KR950014375A - Anodic Reactivity Test Apparatus and Evaluation Method in Electroplating - Google Patents

Anodic Reactivity Test Apparatus and Evaluation Method in Electroplating Download PDF

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Publication number
KR950014375A
KR950014375A KR1019930023744A KR930023744A KR950014375A KR 950014375 A KR950014375 A KR 950014375A KR 1019930023744 A KR1019930023744 A KR 1019930023744A KR 930023744 A KR930023744 A KR 930023744A KR 950014375 A KR950014375 A KR 950014375A
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South Korea
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plating liquid
electroplating
anode
plating
tank
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KR1019930023744A
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Korean (ko)
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KR960006054B1 (en
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진영술
김태엽
최대영
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조말수
포항종합제철 주식회사
백덕현
재단법인산업과학기술연구소
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Priority to KR1019930023744A priority Critical patent/KR960006054B1/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/20—Metals
    • G01N33/208—Coatings, e.g. platings

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명은 전기도금에 있어서 양극의 반응성을 관찰 및 측정할 수 있는 장치와 그 장치를 이용한 평가방법에 관한 것으로서, 가용성 혹은 불용성 양극을 사용하는 전기도금에 있어서 신규한 양극반응성 실험장치 및 이 장치를 이용하여 도금전압, 양극형태, 양극전해효율, 도금액종도의 경시변화 등을 관찰 및 측정함으로서 양극의 반응성을 정확하게 평가할 수 있고, 양극의 반응성이 부적절한 경우 개선방안을 강구할 수 있는 유용한 방법을 제공하고자하는데, 그 목적이 있다.The present invention relates to a device capable of observing and measuring the reactivity of a positive electrode in electroplating, and an evaluation method using the same. The present invention relates to a novel positive electrode reactivity test apparatus and an apparatus for electroplating using a soluble or insoluble positive electrode. By observing and measuring the plating voltage, anode type, anode electrolysis efficiency, and change of plating solution over time, it is possible to accurately evaluate the reactivity of the anode, and to provide a useful method to find an improvement plan when the anode is inadequate. There is a purpose.

본 발명은 전압, 전류기록용레코더(5)가 연결되어 있는 전원공급용정류기(1); 상기 전원공급용정류기(1)에 전기적으로 연결된 양극(3)과 음극(3)이 일정한 간격을 두고 그 내부에 위치되고, 오바플로덱(7)이 그 측벽과 일정한 거리를 두고 서로 마주보면서 그 내부에 위치되고 상기 오바플로덱(7)을 넘은 도금액을 도금액 공급탱크(9)로 회수하기 위한 드레인배관(8)이 그 하부에 구비되어 있는 전기도금조(2); 상기 양극(3)과 음극(4)사이에서 전기도금조(2)하부에 위치되어 도금액을 전기도금조(2)에 분사시키도록 구성되는 도금액 분사노즐(6); 및 상기 도금액 공급탱크(9)에 저장되어 있는 도금액을 상기 도금액 분사노즐(6)에 공급하도록 펌프(12)를 구비하여 형성되는 도금액 공급배관(15)을 포함하여 구성되는 전기도금에서의 양극반응성 실험장치 및 이를 이용하여 양극반응성을 평가하는 방법을 그 요지로 한다.The present invention provides a power supply rectifier 1 having a voltage and current recording recorder 5 connected thereto; The positive electrode 3 and the negative electrode 3 electrically connected to the power supply rectifier 1 are positioned therein at regular intervals, and the Obaflodec 7 faces each other at a constant distance from the side wall thereof. An electroplating tank (2) disposed inside the drain pipe (8) located therein for recovering the plating liquid beyond the obovaflodec (7) to the plating liquid supply tank (9); A plating liquid injection nozzle (6) positioned between the anode (3) and the cathode (4) and configured to inject a plating liquid into the electroplating tank (2); And a plating liquid supply pipe 15 formed with a pump 12 to supply the plating liquid stored in the plating liquid supply tank 9 to the plating liquid injection nozzle 6. An experimental apparatus and a method of evaluating anodic reactivity using the same are the main points.

Description

전기도금에 있어서 양극 반응성 실험장치 및 평가방법Anode Reactivity Experiment Apparatus and Evaluation Method in Electroplating

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 부합되는 양극반응성 실험장치의 개략도.1 is a schematic diagram of a cathode reactivity test apparatus in accordance with the present invention.

제2도는 본 발명의 양극반응성 실험장치의 평면도.2 is a plan view of the anionic reactivity test apparatus of the present invention.

