KR950018250A - Resin Composition for Copper Clad Laminates on Printed Circuit Board - Google Patents
Resin Composition for Copper Clad Laminates on Printed Circuit Board Download PDFInfo
- Publication number
- KR950018250A KR950018250A KR1019930031265A KR930031265A KR950018250A KR 950018250 A KR950018250 A KR 950018250A KR 1019930031265 A KR1019930031265 A KR 1019930031265A KR 930031265 A KR930031265 A KR 930031265A KR 950018250 A KR950018250 A KR 950018250A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- printed circuit
- circuit board
- resin
- copper
- Prior art date
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
하기한 식(I)의 4관능성 에폭시 수지와, 브롬화 비스페놀A형 에폭시 수지와, 자외선 안정제와, 경화제 및 경화촉진제를 포함하는 인쇄회로기판의 동박적층용 수지조성물은 기존의 난연성 인쇄회로용 에폭시 동박적층판에 자외선차폐기능을 부여하고 또한 내열성을 향상시켜, 종래의 일반 글래스 에폭시 동박적층판이 갖고 있는 양면 노광시 진상이 남는 단점을 제거하며 생산성 및 제품의 기능을 높일 수 있으며, 자외선 안정제의 양을 종래의 다른 제조방법보다 줄일 수 있으며 이에 의한 물성저하를 극소화하여 원가가 저렴한 인쇄회로기판을 제공한다.The resin composition for copper lamination of a printed circuit board comprising a tetrafunctional epoxy resin of formula (I), a brominated bisphenol A epoxy resin, an ultraviolet stabilizer, a curing agent, and a curing accelerator is a conventional flame retardant printed circuit epoxy. It provides UV shielding function to copper foil laminated plate and improves heat resistance, which eliminates the disadvantages of leaving behind the facts of double-sided exposure of conventional glass epoxy copper foil laminated plates, and improves productivity and product function. Compared with other conventional manufacturing methods, it is possible to minimize the physical property deterioration thereby providing a low cost printed circuit board.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930031265A KR950018250A (en) | 1993-12-30 | 1993-12-30 | Resin Composition for Copper Clad Laminates on Printed Circuit Board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930031265A KR950018250A (en) | 1993-12-30 | 1993-12-30 | Resin Composition for Copper Clad Laminates on Printed Circuit Board |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950018250A true KR950018250A (en) | 1995-07-22 |
Family
ID=66853723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930031265A KR950018250A (en) | 1993-12-30 | 1993-12-30 | Resin Composition for Copper Clad Laminates on Printed Circuit Board |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR950018250A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100417067B1 (en) * | 2000-12-05 | 2004-02-05 | 주식회사 엘지화학 | Epoxy resin composition and copper clad laminates having low electric permittimity using the same |
KR100419063B1 (en) * | 2000-06-10 | 2004-02-14 | 주식회사 엘지화학 | Epoxy resin composition and laminate using the same |
KR100431439B1 (en) * | 2001-05-08 | 2004-05-14 | 주식회사 엘지화학 | Composition of epoxy resin |
KR100431440B1 (en) * | 2001-05-04 | 2004-05-14 | 주식회사 엘지화학 | Composition of epoxy resin |
-
1993
- 1993-12-30 KR KR1019930031265A patent/KR950018250A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100419063B1 (en) * | 2000-06-10 | 2004-02-14 | 주식회사 엘지화학 | Epoxy resin composition and laminate using the same |
KR100417067B1 (en) * | 2000-12-05 | 2004-02-05 | 주식회사 엘지화학 | Epoxy resin composition and copper clad laminates having low electric permittimity using the same |
KR100431440B1 (en) * | 2001-05-04 | 2004-05-14 | 주식회사 엘지화학 | Composition of epoxy resin |
KR100431439B1 (en) * | 2001-05-08 | 2004-05-14 | 주식회사 엘지화학 | Composition of epoxy resin |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |