KR950000911Y1 - Stabilizer - Google Patents

Abstract

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Description

Self-heating structure of electronic ballast for high pressure discharge lamp

1 is an exploded perspective view showing some of the main components of the present invention.

2 is a rear view of the assembled state of the present invention.

3 is a cross-sectional view of the assembled state of the main portion of the present invention.

Figure 4 (a), (b) is a longitudinal cross-sectional view of the heat sink structure of the conventional electronic ballast.

* Explanation of symbols for main parts of the drawings

1: Case body 2a, b: Insertion rail

3a, 3b: transistor 4: circuit board

5a, b: upper and lower cover 6a, b, c, d: heat dissipation wing

7a, b: Insulation paper 8: Expansion contact

The present invention relates to a self-heating structure of an electronic ballast for a high-pressure discharge lamp such as mercury lamp, sodium lamp or metal lamp, in particular, the present invention is to stabilize the ballast in order to efficiently discharge the heat generated from the transistor (transistor) which is the main part of the electronic ballast The heat dissipation wings are scattered all over the case body, and the two transistors connected to the circuit board installed inside the case body are interposed with the mica insulating paper on both sides of the inner wall of the case body. It is a simple heat dissipation structure that allows heat generated in transistors to conduct heat to the case body and is quickly released to the outside by the heat dissipation blades, thereby preventing the damage of electronic circuit components by heat and extending its service life. Purpose, and without using a separate heat dissipation structure Since the weight of the ballast itself can be reduced in weight, it is another purpose to provide convenience in handling such as installation while reducing the manufacturing cost.

In the ballast used for the high-pressure discharge lamp of the related art, since the copper wire is wound around the silicon steel sheet, the overall size is large, the power loss of the silicon steel core and the power loss inherent to the copper wire are large, heavy, and the entire volume is large. Therefore, there was a lot of inconvenience in handling such as installation, unlike the conventional ballast of the transformer structure, the ballast is electronically configured to significantly reduce the size and weight, thereby reducing the power loss while solving the inconvenience of handling such as installation. It was introduced by the applicant in the Patent Publication No. 91-3551.

However, in the electronic ballast, which is the above-described invention, a large amount of current flows through the transistors constituting the electronic circuit, and thus high heat is generated in the transistor. Therefore, an aluminum heat sink is used to solve this problem.

That is, two transistors 104a and 104b are disposed on both sides of the circuit board 103 fitted to the insertion rails 102 formed on both side walls of the case body 101 of the ballast, and the transistors 104a are provided. To the outer wall of the 104b, the heat sink 105 made of “c” shaped aluminum is brought into close contact with each other, and the filler 106 made of an insulating material is filled between the aluminum heat sink 105 and the case body 101. This heat dissipation structure may have a primary heat dissipation effect for the aluminum heat sink 105 to absorb heat generated by the transistors 104a and 104b, but the heat of the heat sink 105 made of aluminum absorbs heat. Since it is not easily conducted to the case body 101, it is difficult to expect a continuous heat release effect, which causes a problem of inferior efficiency. In addition, the heat sink 105 made of aluminum having a relatively thick and heavy weight is manufactured separately. Since thereby mounted in the main body 101 making up the unit price of the ballast itself, there is a problem in that the weighting is increased with concurrent weight.

The present invention allows self-heating of the transistor to conduct heat directly from the transistor to the case body, and is a self-heating structure that protrudes a large number of heat dissipation wings that have great heat dissipation effect on both side walls of the case body as well as front and rear walls. It is to reduce the weight of itself to quickly discharge the heat generated by the transistor, which is an electronic component to the outside, which will be described in detail according to the accompanying drawings.

After inserting the circuit board 4 to which electronic circuit components such as transistors 3a and 3b are connected to the insertion rails 2a and 2b in the case body 1 made of aluminum, the upper and lower lids are inserted. In the electronic ballast covered by (5a) and (5b), a plurality of heat dissipation blades 6a, 6b, and 6c are disposed at predetermined intervals on the left, right, and front and rear walls of the case body 1. It protrudes and adheres to the left and right sides of the circuit board 4 with the insulating papers 7a and 7b interposed between the transistors 3a and 3b and the inner wall surface of the case body 1 interposed therebetween. As shown in Fig. 8, the reference numerals 9a and 9b are attached to upper and lower rear walls of the case body 1, and 10a and 10b are power connection lines and lamp connection lines. Is displayed.

As described above, when the operation and effect of the present invention are constructed, the transistors 3a and 3b are disposed on both sides of the upper portion of the circuit board 4 fitted to the insertion rails 2a and 2b formed in the case body 1. Is connected, the transistors 3a and 3b can be opened to both sides using the expansion contact 8 after the assembly of the circuit board 4, and the expansion contact 8 itself is leftward. The left-hand bolt 8b and the right-hand bolt 8c are screwed at both ends of the female screw nut 8a in which the female screw part and the female screw part in the right direction are laid, and the ends of the bolt are connected to the transistors 3a and 3b. It is inserted into the insulating holes a and b so that both transistors can be opened to both sides by means of rotating the female nut body 8a, the left screw bolt 8b, and the right screw bolt 8b.

In the state where the circuit board 4 is completely inserted inside the case body 1 as described above, the insulating papers 7a and 7b made of mica are interposed on the back side of each of the transistors 3a and 3b. When the extension end openings 8 are rotated to extend the transistors 3a and 3b on both sides, both transistors are in close contact with the case body 1 with the insulating papers 7a and 7b interposed therebetween. When the ballast is connected to the high-voltage discharge lamp and used in this state, the high heat generated in the transistors 3a and 3b is formed through the insulating paper 7a and 7b. The case body 1 is made of conductive material. The material of the case body 1 is made of aluminum having good thermal conductivity, so that high heat generated from the transistors 3a and 3b is quickly conducted to the case body 1. At the same time as the load, the conducted heat diffuses through the case body 1, Since the plurality of heat dissipation blades 6a, 6b, 6c, and 6d formed integrally with the front and rear side walls as well as the left and right side walls of the sieve have greatly increased the contact area with the outside air, the case body 1 The heat conducted to the heat dissipation is rapidly dissipated by the heat dissipation wings, and thus the case body 1 continuously absorbs heat generated in the transistors 3a and 3b and releases them to the outside, thereby discharging the transistors 3a, (3b) can prevent the damage caused by insufficient heat dissipation and prevent the conduction of heat to each electronic component connected to the circuit board 4, thereby significantly extending the service life of the ballast itself. It is.

As such, the present invention provides an electronic ballast in which a high temperature is generated due to high current flow when it is connected to a high voltage discharge lamp, so that the heat generated by the transistor is closely adhered to the inner wall of the case. At the same time, the heat dissipation blades protruding from the left, right and front and rear walls of the case body quickly release the absorbed heat to the outside air, so that the heat dissipation effect can be expected and the heat can be continuously released. In addition, each electronic component can be prevented from being damaged by heat, which can significantly extend the service life of the electronic safety device itself, and can reduce the size and weight of the ballast, which is convenient for installation and handling. It is a useful design with the advantage of being able to pursue it.

Claims (2)

After inserting the circuit board 4 to which electronic circuit components such as transistors 3a and 3b are connected to the insertion rails 2a and 2b in the case body 1 made of aluminum, the upper and lower lids are inserted. In the electronic ballast covered by (5a) and (5b), transistors 3a and 3b connected to the left and right sides of the circuit board 4 inserted into the case body 1 are connected. Insulating papers 7a and 7b are interposed on the face side, and the two-side transistors are opened to both sides with the expansion-contact 8 to close the both sides of the inner wall surface of the case body 1 so that the heat generated in the transistor is transferred to the case body. Self-heating structure of electronic ballast for high-pressure discharge lamp, characterized by conduction and heat dissipation. 2. The transistors 3a and (3) according to claim 1, wherein a plurality of heat dissipation blades 6a, 6b, 6c, and 6d are protruded from the left and right walls and the front and rear walls of the case body 1. Self-heating structure of the electronic ballast for high-pressure discharge lamp, characterized in that the heat dissipation surface area of the heat conducted in 3b) is expanded.