KR950004807U - 와이어 본딩 장비의 예열장치 - Google Patents
와이어 본딩 장비의 예열장치Info
- Publication number
- KR950004807U KR950004807U KR2019930012684U KR930012684U KR950004807U KR 950004807 U KR950004807 U KR 950004807U KR 2019930012684 U KR2019930012684 U KR 2019930012684U KR 930012684 U KR930012684 U KR 930012684U KR 950004807 U KR950004807 U KR 950004807U
- Authority
- KR
- South Korea
- Prior art keywords
- preheater
- wire bonding
- bonding equipment
- equipment
- wire
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019930012684U KR970002101Y1 (ko) | 1993-07-10 | 1993-07-10 | 와이어 본딩 장비의 예열 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019930012684U KR970002101Y1 (ko) | 1993-07-10 | 1993-07-10 | 와이어 본딩 장비의 예열 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950004807U true KR950004807U (ko) | 1995-02-18 |
| KR970002101Y1 KR970002101Y1 (ko) | 1997-03-19 |
Family
ID=19358834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019930012684U KR970002101Y1 (ko) | 1993-07-10 | 1993-07-10 | 와이어 본딩 장비의 예열 장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970002101Y1 (ko) |
-
1993
- 1993-07-10 KR KR2019930012684U patent/KR970002101Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970002101Y1 (ko) | 1997-03-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| J2X1 | Appeal (before the patent court) |
Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL |
|
| B701 | Decision to grant | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20080222 Year of fee payment: 12 |
|
| EXPY | Expiration of term |