KR950001768B1 - Method of heating soldering for power hybrid - Google Patents

Method of heating soldering for power hybrid Download PDF

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Publication number
KR950001768B1
KR950001768B1 KR1019920007233A KR920007233A KR950001768B1 KR 950001768 B1 KR950001768 B1 KR 950001768B1 KR 1019920007233 A KR1019920007233 A KR 1019920007233A KR 920007233 A KR920007233 A KR 920007233A KR 950001768 B1 KR950001768 B1 KR 950001768B1
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KR
South Korea
Prior art keywords
solder paste
reflow
soldering
ceramic substrate
pad
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Application number
KR1019920007233A
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Korean (ko)
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KR930022532A (en
Inventor
이상로
Original Assignee
대우전자부품주식회사
석진철
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Application filed by 대우전자부품주식회사, 석진철 filed Critical 대우전자부품주식회사
Priority to KR1019920007233A priority Critical patent/KR950001768B1/en
Publication of KR930022532A publication Critical patent/KR930022532A/en
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Publication of KR950001768B1 publication Critical patent/KR950001768B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The method enhances degassing sfficiency and reduces the number of voids in solder paste by adding a step of reflow soldering for bonding between a heatsink of power transister and a ceramic substrate of Al2O3. The method has the steps of: printing and sintering conductor pad (2) on a ceramic substrate (1) (A), printing solder paste on a conductor pad (B), forming a reflow solder paste (3') by reflow soldering in a furnace (C), coating covered material (4) on reflow solder paste (D), attaching a heatsink (5) of power trasister on a covered material (E), and make reflow in a furnace(F).

Description

파워 하이브리드용 방열판 솔더링 방법Heat sink soldering method for power hybrids

제1도는 솔더링이 이루어진 본 발명의 사시도.1 is a perspective view of the present invention made of soldering.

제2도는 본 발명의 솔더링 방법 설명도.2 is an explanatory diagram of a soldering method of the present invention.

제3도는 종래의 솔더링 방법 설명도.3 is a diagram illustrating a conventional soldering method.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 산화알루미나(Al2O3)세라믹기판 2 : 도체패드1: aluminum oxide (Al 2 O 3) ceramic substrate 2 conductor pads

3 : 솔더페이스트 31' : 리플로잉 솔더페이스트3: solder paste 31 ': reflow solder paste

4 : 피복제 5 : 파워 트랜지스터의 방열판4: coating agent 5: heat sink of power transistor

본 발명은 파워 하이브리드용 능동소자인 파워 트랜지스터의 방열판과 산화알루미나(Al2O3)세라믹기판과의 접합방법인 솔더링(soldering)에 관한 것으로, 특히 솔더페이스트내의 가스의 배출을 용이하게 하기 위하여 인쇄된 솔더페이스트만을 임시 리플로우 솔더링하는 과정을 첨가한 솔더링 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to soldering, which is a bonding method between a heat sink and an alumina oxide (Al 2 O 3 ) ceramic substrate of a power transistor, which is an active element for a power hybrid, and in particular, to facilitate the discharge of gas in the solder paste. The present invention relates to a soldering method with the addition of a temporary reflow soldering process of only the solder paste.

일반적으로 종래에 사용되고 있는 솔더링 방법은 산화알루미늄(Al2O3)세라믹기판위 파워 트랜지스터 방열판의 실장위치인 도체패드(PAD)상에 솔더페이스트(solder paste)를 인쇄한 후(솔더페이스트내에 피복재가 함유된 상태) 솔더페이스트 고유의 점착력에 의거하여 파워 트랜지스터의 방열판을 탑재 고정시킨 뒤 화로(furnace)에 리플로우시켜 접합하는 방법이었다.In general, the soldering method used in the prior art is to print a solder paste (PAD) on the conductive pad (PAD), the mounting position of the power transistor heat sink on the aluminum oxide (Al 2 O 3 ) ceramic substrate (covering material in the solder paste) It is a method of mounting and fixing the heat sink of the power transistor based on the inherent adhesive force of the solder paste, and then reflowing and joining the furnace.

이러한 솔더링 방법에 있어서, 파워 트랜지스터의 방열판(heatsink) 자체의 면적이 다른 소자에 비해서 현저히 큰 관계로 인하여 솔더페이스트를 용융 접합시키는 과정에서 플럭스의 가스가 효과적으로 배출되지 못하였으며 따라서 솔더링후 페이스트(paste) 내부에 기포가 다량 발생함(솔더페이스트 전체 면적의 약 40∼50%가 발생함)으로 인한 열방산의 저하로 인하여 전체모듈의 수명이 단축되고 있는 현상이 있어왔다.In this soldering method, because the area of the heatsink itself of the power transistor is significantly larger than that of other devices, the gas of the flux was not effectively discharged during the melt bonding of the solder paste, and thus, the post-solder paste There has been a phenomenon that the life of the entire module is shortened due to the decrease of heat dissipation due to the large amount of bubbles generated (about 40-50% of the total area of solder paste).

본 발명은 이러한 문제점을 해결하기 위하여 파워 트랜지스터의 방열판과 산화알루미나(Al2O3)세라믹기판과의 솔더링 방법에 있어서 방열판이 탑재되지 않은 상태의 솔더페이스트(solder paste)를 임시 리플로우 솔더링(pre reflow soldering)시킴으로서 페이스트내에서 생성되는 가스의 배출을 용이하게 하였다.In order to solve this problem, the present invention relates to a method of soldering a heat transistor and an alumina oxide (Al 2 O 3 ) ceramic substrate of a power transistor to temporarily reflow solder paste (solder paste) without a heat sink. Reflow soldering facilitates the release of gases generated in the paste.

