KR950012698A - Lead frame plating rack loading / unloading device - Google Patents

Lead frame plating rack loading / unloading device Download PDF

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Publication number
KR950012698A
KR950012698A KR1019930022858A KR930022858A KR950012698A KR 950012698 A KR950012698 A KR 950012698A KR 1019930022858 A KR1019930022858 A KR 1019930022858A KR 930022858 A KR930022858 A KR 930022858A KR 950012698 A KR950012698 A KR 950012698A
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KR
South Korea
Prior art keywords
rack
lead frame
plating
loading
unloading
Prior art date
Application number
KR1019930022858A
Other languages
Korean (ko)
Other versions
KR960016242B1 (en
Inventor
박성열
공우현
양한기
박민후
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019930022858A priority Critical patent/KR960016242B1/en
Publication of KR950012698A publication Critical patent/KR950012698A/en
Application granted granted Critical
Publication of KR960016242B1 publication Critical patent/KR960016242B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명은 집적회로 패키지가 실장된 리드프레임을 도금처리 하기 위하여 도금랙에 리드 프레임을 로딩하거나, 언로딩 시켜주는 장치에 대한 것으로, 도금랙 (2)에 리드프레임 (1)을 로딩/언로딩하는 일체의 과정을 하나의 도금랙 로딩장치에 의해, 즉, 엘리베이터장치(5) (5')와 인텍스시스템(6)과 랙로딩부(7)와 한쌍의 헤드장치(3) (3')와 랙클램핑장치(8)와 랙언로딩부(9)로 구성되는 도금랙 로딩장치에 의해 자동으로 이루어지도록 함으로써 리드프레임의 불량요인을 완전히 제거할 수 있도록 하고, 아울러 생산원가의 절감효과를 이루도록한 회기적인 발명이다.The present invention relates to an apparatus for loading or unloading a lead frame in a plating rack for plating a lead frame mounted with an integrated circuit package, and loading / unloading a lead frame (1) in a plating rack (2). The whole process is performed by one plating rack loading apparatus, that is, the elevator apparatus 5 (5 '), the index system (6), the rack loading unit (7) and the pair of head apparatuses (3) (3'). And the rack rack clamping device 8 and the rack unloading unit 9 are automatically made by the plating rack loading device to completely eliminate the defects of the lead frame, and also to reduce the production cost It is a recurrent invention.

Description

리드프레임 더금렉의 로당/언로딩장치Lead frame the gold rack rod sugar / unloading device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 전체 흐름도,1 is an overall flow chart of the present invention,

제12도는 본 발명의 헤드 장치도,12 is a head device of the present invention,

제16도는 제15도의 평면도.FIG. 16 is a plan view of FIG.

Claims (3)

매거진(4) (4)에 수장된 리드프레임 (1)을 후술하는 인덱스시스템에 로딩시켜주기 위한 한쌍의 구성되는 엘리베이더장치(5) (5')와, 상기 엘리베이터장치(5) (5')에 의해 한개씩 투입되는 리드프레임을 스텝 이동시켜 주기 위한 워킹빔 (61) (61')과 지지레일(62) (62')로 구성되는 인덱스시스템 (6)과, 전후로 다수개의 리드프레임 (1)을 걸을 수 있는 현가장치 (21)를 구비한 도금랙 (2)을 2개의 헤드장티 (3) (3') 사이로 이송 세팅시켜 주는 랙로딩부(7)와, 세팅된 도금랙 (2)의 현가장치 (21)에 지지레일 (62) (62')위의 리드프레임 (1)을 집어 로딩 시켜주거나 또는 현가장치 (21)에 걸려있는 리드프레임 (1)을 탈거하여 지지레일(62) (62') 위에 언로딩 시켜주는 헤드장치 (3) (3')와, 랙클램핑장치 (8)에 의해 출력되는 도금랙 (2)을 도금장치로 이송시켜 주기 위한 랙언로딩부(9)로 구성함을 특징으로 하는 리드프레임 도금랙의 로딩/언로딩장치.A pair of elevator devices (5) (5 ') configured to load the lead frame (1) stored in the magazine (4) (4) to an index system described later, and the elevator device (5) (5'). Indexing system 6 composed of walking beams 61, 61 'and support rails 62, 62' for stepping the lead frames fed one by one, and a plurality of lead frames 1 before and after A rack loading section (7) for transferring and setting a plating rack (2) having a suspension device (21) for walking there between two heads (3) (3 '), and a set plating rack (2) Load the lead frame 1 on the support rails 62 and 62 'on the suspension device 21 or remove the lead frame 1 from the suspension device 21 to support the rail 62. Head device (3) (3 ') for unloading on (62'), and rack unloading part (9) for transferring the plating rack (2) output by the rack clamping device (8) to the plating device.A lead frame loading / unloading device of the plating rack, characterized by name. 제1항에 있어서, 헤드장치 (3) (3')를 구성하는 헤드(32) (32')를 회전 가능토록 구성하여 에어실린더 (31)의 동작에 의해 헤드(32) (32')의 회전이 실시되도록 함을 특징으로 하는 리프레임 도금랙의 로딩/언로딩 장치.The head 32 (32 ') of the head 32 (32') is formed by rotatable operation of the head (32) (32 ') constituting the head device (3) (3'). Loading / unloading device of the reframe plating rack characterized in that the rotation is carried out. 제2항에 있어서, 헤드(32) (32')를 구성하는 집게 (321) (321')의 일측 핑거 (P')를 신축형으로 구성하여 리드프레임(1)이 일정각도 기울어진 상태로 현가장치(21)에 삽탈될 수 있도록 함을 특징으로 하는 리드프레임 도금랙의 로딩/언로딩 장치.According to claim 2, wherein one finger (P ') of the forceps (321, 321') constituting the head (32) (32 ') is configured to be stretched so that the lead frame (1) is inclined at an angle. Lead frame plating rack loading / unloading device, characterized in that to be inserted into the suspension (21). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930022858A 1993-10-30 1993-10-30 Loading/unloading device of lead frame coating rack KR960016242B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930022858A KR960016242B1 (en) 1993-10-30 1993-10-30 Loading/unloading device of lead frame coating rack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930022858A KR960016242B1 (en) 1993-10-30 1993-10-30 Loading/unloading device of lead frame coating rack

Publications (2)

Publication Number Publication Date
KR950012698A true KR950012698A (en) 1995-05-16
KR960016242B1 KR960016242B1 (en) 1996-12-07

Family

ID=19366995

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930022858A KR960016242B1 (en) 1993-10-30 1993-10-30 Loading/unloading device of lead frame coating rack

Country Status (1)

Country Link
KR (1) KR960016242B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496440B1 (en) * 2002-10-30 2005-06-20 디엠아이텍 주식회사 Loading apparatus for semiconductor strip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111886A1 (en) * 2010-03-10 2011-09-15 (주) 개성엔터프라이즈 Automatic loading and unloading apparatus for semiconductor package lead frame magazine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496440B1 (en) * 2002-10-30 2005-06-20 디엠아이텍 주식회사 Loading apparatus for semiconductor strip

Also Published As

Publication number Publication date
KR960016242B1 (en) 1996-12-07

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