 wt.pts of the epoxy resin), having 100-3000 of the Mw and 500-3000 cpoise of the viscosity at 25 deg.C; 40-130 wt.pts of aliphatic acid anhydride hardening agent and hardening accelerating agent comprising two basic acid polyanhydride of formula (I) having 200-500 Mw and 2000-7000 cpoise of the viscosity at 25 deg.C, where n is integer of 1-4.

Description

고전압 전기부품용 열경화성 에폭시 수지 조성물Thermosetting epoxy resin composition for high voltage electric parts

본 발명은 전기ㆍ전자기기의 전기 절연 충진물로 사용가능한 열경화성 에폭시 수지 조성물에 관한 것으로서, 특히 전기절연 특성 및 외부의 주기적인 온도의 변화에 대한 내성이 강해, 가혹한 사용조건하에서도 전기 절연 특성이 우수하게 유지되며, 일반적으로 신뢰성 높은 전기전자 제품의 제조에 사용 가능한 고전압 전기부품용 열경화성 수지조성물에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermosetting epoxy resin composition that can be used as an electrical insulation filler for electrical and electronic devices. The present invention is particularly resistant to electrical insulation properties and external periodic temperature changes, and has excellent electrical insulation properties even under severe use conditions. The present invention relates to a thermosetting resin composition for high voltage electric parts, which is maintained in general, and which can be used for manufacturing highly reliable electric and electronic products.

열경화성 수지를 전기ㆍ전자 부품에 전기절연재료로 응용하는 방법은 일찍부터 알려져 왔으며, 그 중에서도 에폭시수지계 조성물은 에폭시 수지가 지니고 있는 에폭시 관능기의 반응성에 의해 요구되는 형태의 성형품의 제조가 가능하며, 경화제등의 조성물에 함께 배합되는 화합물의 종류에 따라 대단히 다양한 특성을 나타내므로 가장 널리 응용되고 있다.The method of applying the thermosetting resin to the electrical and electronic parts as an electrical insulating material has been known for a long time. Among them, the epoxy resin composition is capable of producing a molded article in the form required by the reactivity of the epoxy functional group of the epoxy resin, and the curing agent It is most widely applied because it shows a great variety of properties depending on the kind of the compound to be blended in the composition, such as.

그러나, 전기ㆍ전자기기의 상용범위가 확대되고, 열경화성 수지를 전기 절연물로 응용하는 전기ㆍ전자기기 부품의 종류가 다양해짐에 따라 그 부품에 사용되는 환경도 대단히 광범위하게 되었다.However, as the commercial range of electric and electronic devices has been expanded, and the types of electric and electronic device parts that use thermosetting resins as electric insulators have been diversified, the environment used for such parts has also become very wide.

이에따라, 외부의 가혹한 사용조건하에서도 기본적인 전기절연 특성 및 기계적 특성이 유지되어 전기ㆍ전자기기에 높은 신뢰성을 부여할 수 있는 내습성, 내열충격성등이 향상된 열경화성 수지조성물이 요구되게 되었다.Accordingly, there is a need for a thermosetting resin composition having improved moisture resistance and thermal shock resistance that can provide high reliability to electrical and electronic devices by maintaining basic electrical insulation properties and mechanical properties even under severe external use conditions.

이러한 요구에 부응하기 위한 종래 기술로는 내열충격성의 향상을 위해 에폭시-변성 고무계 화합물을 첨가하는 방법이 있으나, 이 경우는 분자량의 증대에 따라 점도가 상승하는 문제점이 있다.Conventional techniques for meeting such demands include a method of adding an epoxy-modified rubber-based compound to improve thermal shock resistance, but in this case, there is a problem in that the viscosity increases with increasing molecular weight.

또한, 실리콘계 화합물을 첨가하는 방법이 있는데, 이 경우 내습성, 내균열성, 내충격성등의 향상이 가능하나, 경우에 따라서는 접착력의 저하, 경우에 따라서는 실리콘계 화합물의 경화물 외부에의 침출에 의한 접착력의 저하등의 문제가 있다.In addition, there is a method of adding a silicone-based compound. In this case, it is possible to improve moisture resistance, crack resistance, impact resistance, etc. There is a problem such as a decrease in adhesive strength.

본 발명은 이러한 종래기술의 문제점을 해결하여 높은 신뢰성을 지니는 고전압 전기부품용 열경화성 에폭시 수지조성물을 제공하기 위하여 안출된 것으로, 상온에서 액상인 비스페놀-A형 에폭시 수지와 분자 내 1개 이상의 벤젠고리 또는 시클로헥산고리를 지니고 2개의 활성 에폭시기를 지니는 에폭시 수지계 반응성 희석제를 유기성분으로 하고 여기에 수산화알미늄, 결정성 실리카 및 산화안티몬으로 구성되는 복합무기 충진제, 지방족 산무수물 경화제및 경화촉진제를 배합하여 제조하였다.The present invention has been made to solve the problems of the prior art to provide a thermosetting epoxy resin composition for high-voltage electrical components having a high reliability, a liquid bisphenol-A epoxy resin and at least one benzene ring in the molecule at room temperature or Epoxy resin-based reactive diluents having a cyclohexane ring and two active epoxy groups were prepared by combining organic inorganic fillers composed of aluminum hydroxide, crystalline silica, and antimony oxide, aliphatic acid anhydride curing agents, and curing accelerators. .

상기 지방족 산무수물 경화제로는 도데실 썩시닉 안하이드라이드와 2염기산 폴리무수물의 혼합 경화제가 적당한데, 본 발명의 바람직한 지방족 산무수물 경화제는 도데실 썩시닉안하이드라이드로서 일반 지환족 산무수물경화제에 비해 기계적 특성과 전기적 특성에 있어서 동일한 수준을 유지하면서도 가사시간이 길며, 특히 내열충격성이 우수하다. 또한, 상기 2염기산 폴리무수물의 바람직한 것은 하기 일반식(I)의 화합물인데, 이는 지방족쇄에 의하여 충격흡수의 역할을 하며, 특히 경화물의 내열충격성 및 내균열성 향상에 크게 기여한다.As the aliphatic acid anhydride curing agent, a mixed curing agent of dodecyl rosinic anhydride and a dibasic polyanhydride is suitable, and the preferred aliphatic acid anhydride curing agent of the present invention is a dodecyl rosinic anhydride as a dodecyl rosinic anhydride. In comparison, the pot life is long while maintaining the same level of mechanical and electrical properties, and particularly, the thermal shock resistance is excellent. In addition, the dibasic polyanhydride is preferably a compound of the general formula (I), which acts as a shock absorber by the aliphatic chain, and in particular, contributes greatly to the thermal shock resistance and crack resistance of the cured product.

일반식(I)Formula (I)

n은 1~4의 정수이다.n is an integer of 1-4.

상기 1개이상의 시클로헥산고리 또는 벤젠고리를 함유하는 2관능성의 에폭시 수지계 반응성 희석제는 1관능성 반응성 희석제및 비반응성 희석제에 비해 기계적 특성, 내열성 저하를 최대한으로 억제할 수 있다.The bifunctional epoxy resin-based reactive diluent containing at least one cyclohexane ring or benzene ring can inhibit mechanical properties and heat resistance deterioration to the maximum as compared with a monofunctional reactive diluent and a non-reactive diluent.

본 발명에서 사용한 지방족 산무수물중 도데실 썩시닉 안하이드라이드는 그 분자량이 100~300, 25℃에서의 점도가 500~3,000센티포아즈인 것이 가장 유용하며, 함량은 전체 에폭시수지 100중량부에 대하여 50~150중량부의 범위가 적당하며, 함량이 위에서 한정한 범위보다 작을 경우에는 본 발명에서 목적하는 가공성 및 기계적 특성이 불량해질 우려가 있다.Among the aliphatic acid anhydrides used in the present invention, dodecyl rosinic anhydride is most useful having a molecular weight of 100 to 300 and viscosity of 500 to 3,000 centipoise at 25 ° C, and the content is 100 parts by weight of the total epoxy resin. With respect to the range of 50 to 150 parts by weight is appropriate, and if the content is smaller than the range defined above, there is a fear that the desired workability and mechanical properties in the present invention is poor.

