KR950000517B1 - Method of manufacturing seramic package - Google Patents

Method of manufacturing seramic package Download PDF

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KR950000517B1
KR950000517B1 KR1019890017186A KR890017186A KR950000517B1 KR 950000517 B1 KR950000517 B1 KR 950000517B1 KR 1019890017186 A KR1019890017186 A KR 1019890017186A KR 890017186 A KR890017186 A KR 890017186A KR 950000517 B1 KR950000517 B1 KR 950000517B1
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ceramic package
external connection
package
substrate
hole
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KR1019890017186A
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Korean (ko)
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KR910010681A (en
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편영범
장안재
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삼성코닝 주식회사
한형수
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

forming rectangular through-holes (8,8',8") in positions which are joined by external connecting lead (9) on non-sintered substrate (1); forming internal conductive pattern layers (5) in the holes (8,8',8"); heating, compressing and sintering each substrate in a stacked state; inserting an external connecting lead (9) into the holes (8,8',8") in the sintered ceramic package to solder, and cutting along the cutting line.

Description

세라믹 팩키지의 제조방법Manufacturing method of ceramic package

제 1 도는 종래 기술에 의한 적층세라믹 팩키지의 분리사시도.1 is an exploded perspective view of a laminated ceramic package according to the prior art.

제 2 도는 종래 기술에 의한 적층세라믹 패키지의 제조공정도.2 is a manufacturing process diagram of a laminated ceramic package according to the prior art.

제 3 도는 본 발명에 의한 적층세라믹 패키지의 분리사시도.3 is an exploded perspective view of a laminated ceramic package according to the present invention.

제 4 도는 본 발명에 의한 적층세라믹 팩키지의 제조공정도.4 is a manufacturing process diagram of the laminated ceramic package according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 반도체 소자 탑재미소성기판 2 : 내부패턴 형성 미소성기판DESCRIPTION OF SYMBOLS 1 Unbaked board | substrate with a semiconductor element 2 Unbaked substrate with internal pattern formation

3 : 최상층 미소성기판 4 : 반도체소자 탑재용 패턴3: top layer unbaked substrate 4: semiconductor element mounting pattern

5 : 내부도체패턴 6 : 캡 밀폐용 도체패턴5: Inner conductor pattern 6: Cap sealing conductor pattern

7 : 공동(Cavity) 8,8',8'' : 관통구7: Cavity 8,8 ', 8' ': Through Hole

9 : 외부접속리드9: External connection lead

본 발명은 반도체 소자를 탑재하는 적층 세라믹 팩키지(Ceramic Package) 제조에 관한 것으로, 특히 팩키지의 측면에 외부접속리드를 수직으로 접합시키는 측면 경납땜 세라믹 팩키지(Side-Brazed Ceramic Package)의 외부인출용 측면도체 배선 형성방법 및 외부 접속리드의 접속방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to the manufacture of a multilayer ceramic package on which a semiconductor device is mounted. In particular, a side surface for external drawing of a side brazed ceramic package for vertically bonding an external connection lead to a side of the package. A method for forming conductor wirings and a method for connecting external connection leads.

구체적으로는 반도체 소자를 탑재할 수 있는 적층세라믹 팩키지의 제조시 각 미소성 기판상에 외부접속리드가 접합되는 위치에 따라 관통구를 형성시켜 관통구 내부에 외부접속리드를 접합시킬 수 있도록 진공흡입 프린팅(Printing)에 의해 측면도체 배선층을 형성시키고, 상기 관통구에 외부접속리드를 삽입하여 납땜시킨것에 관한 것이다.Specifically, in the manufacture of a laminated ceramic package in which semiconductor elements can be mounted, vacuum suction is performed to form a through hole according to the position where the external connection lead is bonded on each unbaked substrate so that the external connection lead can be bonded inside the through hole. A side conductor wiring layer is formed by printing, and an external connection lead is inserted into the through hole and soldered.

일반적으로 사용되고 있는 적층 세라믹 팩키지의 제조방법은 제 1 도에 도시된 바와 같이 알루미나계 세라믹 재료로 구성된 반도체 소자 탑재 미소성 기판(1), 내부패턴형성 미소성 기판(2), 최상층 미소성 기판(3)의 소정부분에 텅스텐이나 몰리브덴 등의 고융점 금속을 주성분으로 하는 금속화 재료에 의해 반도체 소자탑재용 패턴(4), 내부도체 패턴(5), 캡 밀폐용 도체 패턴(6)을 형성시킨 후 각 미소성 기판을 적층하여 소정의 패턴을 따라 절단함으로써, 미소성 팩키지(20)을 얻게 된다.In general, a method of manufacturing a multilayer ceramic package that is used is a semiconductor element-mounted unbaked substrate 1 composed of an alumina-based ceramic material, an inner pattern forming unbaked substrate 2, and a topmost unbaked substrate (as shown in FIG. 1). 3) A semiconductor element mounting pattern 4, an inner conductor pattern 5, and a cap sealing conductor pattern 6 are formed of a metallization material composed mainly of a high melting point metal such as tungsten or molybdenum in a predetermined portion of 3). After the unbaked substrates are laminated and cut along a predetermined pattern, the unbaked package 20 is obtained.

절단한 각각의 미소성 팩키지(20)의 측면에 외부접속리드(9)가 접할 수 있도록 측면패턴부(21)를 텅스텐 금속페이스트를 사용하여 인쇄한다.The side pattern portion 21 is printed using a tungsten metal paste so that the external connection lead 9 is in contact with the side of each unbaked package 20 which has been cut.

그리고, 상기의 미소성팩키지(20)을 가습수소 분위기에서 소정의 시간동안 열처리한 후 외부접속리드(9)를 팩키지 측면 패턴부(21)에 Ag-Cu 땜납접합시킴으로써 적층 세라믹 팩키지가 완성이 된다.After the unbaked package 20 is heat-treated in a humidified hydrogen atmosphere for a predetermined time, the multilayer ceramic package is completed by soldering the external connection lead 9 to the package side pattern portion 21 by Ag-Cu solder. .

그런데 상기와 같은 방법으로 적층 세라믹 팩키지를 제조하는데 있어, 첫째 세라믹 팩키지(20)의 측면에 외부접속용리드(9)를 설계하는 소위 측면 경납땜 팩키지의 경우에는 세라믹 팩키지(20)의 측면에 내부도체 패턴(5)과 외부접속리드(9)가 전기적인 접속이 되도록 측면 패턴부(21)의 형성 및 외부접속리드의 접합시 특수치구를 필요로 하게 되어 제조원가의 상승과 제조공정의 번거로움이 있어 대량생산이 곤란하였으며, 둘째 적층된 미소성 기판을 각각의 팩키지 형태로 절단하여 소결해야 하므로 작업이 번거롭고 시편의 취급시간이 길어지게 되어 불량률이 높았고, 셋째 외부접속리드(9)의 접합과 금속층의 표면부식을 억제하기 위해 실시하는 Ni/Au 도금공정시 각각의 팩키지를 도금시켜야 하므로 도금공정이 길어지고 대량생산이 곤란하였다.However, in the manufacture of the multilayer ceramic package in the same manner as described above, in the case of the so-called side brazing package for designing the external connection lead 9 on the side of the first ceramic package 20, the inside of the side of the ceramic package 20 The formation of the side pattern portion 21 and the need for a special jig when joining the external connection lead so that the conductor pattern 5 and the external connection lead 9 are electrically connected, increases manufacturing costs and hassle. Secondly, it was difficult to mass-produce, and secondly, unbaked substrates had to be cut and sintered in the form of each package, which was cumbersome and the handling time of the specimen was long, so that the defect rate was high. In order to suppress surface corrosion of the Ni / Au plating process, each package had to be plated, so the plating process was long and mass production was difficult.

따라서, 본 발명은 상기와 같은 제반결점을 해소하고자 창출된 것으로써, 내부도체패턴의 끝단에 위치하는 관통구가 각각의 미소성 세라믹 기판에 형성되도록 하여 외부접속리드를 삽입하여 접합시킨 후 절단선을 따라 절단되도록 함으로써 제조공정의 단순화 및 불량률의 감소로 생산원가를 절감하는데 목적이 있다.Therefore, the present invention was created in order to solve the above-mentioned general defects, so that the through-hole located at the end of the inner conductor pattern is formed on each of the unbaked ceramic substrates so as to insert and connect the external connection leads, and then cut lines. It is intended to reduce the production cost by simplifying the manufacturing process and reducing the defective rate by being cut along.

또 다른 목적은 외부접속리드의 위치 이탈을 방지하고, 시편의 취급시간 단축 및 대량생산을 할 수 있게 하는데 목적이 있다.Another purpose is to prevent the external connection lead from deviating, to shorten the handling time of the specimen and to mass produce.

상기한 목적을 달성하기 위한 본 고안의 특징으로 첨부된 도면에 의거하여 상세히 설명하면 다음과 같다.When described in detail based on the accompanying drawings as a feature of the present invention for achieving the above object is as follows.

본 발명에 의한 적층 세라믹 팩키지의 제조방법을 제 3 도 및 제 4 도에 나타내었다.3 and 4 show a method of manufacturing a multilayer ceramic package according to the present invention.

즉, 미소성 세라믹 기판(예를 들어 3매를 사용할 경우)을 캡(CAP)을 접착시키는 최상층 기판(3)의 소정위치에 반도체 소자를 탑재시키는 공동(Cavity)(7)을 형성시킴과 동시에 소결후에 세라믹 기판의 적층체를 각각의 팩키지로 절단할 수 있도록 형성된 절단선(10)을 따라 사각형의 관통구(8'')를 외부접속리드(9)가 삽입될 수 있는 크기로 펀칭(Punching)공정으로 형성시킨다.That is, while forming a cavity 7 for mounting a semiconductor element at a predetermined position of the uppermost substrate 3 on which the unbaked ceramic substrate (for example, when using three sheets) is bonded to the cap CAP, Punching a rectangular through hole 8 '' along the cutting line 10 formed to cut the laminate of the ceramic substrate into individual packages after sintering to a size where the external connection lead 9 can be inserted. ) Is formed by the process.

상기 관통구(8'')는 내부도체 패턴(5)과 외부접속리드(9)가 접속될 수 있도록 내부도체패턴(5)의 외부 끝부분에 위치하도록 하며, 관통구(8'') 내부에 진공흡입법을 이용하여 금속도체 페이스트(Paste)를 인쇄함으로서 도체배선층을 형성시킨다.The through hole 8 ″ is positioned at an outer end of the inner conductor pattern 5 so that the inner conductor pattern 5 and the external connection lead 9 can be connected to each other, and inside the through hole 8 ″. The conductor wiring layer is formed by printing a metal conductor paste by using vacuum suction method.

상기와 동일하게 내부도체 패턴(5)이 형성된 내부패턴 형성미소성기판(2) 및 반도체 소자 탑재용 패턴(4)이 형성된 반도체 소자탑재 미소성 기판(1)에 관통구(8)(8')를 천공하고 진공흡입법으로 금속도체 페이스트를 인쇄함으로써 도체 배선층을 형성시킨다.As described above, through holes 8 and 8 'are formed in the semiconductor element-mounted unbaked substrate 1 on which the internal pattern-forming microstructured substrate 2 on which the inner conductor pattern 5 is formed and the pattern for mounting semiconductor elements 4 are formed. ) And the conductor wiring layer is formed by printing the metal conductor paste by vacuum suction method.

그후, 각각의 미소성 기판(1)(2)(3)을 가열압착법에 의해 적층한 다음 관통구(8)(8')(8'')을 따라 절단되는 절단선(10)을 형성시킨후 1500∼1600℃ 가습수소 분위기에서 소결한다.Thereafter, each unbaked substrate 1, 2, 3 is laminated by hot pressing, and then a cutting line 10 is formed which is cut along the through holes 8, 8 ', 8 ". After sintering is performed at 1500 to 1600 ° C in a humidified hydrogen atmosphere.

소결된 세라믹 팩키지(P)는 외부접속리드(9)의 부착을 위해 금속도체 패턴표면에 Ni도금층을 형성시킨후, 상기 관통구(8)(8')(8'')에 외부접속리드(9)를 삽입시켜 Ag-Cu계 땜납재료로 800∼850℃로 열처리하여 접합시킨다.The sintered ceramic package (P) forms a Ni plating layer on the surface of the metal conductor pattern for attachment of the external connection lead (9), and then the external connection lead (8) (8 ') (8' ') in the through holes (8). 9) is inserted and heat-bonded by Ag-Cu solder material at 800 ~ 850 ℃.

외부접속리드(9)가 접합된 세라믹 팩키지(P)는 Ni/Au 도금층을 도체패턴 표면에 형성시키게 된다.The ceramic package P, to which the external connection leads 9 are bonded, forms a Ni / Au plating layer on the surface of the conductor pattern.

