KR970019750U - 와이어 본딩 장비의 히터블럭 - Google Patents

와이어 본딩 장비의 히터블럭

Info

Publication number
KR970019750U
KR970019750U KR2019950028711U KR19950028711U KR970019750U KR 970019750 U KR970019750 U KR 970019750U KR 2019950028711 U KR2019950028711 U KR 2019950028711U KR 19950028711 U KR19950028711 U KR 19950028711U KR 970019750 U KR970019750 U KR 970019750U
Authority
KR
South Korea
Prior art keywords
wire bonding
heater block
bonding equipment
equipment
heater
Prior art date
Application number
KR2019950028711U
Other languages
English (en)
Other versions
KR0127585Y1 (ko
Inventor
김학원
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950028711U priority Critical patent/KR0127585Y1/ko
Publication of KR970019750U publication Critical patent/KR970019750U/ko
Application granted granted Critical
Publication of KR0127585Y1 publication Critical patent/KR0127585Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019950028711U 1995-10-13 1995-10-13 와이어 본딩 장비의 히터블럭 KR0127585Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950028711U KR0127585Y1 (ko) 1995-10-13 1995-10-13 와이어 본딩 장비의 히터블럭

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950028711U KR0127585Y1 (ko) 1995-10-13 1995-10-13 와이어 본딩 장비의 히터블럭

Publications (2)

Publication Number Publication Date
KR970019750U true KR970019750U (ko) 1997-05-26
KR0127585Y1 KR0127585Y1 (ko) 1998-12-01

Family

ID=19425936

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950028711U KR0127585Y1 (ko) 1995-10-13 1995-10-13 와이어 본딩 장비의 히터블럭

Country Status (1)

Country Link
KR (1) KR0127585Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100466462B1 (ko) * 2001-01-19 2005-01-14 가부시키가이샤 신가와 본딩 장치용 워크 프레서

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100466462B1 (ko) * 2001-01-19 2005-01-14 가부시키가이샤 신가와 본딩 장치용 워크 프레서

Also Published As

Publication number Publication date
KR0127585Y1 (ko) 1998-12-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090624

Year of fee payment: 12

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