상기 일반식(I)의 2염기산 폴리 무수물은 분자량이 200~500, 25℃에서 점도가 2,000~7,000센티포아즈인 것이 고온에서의 전기특성 및 내열특성면에서 가장 유리하며, 함량은 전체 에폭시수지 100중량부에 대하여 40~130범위가 적당하며, 함량이 한정범위보다 작을 경우에는 본 발명에서 목적하는 내열충격성 및 전기적 특성이 떨어지고, 많은 경우에는 열변형온도가 저하되는 등 경화물의 열정성질에 나쁜 영향을 줄 수 있다.The dibasic acid anhydride of the general formula (I) has a viscosity of 2,000 to 7,000 centipoise at a molecular weight of 200 to 500 and 25 ° C, and is most advantageous in terms of electrical properties and heat resistance at high temperatures, and the content of the total epoxy The range of 40 to 130 is suitable for 100 parts by weight of resin, and if the content is smaller than the limited range, the thermal shock resistance and electrical properties desired in the present invention are deteriorated, and in many cases, the passion properties of the cured product are reduced. It can have a bad effect.

상기 시클로 헥산고리나 벤젠고리를 함유하는 2관능성 에폭시 수지계 반응성 희석제중에는, 디비닐벤젠디옥시드, 레조시놀 디글리시딜에테르, 2-글리시딜에테르, 디글리시딜에스테르 등으로서 분자량이 150~300범위의 것이 적당하다. 함량은 전체 에폭시수지 100중량부에 대하여 5~25중량부의 범위가 적당하다. 함량이 한정한 범위보다 과량인 경우는 내열성, 기계적 특성이 저하될 우려가 있다.In the bifunctional epoxy resin-based reactive diluent containing the cyclohexane ring or the benzene ring, the molecular weight is divinylbenzene dioxide, resorcinol diglycidyl ether, 2-glycidyl ether, diglycidyl ester or the like. The range of 150 ~ 300 is suitable. The content is in the range of 5 to 25 parts by weight based on 100 parts by weight of the total epoxy resin. If the content is in excess of the limited range, there is a fear that the heat resistance and mechanical properties are lowered.

에폭시 수지는 상온에서 액상이며 에폭시 당량이 180~200인 비스페놀-A형 에폭시 수지로 그 첨가량은 전체 수지조성 혼합물 100중량부에 대하여 5~15중량부의 범위가 제반특성면에서 가장 유리하다.Epoxy resin is bisphenol-A epoxy resin which is liquid at room temperature and has an epoxy equivalent of 180 to 200. The addition amount thereof is most advantageous in terms of characteristics in a range of 5 to 15 parts by weight based on 100 parts by weight of the total resin composition mixture.