따라서 솔더페이스트를 통해서 배출되는 가스의 양만큼 솔더페이스트내에 생성되는 기포(vold)의 양은 감소하여 생성되는 기포는 솔더페이스트 전체면적의 약 5%에만 존재하게 되므로 열방산도 용이하여 전체모듈의 수명은 연장되게 된다.Therefore, the amount of bubbles generated in the solder paste is reduced by the amount of gas discharged through the solder paste, so that the generated bubbles exist only at about 5% of the total area of the solder paste, so heat dissipation is easy and the life of the entire module is extended. Will be.

이하 본 발명의 솔더링 방법을 첨부한 도면을 통하여 살펴본다.Hereinafter, the soldering method of the present invention will be described with reference to the accompanying drawings.

제2도에서 볼 수 있듯이 산화알루미나(Al2O3)세라믹기판(1) 위에는 솔더페이스트(3)가 인쇄될 수 있는 도체패트(PAD)(2)가 인쇄소성된다. 인쇄소성된 도체패드(PAD)(2)위에는 솔더페이스트(3)가 인쇄된다. 도체패드(2) 위에 인쇄된 솔더페이스트(3)는 화로(furnace)에 의해서 임시 리플로우 솔더링(pre reflow soldering)과정(c)으로 된다.As shown in FIG. 2, a conductive pad (PAD) 2 through which a solder paste 3 can be printed is printed on the alumina oxide (Al 2 O 3 ) ceramic substrate 1. The solder paste 3 is printed on the printed-fired conductive pad (PAD) 2. The solder paste 3 printed on the conductor pad 2 is subjected to a pre reflow soldering process (c) by a furnace.

이 임시 리플로우 솔더링 과정(c)에서 솔더페이스트에서 생선된 다량의 가스가 배출된다. 임시 리플로우 솔더링이 이루어진 과정(c)에서 리플로우 솔더페이스트(3')위 표면으로는 피복제(4)가 도포되며 도포된 피복제(4)위로 파워 트랜지스터의 방열판(5)이 장착된다. 피복제(4)위에 정착되어진 방열판(5)은 화로(furnace)에 의해서 리플로우(reflow)되어 완전한 솔더링(soldering)과정(f)으로 된다.In this temporary reflow soldering process (c), a large amount of gas from the solder paste is discharged. In the process (c) where the temporary reflow soldering is performed, the coating material 4 is applied to the surface of the reflow solder paste 3 ', and the heat sink 5 of the power transistor is mounted on the coating material 4 applied. The heat sink 5 fixed on the coating material 4 is reflowed by a furnace and becomes a complete soldering process f.

상기에서 살펴보았듯이 본 발명이 제공하는 솔더링 방법은 종래의 리플로우 솔더링 방법에 있어서 임시 리플로우 솔더링 과정(c)을 첨가함으로서 임시 리플로우 솔더링 과정에서 다량의 가스를 배출되게 하여, 솔더링이 이루어진 후의 솔더페이스트내에 존재하는 기포(vold)는 솔더부 전체면적의 5%에만 존재하며 또한 배출되는 가수의 양만큼 열방산이 용이하게 이루어져서 전체모듈의 수명이 연장되는 매우 실용적인 방법인 것이다.As described above, in the soldering method provided by the present invention, by adding a temporary reflow soldering process (c) in the conventional reflow soldering method, a large amount of gas is discharged during the temporary reflow soldering process, The bubbles (vold) present in the solder paste are present only at 5% of the total area of the solder portion, and the heat dissipation is easily performed by the amount of the valence discharged, thereby extending the life of the entire module.

Claims (1)

산화알루미나(Al2O3)세라믹기판(1) 위에 부착된 도체패드(PAD)(2)위로 솔더페이스트(3)가 인쇄되고(피복제 함유) 그위로 파워 트랜지스터의 방열판(5)이 장착되어 일시에 리플로우 솔더링으로 하는 방법에 있어서, 산화알루미나(Al2O3)세라믹기판(1)의 도체패드(2)위에 인쇄된 솔더페이스트(3)를 임시 리플로우 솔더링하는 과정(c)을 첨가한 솔더링 방법.The solder paste 3 is printed (containing a coating) onto the conductive pad (PAD) 2 attached to the alumina oxide (Al 2 O 3 ) ceramic substrate 1, and the heat sink 5 of the power transistor is mounted thereon. In the method of temporarily reflow soldering, a step (c) of temporarily reflow soldering the solder paste 3 printed on the conductor pad 2 of the alumina oxide (Al 2 O 3 ) ceramic substrate 1 is added. One soldering method.
KR1019920007233A 1992-04-29 1992-04-29 Method of heating soldering for power hybrid KR950001768B1 (en)

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Application Number Priority Date Filing Date Title
KR1019920007233A KR950001768B1 (en) 1992-04-29 1992-04-29 Method of heating soldering for power hybrid

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Application Number Priority Date Filing Date Title
KR1019920007233A KR950001768B1 (en) 1992-04-29 1992-04-29 Method of heating soldering for power hybrid

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KR930022532A KR930022532A (en) 1993-11-24
KR950001768B1 true KR950001768B1 (en) 1995-02-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100982102B1 (en) * 2008-06-10 2010-09-13 콘티넨탈 오토모티브 시스템 주식회사 Electric device package apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100982102B1 (en) * 2008-06-10 2010-09-13 콘티넨탈 오토모티브 시스템 주식회사 Electric device package apparatus

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KR930022532A (en) 1993-11-24

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