KR950018250A - Resin Composition for Copper Clad Laminates on Printed Circuit Board - Google Patents

Resin Composition for Copper Clad Laminates on Printed Circuit Board Download PDF

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Publication number
KR950018250A
KR950018250A KR1019930031265A KR930031265A KR950018250A KR 950018250 A KR950018250 A KR 950018250A KR 1019930031265 A KR1019930031265 A KR 1019930031265A KR 930031265 A KR930031265 A KR 930031265A KR 950018250 A KR950018250 A KR 950018250A
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KR
South Korea
Prior art keywords
resin composition
printed circuit
circuit board
resin
copper
Prior art date
Application number
KR1019930031265A
Other languages
Korean (ko)
Inventor
석재한
고종호
Original Assignee
하기주
주식회사 코오롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하기주, 주식회사 코오롱 filed Critical 하기주
Priority to KR1019930031265A priority Critical patent/KR950018250A/en
Publication of KR950018250A publication Critical patent/KR950018250A/en

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Abstract

하기한 식(I)의 4관능성 에폭시 수지와, 브롬화 비스페놀A형 에폭시 수지와, 자외선 안정제와, 경화제 및 경화촉진제를 포함하는 인쇄회로기판의 동박적층용 수지조성물은 기존의 난연성 인쇄회로용 에폭시 동박적층판에 자외선차폐기능을 부여하고 또한 내열성을 향상시켜, 종래의 일반 글래스 에폭시 동박적층판이 갖고 있는 양면 노광시 진상이 남는 단점을 제거하며 생산성 및 제품의 기능을 높일 수 있으며, 자외선 안정제의 양을 종래의 다른 제조방법보다 줄일 수 있으며 이에 의한 물성저하를 극소화하여 원가가 저렴한 인쇄회로기판을 제공한다.The resin composition for copper lamination of a printed circuit board comprising a tetrafunctional epoxy resin of formula (I), a brominated bisphenol A epoxy resin, an ultraviolet stabilizer, a curing agent, and a curing accelerator is a conventional flame retardant printed circuit epoxy. It provides UV shielding function to copper foil laminated plate and improves heat resistance, which eliminates the disadvantages of leaving behind the facts of double-sided exposure of conventional glass epoxy copper foil laminated plates, and improves productivity and product function. Compared with other conventional manufacturing methods, it is possible to minimize the physical property deterioration thereby providing a low cost printed circuit board.

Description

인쇄회로기판의 동박적층판용 수지조성물Resin Composition for Copper Clad Laminates on Printed Circuit Board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (5)

하기한 식(I)의 4관능성 에폭시 수지와; 브롬화 비스페놀A형 에폭시 수지와; 자외선 안정제와; 경화제 및 경화촉진제를; 포함하는 인쇄회로기판의 동박적층용 수지조성물.A tetrafunctional epoxy resin of the following formula (I); Brominated bisphenol-A epoxy resins; Ultraviolet stabilizers; Curing agents and curing accelerators; A resin composition for copper lamination of a printed circuit board containing. 제1항에 있어서, 상기한 4 관능성 에폭시 수지는 총수지 사용량에 대하여 5 내지 20 중량%를 첨가하는 것을 특징으로 하는 동박적층판용 수지조성물.The resin composition according to claim 1, wherein the tetrafunctional epoxy resin is added in an amount of 5 to 20% by weight based on the total amount of resin used. 제1항에 있어서, 상기한 브롬화 비스페놀A형 에폭시 수지는 브롬을 18 내지 30 중량%를 첨가하는 것을 특징으로 하는 동박적층판용 수지조성물.The resin composition for copper-clad laminate according to claim 1, wherein the brominated bisphenol-A epoxy resin adds 18 to 30 wt% bromine. 제1항에 있어서, 상기한 자외선 흡수제는 벤조페논계 및 벤조트리아졸계의 자외선 화합물을 총 수지양에 대하여 0.2 내지 5.0 중량%를 갖고 있는 것을 특징으로 하는 동박적층판용 수지조성물.The resin composition for copper clad laminate according to claim 1, wherein the ultraviolet absorber has a benzophenone-based and a benzotriazole-based ultraviolet compound in an amount of 0.2 to 5.0 wt% based on the total resin amount. 제1항에 있어서, 상기한 경화제는 디시아노디아미드를 5.0 내지 60.0 PHR 사용하고 상기한 경화 촉진제는 이미다졸계의 2-메틸이미다졸, 2-메틸-4-메틸이미다졸, 벤즈이미다졸로 이루어진 군에서 선택되는 하나 이상의 혼합물을 사용하는 것을 특징으로 하는 동박적층판용 수지조성물.The curing agent according to claim 1, wherein the curing agent uses dicyanodiamide in a range of 5.0 to 60.0 PHR, and the curing accelerator is imidazole 2-methylimidazole, 2-methyl-4-methylimidazole, and benzimi. A resin composition for copper clad laminates, characterized in that at least one mixture selected from the group consisting of doazoles is used. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930031265A 1993-12-30 1993-12-30 Resin Composition for Copper Clad Laminates on Printed Circuit Board KR950018250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930031265A KR950018250A (en) 1993-12-30 1993-12-30 Resin Composition for Copper Clad Laminates on Printed Circuit Board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930031265A KR950018250A (en) 1993-12-30 1993-12-30 Resin Composition for Copper Clad Laminates on Printed Circuit Board

Publications (1)

Publication Number Publication Date
KR950018250A true KR950018250A (en) 1995-07-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930031265A KR950018250A (en) 1993-12-30 1993-12-30 Resin Composition for Copper Clad Laminates on Printed Circuit Board

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100417067B1 (en) * 2000-12-05 2004-02-05 주식회사 엘지화학 Epoxy resin composition and copper clad laminates having low electric permittimity using the same
KR100419063B1 (en) * 2000-06-10 2004-02-14 주식회사 엘지화학 Epoxy resin composition and laminate using the same
KR100431439B1 (en) * 2001-05-08 2004-05-14 주식회사 엘지화학 Composition of epoxy resin
KR100431440B1 (en) * 2001-05-04 2004-05-14 주식회사 엘지화학 Composition of epoxy resin

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100419063B1 (en) * 2000-06-10 2004-02-14 주식회사 엘지화학 Epoxy resin composition and laminate using the same
KR100417067B1 (en) * 2000-12-05 2004-02-05 주식회사 엘지화학 Epoxy resin composition and copper clad laminates having low electric permittimity using the same
KR100431440B1 (en) * 2001-05-04 2004-05-14 주식회사 엘지화학 Composition of epoxy resin
KR100431439B1 (en) * 2001-05-08 2004-05-14 주식회사 엘지화학 Composition of epoxy resin

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