무기물 충진제중에는 공지의 결정성 산화규소, 용융산화규소, 활석분, 탄산칼슘, 마이카, 알루미나, 수산화알루미나, 고령토분 등의 충진제가 사용가능하나, 성형품의 용도, 사용환경, 가공방법, 크기 및 모양등의 특성에 따라 무기물 충진제의 불순물 함량, 입자크기 및 입자크기분포에 의하여 선정하여야 한다. 본원발명에 사용되는 바람직한 충진제는 둘이상의 무기물을 혼합한 것으로서 수산화 알루미나 35~60중량%, 결정실리카 30~45중량%, 산화안티몬 5~10중량%로 혼합한 것이며, 전체 조성물 100중량부에 대하여 35~70중량부를 배합하는 것이 적당하다. 충진제가 35중량부 이하인 경우, 선팽창 계수가 크게되어 내열충격성이 불량하게 되고, 70중량부 이상인 경우 점도가 높아져 가공성이 불량하게 된다.Among inorganic fillers, fillers such as known crystalline silicon oxide, molten silicon oxide, talc powder, calcium carbonate, mica, alumina, alumina hydroxide, kaolin powder, etc. can be used, but the use of the molded product, the use environment, processing method, size and shape It should be selected according to the impurity content, particle size and particle size distribution of the inorganic filler according to the characteristics such as. Preferred fillers to be used in the present invention are a mixture of two or more inorganic materials, 35 to 60% by weight of hydroxide alumina, 30 to 45% by weight of crystalline silica, 5 to 10% by weight of antimony oxide, based on 100 parts by weight of the total composition It is suitable to mix 35-70 weight part. In the case where the filler is 35 parts by weight or less, the coefficient of linear expansion is increased, resulting in poor thermal shock resistance, and in the case of 70 parts by weight or more, the viscosity becomes high, resulting in poor workability.

경화촉매로 사용되는 이미다졸계 화합물중에는 2-메틸 이미다졸, 2-에틸-4-메틸이미다졸, 2-페닐 이미다졸, 2-펜타데실이미다졸, 2-이소프로필 이미다졸, 2,4-디페닐 이미다졸, 2-페닐-4-메틸 이미다졸, 1-비닐-4-메틸 이미다졸, 1-시아노메틸 이미다졸, 1-시아노-2-에틸-4-메틸이미다졸, 2,4,5-트리 페닐 이미다졸, 1-비닐-2-리드록시 에틸 이미다졸, 1-시아노 에틸-2-페닐 이미다졸등이 있다.Among the imidazole compounds used as curing catalysts, 2-methyl imidazole, 2-ethyl-4-methylimidazole, 2-phenyl imidazole, 2-pentadidecyl imidazole, 2-isopropyl imidazole, 2, 4-diphenyl imidazole, 2-phenyl-4-methyl imidazole, 1-vinyl-4-methyl imidazole, 1-cyanomethyl imidazole, 1-cyano-2-ethyl-4-methylimidazole , 2,4,5-triphenyl imidazole, 1-vinyl-2- hydroxyethyl imidazole, 1-cyano ethyl-2-phenyl imidazole and the like.

이들 이미다졸계 화합물의 배합량은 에폭시와 시클로 헥산고리 또는 벤젠 고리를 함유하는 2관능성의 에폭시수지계 반응성 희석제의 혼합물 100중량부에 대하여 0.05~5중량부의 범위가 적당하며, 0.05중량부 이하에서는 경화속도의 지연, 경화물의 내열성이 저하될 우려가 있다.The compounding quantity of these imidazole compound is 0.05-5 weight part with respect to 100 weight part of mixtures of the bifunctional epoxy resin type reactive diluent containing an epoxy, a cyclo hexane ring, or a benzene ring, and a cure rate is 0.05 weight part or less. There exists a possibility that the heat resistance of retardation and hardened | cured material may fall.

또한 제품의 용도와 제조공정의 특성에 따라 소포제, 염료, 안료, 커플링제등을 첨가할 수 있다.In addition, antifoaming agents, dyes, pigments, coupling agents and the like may be added depending on the use of the product and the characteristics of the manufacturing process.

본 발명의 열경화성 수지 조성물 제조에는 공지 액상 수지조성물의 혼합방법이 적용가능하고, 혼합순서는 문제되지 않는다.The method of mixing a known liquid resin composition is applicable to the thermosetting resin composition of the present invention, and the mixing order is not a problem.

조성물의 특징에 따라 일정온도를 높인 상태에서 혼합시키는 방법도 적용가능하다.Depending on the characteristics of the composition, a method of mixing in an elevated state is also applicable.

