DE69408657T2
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1998-07-09
TAB-Lötflächengeometrie für Halbleiterbauelemente
KR0131192B1
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1998-04-14
Exposed mask, fabrication method of exposed mask substrate and patterning method based on exposed mask
GB2322970B
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2000-03-22
Process for single mask C4 solder bump fabrication
EP0563829A3
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1994-08-24
Device for inspecting printed cream solder
EP0600262A3
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1997-04-02
Permanent multi-layer coatings for printed circuit boards that can be photographically recorded and developed by water.
KR970703062A
(ko )
1997-06-10
전자 구성 요소용 밀봉 장치(encapsulation for electronic components)
FI953085A0
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1995-06-21
Menetelmä monikerroksisen painetun kela-alustan, painettujen kela-alustojen ja painettujen kelakomponenttien valmistamiseksi
NO950781D0
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1995-02-28
Gel-fri maling som inneholder kobberpyrition
DE69306178D1
(de )
1997-01-09
Ablatives Verfahren für die Leiterplattentechnologie
ZA897138B
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1990-06-27
U.v.curable compositions for making tentable solder mask coating
GB2273993B
(en )
1996-05-08
Aqueous processable,multilayer,photoimageable permanent coatings for printed circuits
DE69302025T2
(de )
1996-09-05
Dünnes Metallblech für Schattenmaske
GB2316901B
(en )
2000-08-16
Printed circuit board for flow soldering
GB2264827B
(en )
1995-11-29
Oscillator circuit die on ceramic substrate
AU1413497A
(en )
1997-07-03
Solder mask for manufacture of printed circuit boards
BR9404291A
(pt )
1995-06-20
Processo de revestimento com solda de uma área terminal metálica prevista sobre um substrato, pasta de solda apropriada para aplicação pelo processo e painel ou folha fina flexível de circuito impresso
KR950005187U
(ko )
1995-02-18
기판인식형 크림 솔더(cream solder) 인쇄용 메탈 마스크(metal mask)
EP0573031A3
(en )
1995-06-14
Method of manufacturing structured masks for welding.
ITTO930872A1
(it )
1995-05-22
Metodo per fabbricare un accessorio stampato di finizione esterna.
IT9000630A0
(it )
1990-09-03
Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.
FR2709634B1
(fr )
1997-01-31
Structure pour relier des cartes de circuits imprimés.
EP0170767A3
(en )
1988-01-13
Substrate for printed circuits
IT1271298B
(it )
1997-05-27
Processo fotolitografico per contatto per la realizzazione di linee metalliche su un substrato
KR960012953U
(ko )
1996-04-17
프린트기판의 솔더마스크
KR950029720U
(ko )
1995-11-17
인쇄회로기판용 압력분무식 플럭스(Flux) 분무장치