Claims (4)

전압, 전류기록용레코더(5)가 연결되어 있는 전원공급용 정류기(1); 상기 전원공급용정류기(1)에 전기적으로 연결된 양극(3)과 음극(4)이 일정한 간격을 두고 그 내부에 위치되고, 오바플로덱(7)이 그 측벽과 일정한 거리를 두고 서로 마주보면서 그 내부에 위치되고, 상기 오바플로덱(7)을 넘은 도금액을 도금액 공급탱크(9)로 회수하기 위한 드레인배관(8)이 그 하부에 구비되어 있는 전기도금조(2); 상기 양극(3)과 음극(4)사이에서 전기도금조(2)하부에 위치되어 도금액을 전기도금조(2)에 분사시키도록 구성되는 도금액 분사노즐(6); 및 상기 도금액 공급탱크(9)에 저장되어 있는 도금액을 상기 도금액 분사노즐(6)에 공급하도록 펌프(12)를 구비하여 형성되는 도급액 공급배관(15)을 포함하여 구성됨을 특징으로 하는 전기도금에서의 양극반응성 실험장치.A power supply rectifier 1 having a voltage and current recording recorder 5 connected thereto; The positive electrode 3 and the negative electrode 4 electrically connected to the power supply rectifier 1 are positioned therein at regular intervals, and the Obaflodec 7 faces each other at a constant distance from the sidewalls thereof. An electroplating tank (2) located therein, the drain pipe (8) of which is disposed at the lower part for recovering the plating liquid beyond the obovaflodec (7) to the plating liquid supply tank (9); A plating liquid injection nozzle (6) positioned between the anode (3) and the cathode (4) and configured to inject a plating liquid into the electroplating tank (2); And a coating liquid supply pipe 15 formed with a pump 12 to supply the plating liquid stored in the plating liquid supply tank 9 to the plating liquid injection nozzle 6. Bipolar reactivity test apparatus. 제1항에 있어서, 도금액 공급탱크(9)에서 pH조절장치(10)및 온도조절장치(11)가 구비되고;그리고 상기 도금액 공급배관(15)에는 유량조절밸브(13)및 유량계(14)가 구비되는 것을 특징으로 하는 전기도금에서의 양극반응성 실험장치.The plating liquid supply tank (9) is provided with a pH adjusting device (10) and a temperature adjusting device (11); and the plating liquid supply pipe (15) has a flow control valve (13) and a flow meter (14). Anode reactivity test device in the electroplating, characterized in that the provided. 제1항 또는 제2항에 있어서, 양극(3)이 막대형이고 교체가 가능하도록 전기도금조(2)내에 고정되는 것을 특징으로 하는 전기도금에서의 양극반응성 실험장치.The apparatus of claim 1 or 2, wherein the anode (3) is rod-shaped and is fixed in the electroplating bath (2) so that it can be replaced. 전압, 전류기록용레코더(5)가 구비되어 있는 전원공급용정류기(1)에 전기적으로 연결되어있는 양극(3)과 음극(4)이 그 내부에 일정간격을 두고 위치되어 있는 전기도금조(2)에, 도금액공급탱크(9)저장된 도금액을 도금액공급배관(15)및 도금액 분사노즐(6)에 의해 분사시키면서 전원공급용 정류기(1)에 의해 양극(3)과 음극(4)에 전원을 공급하여 전기도금할시, 도금액조건, 도금조건 및 양극재질을 변화시켜가면서 전기도금하고, 그 과정에서 양극 또는 전기도금조내의 도금액을 채취하여 양극의 표면상태, 양극전해효율, 도금전압, 도금액 농도변화, 도금액중의 불순물 농도를 관찰 및 측정하여 가용성 또는 불용성 양극의 반응성을 평가하는 것을 특징으로 하는 전기도금에서의 양극반응성 평가방법.An electroplating bath in which a positive electrode 3 and a negative electrode 4 electrically connected to a power supply rectifier 1 equipped with a voltage and current recording recorder 5 are positioned at regular intervals therein ( 2), while the plating liquid stored in the plating liquid supply tank 9 is sprayed by the plating liquid supply pipe 15 and the plating liquid injection nozzle 6, power is supplied to the positive electrode 3 and the negative electrode 4 by the power supply rectifier 1. When electroplating by supplying electroplating, electroplating with changing plating solution condition, plating condition and anode material, and in the process, the plating solution in the anode or electroplating tank is taken and the surface state of the anode, anode electrolytic efficiency, plating voltage, plating solution A method for evaluating anode reactivity in electroplating, characterized by evaluating the change in concentration and the concentration of impurities in the plating solution to evaluate the reactivity of the soluble or insoluble anode. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930023744A 1993-11-09 1993-11-09 Device of testing an anodic response in electroplating and the estimation therefor KR960006054B1 (en)

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KR1019930023744A KR960006054B1 (en) 1993-11-09 1993-11-09 Device of testing an anodic response in electroplating and the estimation therefor

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KR1019930023744A KR960006054B1 (en) 1993-11-09 1993-11-09 Device of testing an anodic response in electroplating and the estimation therefor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100352620B1 (en) * 1998-12-29 2002-12-26 주식회사 에스아이테크 Drain pipe connection structure of lead frame plating tank

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101606987B1 (en) * 2014-05-30 2016-03-28 현대제철 주식회사 Electroplating simulation apparatus
RU2607057C1 (en) * 2015-07-14 2017-01-10 Андрей Николаевич Алексеев Galvanic bath with drain pocket

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100352620B1 (en) * 1998-12-29 2002-12-26 주식회사 에스아이테크 Drain pipe connection structure of lead frame plating tank

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