본 발명의 수지조성물의 경화조건은 성형품의 크기 및 요구되는 특성에 따라 다를수 있으나, 일반적으로 100~150℃에서 2~5시간 경화하여 원하는 제품을 얻을 수 있다.Curing conditions of the resin composition of the present invention may vary depending on the size and required characteristics of the molded article, generally can be obtained by curing for 2 to 5 hours at 100 ~ 150 ℃.

본 발명에 의한 구체적인 제조예는 다음의 실시예에 따르고 비교예는 다음과 같다.Specific production examples according to the present invention is in accordance with the following Examples and Comparative Examples are as follows.

그러나, 다음의 실시예가 본 발명의 범위를 한정하는 것은 아니다.However, the following examples do not limit the scope of the present invention.

[실시예 1~2, 비교예 1~3]EXAMPLES 1-2, COMPARATIVE EXAMPLES 1-3

하기 표 1에 기재된 조성대로 조성물을 130℃에서 4시간 경화하여 경화물을 제조하였다. 이 경화물을 이용하여 아래 항목에 대하여 평가하였으며, 그 결과를 표 2에 기재하였다.The cured product was prepared by curing the composition at 130 ° C. for 4 hours according to the composition shown in Table 1 below. The following items were evaluated using this hardened | cured material, and the result is shown in Table 2.

경[화물의 평가]Light [evaluation of freight]

1) 내열충격성 : ASTM D-1647에서 규정하는 시편의 규격에 의해 각 조성물 별로 30개씩의 시편을 제조하여 +100℃에서 30분, -45℃에서 25분씩 50회반복 열처리후 균열이 발생한 시편의 수.1) Thermal shock resistance: According to the standard of specimens specified in ASTM D-1647, 30 specimens were prepared for each composition, and cracks occurred after repeated heat treatment for 50 minutes at + 100 ° C and 25 minutes at -45 ° C for 25 minutes. Number.

2) 내습성 : 100℃의 비등수 속에서 48시간 침적한 시편을 전기적 특성(절연저항, 유전율 : 50KHz에서 측정) 및 굴곡강도를 측정, 건조시의 시험결과를 비교 표시하였다.2) Moisture resistance: Measured electrical properties (insulation resistance, dielectric constant: measured at 50KHz) and flexural strength of the specimens which were immersed for 48 hours in boiling water at 100 ° C.

3) 절연파괴전압 : JIS C 2105에서 규정하는 시험방법 및 조건에 의해 절파괴 전압을 측정비교하였다. 이때 단위는 KV/㎜이다.3) Insulation breakdown voltage: The breakdown voltage was measured and compared according to the test methods and conditions specified in JIS C 2105. At this time, the unit is KV / mm.

[표 1]TABLE 1

* 주* Note

에폭시수지(A) : 에폭시 당량 185~200, 디글리시딜에테르 비스 페놀-A형 에폭시 수지.Epoxy resin (A): Epoxy equivalent 185-200, diglycidyl ether bisphenol-A type epoxy resin.

에폭시계희석제: 분자내 하나 이상의 벤젠고리 또는 시클로 헥산 고리를 지니고 두개의 활성 에폭시기를 지니는 분자량이 150~300인 에폭시계 희석제Epoxy Diluents: Epoxy diluents having a molecular weight of 150 to 300 with one or more benzene rings or cyclohexane rings in the molecule and two active epoxy groups

경화제-A : 분자량 200~500, 점도 500~3,000센티포아즈(25℃)인 지방족 산무수물(도데실썩시닉안하이드라이드)Curing agent-A: aliphatic acid anhydride (dodecylsicinic anhydride) having a molecular weight of 200 to 500 and a viscosity of 500 to 3,000 centipoise (25 ° C)

경화제-B : 분자량 200~500, 점도 2,000~7,000센티포아즈(25℃)인 2염기산 폴리무수물Curing agent-B: Dibasic acid anhydride with molecular weight 200-500, viscosity 2,000-7,000 centipoise (25 degreeC)