상기와 같이 적층된 세라믹 팩키지(P)를 절단선(10)을 따라 절단시키면 외부접속리드(9)가 접합된 적층 세라믹 팩키지(P')가 제조된다.When the ceramic package P stacked as described above is cut along the cutting line 10, the multilayer ceramic package P ′ to which the external connection leads 9 are bonded is manufactured.

상술한 바와 같은 제조공정에 의해 제조된 적층 세라믹 팩키지는 첫째, 종래의 방법과 같이 측면패턴부에 인쇄를 위해 미소성 적층체를 절단하여 각각의 팩키지로 분리시킨다음, 측면 패턴인쇄 치구에 장치해야할 필요없이 미소성 기판상태에서 진공흡입법에 의한 관통구 인쇄기술을 사용하여 리드접합되는 부분에 도체패턴을 형성할 수 있으므로 공정의 단순화 및 단축이 가능하며, 불량감소에 의한 수율향상이 이루어질 수 있다.The laminated ceramic package manufactured by the manufacturing process as described above, first, like the conventional method, the unbaked laminate is cut to separate into individual packages for printing on the side pattern portion, and then to be mounted on the side pattern printing jig. Since it is possible to form a conductive pattern on the part to be bonded through the through hole printing technique by vacuum suction method in the unbaked substrate state, the process can be simplified and shortened, and the yield can be improved by the defect reduction.

둘째, Ni/Au 도금공정시 한번에 복수개의 팩키지를 처리할 수 있으므로 대량생산에 적합하다.Second, the Ni / Au plating process can process a plurality of packages at a time, which is suitable for mass production.

셋째, 외부접속리드를 측면패턴부에 고정시킬 특별한 치구가 필요없이 단순하게 관통구에 접속리드를 삽입시켜 접합시키는 것이 가능하므로, 원가절감이 가능하고 공정의 단순화가 이루어질 수 있으며, 또한 종래의 기술보다 외부접속리드의 위치 이탈이 일어나기 어려우므로 생산수율의 증가가 가능하게 된다.Third, since it is possible to simply connect the connection lead to the through hole without the need for a special jig to fix the external connection lead to the side pattern portion, it is possible to reduce the cost and simplify the process, and also the prior art Since the positional deviation of the external connection lead is less likely to occur, the production yield can be increased.

넷째, 소성공정시 복수개의 팩키지를 동시에 처리가능하므로 작업이 단순해지고, 시편취급시간이 줄어들어 불량확률이 낮아지는 등의 효과가 있다.Fourth, since a plurality of packages can be processed at the same time during the firing process, the operation is simplified, and the specimen handling time is reduced, so that the probability of defects is lowered.

Claims (1)

미소성 세라믹 기판을 복수개 적층한 상태로 가열가압한 다음, 고온소성하여 얻어진 적층 세라믹 기판을 소정의 패턴을 따라서 절단하여 세라믹 팩키지를 형성하는 세라믹 팩키지의 제조방법에 있어서, 상기 미소성 기판에 외부접속리드가 접합되는 위치에 사각관통구를 형성한 후 진공흡입 인쇄에 의해 상기 관통구 내부에 도체팬턴층을 형성시킨 다음, 각 기판을 적층한 상태로 가열압착시켜 소성처리시키고, 소성된 세라믹 팩키지에 형성된 관통구 내부로 외부접속리드를 삽입접합 하여 납땜한 후, 절단선을 따라 절단하는 것에 의해 외부접속리드가 세라믹 팩키지 측면의 상기 사각관통구에 고정되는 것을 특징으로 하는 세라믹 팩키지의 제조방법.A method of manufacturing a ceramic package in which a multilayer ceramic substrate is formed by heating and pressing a plurality of unbaked ceramic substrates, and then cutting the laminated ceramic substrate obtained by high temperature firing according to a predetermined pattern to form a ceramic package. A rectangular through hole is formed at the position where the leads are joined, and then a conductive pantone layer is formed inside the through hole by vacuum suction printing. Then, the substrate is heated and pressed in a laminated state, and calcined, and the ceramic package is fired. A method of manufacturing a ceramic package, characterized in that the external connection lead is fixed to the rectangular through hole on the side of the ceramic package by inserting and soldering an external connection lead into the formed through hole.
KR1019890017186A 1989-11-25 1989-11-25 Method of manufacturing seramic package KR950000517B1 (en)

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KR950000517B1 true KR950000517B1 (en) 1995-01-24

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