경화제-C : 메틸테트라하이드로프탈릭 안하이드라이드Curing Agent-C: Methyltetrahydrophthalic anhydride

[표 2]TABLE 2

Claims (2)

에폭시수지, 반응성 희석제, 충진제, 및 경화제로 이루어지는 수지조성물에 있어서, 상온에서 액상이며, 에폭시당량이 180~200인 비스페놀-A형 에폭시수지 5~15중량부와 분자내 1개 이상의 벤젠고리 또는 시클로헥산고리를 가지며, 2개의 활성 에폭시기를 가지는 디비닐벤젠디옥시드, 레조시놀 디글리시딜에테르, 2-글리시딜에테르 및 디글리시딜에스테르로 이루어진 군으로 부터 선택된 에폭시수지계 반응성 희석제5-25중량부를 유기성분으로 하고, 여기에 수산화알루미늄, 결정성 실리카 및 산화안티몬으로 구성되는 복합무기충진제35-70중량부, 분자량이 100-3000이고, 25℃에서 점도가 500-3,000센티포아즈이며, 사용량이 상기 에폭시수지 100중량부에 대하여 50-150중량부인 도데실 썩시닉 안하이드라이드와 분자량이 200-500이고, 25℃에서 점도가 2,000-7,000센티포아즈이며, 사용량이 상기 에폭시 수지 100중량부에 대하여 40-130중량부인 하기 일반식(Ⅰ)로 표시되는 2염기산 폴리무수물로 이루어진 지방족 산무수물 경화제, 및 경화 촉진제로 구성됨을 특징으로 하는 고전압 전기부품용 열경화성 에폭시 수지조성물.In a resin composition comprising an epoxy resin, a reactive diluent, a filler, and a curing agent, 5 to 15 parts by weight of bisphenol-A type epoxy resin having a liquid equivalent at room temperature and having an epoxy equivalent of 180 to 200 and at least one benzene ring or cyclo in the molecule Epoxy resin reactive diluents selected from the group consisting of divinylbenzene dioxide, resorcinol diglycidyl ether, 2-glycidyl ether and diglycidyl ester having a hexane ring and having two active epoxy groups 5- 25 parts by weight of an organic component, 35-70 parts by weight of a composite inorganic filler comprising aluminum hydroxide, crystalline silica, and antimony oxide, a molecular weight of 100-3000, and a viscosity of 500-3,000 centipoise at 25 ° C. Dodecyl rosinic anhydride having a used amount of 50-150 parts by weight based on 100 parts by weight of the epoxy resin and a molecular weight of 200-500, viscosity of 2,000-7,000 centipo at 25 ℃ And an aliphatic acid anhydride curing agent composed of a dibasic acid anhydride represented by the following general formula (I) having an amount of 40 to 130 parts by weight based on 100 parts by weight of the epoxy resin, and a high voltage electric Thermosetting epoxy resin composition for parts. 여기서, n은 1 내지 4인 정수이다.N is an integer of 1 to 4 here. 제1항에 있어서, 상기 충진제가 수산화 알루미나 35-60중량%, 결정성 실리카 35-45중량% 및 산화 안티몬 5-10중량%으로 이루어진 것을 특징으로 하는 고전압 전기부품용 열경화성 에폭시 수지조성물.The thermosetting epoxy resin composition according to claim 1, wherein the filler comprises 35-60 wt% of alumina hydroxide, 35-45 wt% of crystalline silica, and 5-10 wt% of antimony oxide.
KR1019910025733A 1991-12-31 1991-12-31 Thermosetting epoxy resin compositions KR960002476B1 (en)

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KR20030056495A (en) * 2001-12-28 2003-07-04 주식회사 효성 Epoxy resin compositions for mold transformer and method for manufacturing the same

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KR100579793B1 (en) * 1998-12-31 2006-08-31 에스케이케미칼주식회사 Primer composition for construction
KR100501798B1 (en) * 2002-02-09 2005-07-20 서해조 epoxy resin composite and manufacturing method for covering forming of electromagnetic parts

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