KR950000049Y1 - Mold-die - Google Patents
Mold-die Download PDFInfo
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- KR950000049Y1 KR950000049Y1 KR2019910023202U KR910023202U KR950000049Y1 KR 950000049 Y1 KR950000049 Y1 KR 950000049Y1 KR 2019910023202 U KR2019910023202 U KR 2019910023202U KR 910023202 U KR910023202 U KR 910023202U KR 950000049 Y1 KR950000049 Y1 KR 950000049Y1
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- port
- molding compound
- compound
- mold die
- die
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Abstract
내용 없음.No content.
Description
제1도는 일반적인 몰드다이의 개략도.1 is a schematic view of a typical mold die.
제2a도는 제1도 "가"부에 몰딩컴파운드가 수용된 상태의 단면도.FIG. 2A is a cross-sectional view of the molding compound housed in the “first” part of FIG.
제2b도는 제2a도의 몰딩컴파운드를 가압한 상태의 단면도.FIG. 2B is a sectional view of the molding compound of FIG.
제3도는 본 고안에 이용된 포트의 일부사시도.3 is a partial perspective view of a port used in the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
3 : 플런저 4 :램-팁3: plunger 4: ram-tip
5및10 : 포트 11 : 절연재5 and 10: Port 11: Insulation Material
12A및12B : 전극12A and 12B: Electrode
본 고안은 몰드다이(Mold Die)에 관한 것으로서, 특히 몰딩컴파운드의 예열장치를 구비한 몰드다이에 관한 것이다.The present invention relates to a mold die, and more particularly to a mold die having a preheating device of the molding compound.
반도체 제조공정에서, 다이접착 및 와이어 본딩(Die attach ＆ Wire Bonding) 공정이 실시된 리드프레임은 몰드다이에 장착되어 성형(Encapusulation) 공정을 거치게 된다.In a semiconductor manufacturing process, a lead frame subjected to die attach & wire bonding process is mounted on a mold die and subjected to an encapusulation process.
상형다이 및 하형다이의 캐비티 사이에 안착된 리드프레임에 몰딩컴파운드를 가압, 주입하면, 리드프레임 상하면에 일정헝상의 패캐이지가 성형된다.When the molding compound is pressed and injected into the lead frame seated between the upper die and the cavity of the lower die, a predetermined hung package is formed on the upper and lower surfaces of the lead frame.
이와같은 기능을 수행하는 몰드다이의 구성을 간단히 설명하면, 제1도는 몰드다이의 개략도로서, 상, 하형 다이(1A, 2A)에는 체이스 블록(1B, 2B)이 각각 장착되며, 각 체이스 블록(1B, 2B)상에는 캐비티블록 및 런너블록(도시되지 않음)이 장착되어 리드프레임의 안착 및 몰딩컴파운드의 통로 역할을 수행하게 된다.Briefly describing the configuration of a mold die for performing such a function, FIG. 1 is a schematic view of a mold die, in which upper and lower dies 1A and 2A are mounted with chase blocks 1B and 2B, respectively. Cavity blocks and runner blocks (not shown) are mounted on 1B and 2B to serve as passages for seating and molding compound of lead frames.
상형다이(1A) 상단부에는 몰딩컴파운드를 가압하는 플런저(2, Plunger) 및 램팁(4, Ram-Tip)이 설치되어 있으며, 그하부에는 상형다이(1A)를 관통한 상태에서 몰딩컴파운드를 수용하는 포토(5, Pot)가 형성되어 있다. 이 포트(5)는 상부 체이스 블록(1B)에 장착된 런너볼록의 런너와 연통되어 있다.A plunger (2, Plunger) and a ram tip (4, Ram-Tip) pressurizing the molding compound is installed at the upper end of the upper die (1A), and the lower portion receives the molding compound while penetrating the upper die (1A). The pot 5 is formed. This port 5 communicates with a runner convex runner mounted on the upper chase block 1B.
이와같은 몰드다이를 이용하여 몰딩컴파운드를 각 캐비티내로 주입시키는 과정 및 이에 따른 문제점을 제1도, 제2a도 및 제2b도를 참조하여 설명하면 제2a도는 제1도 A부의 측단면도로서, 예열된 몰딩컴파운드가 수용된 상태를 도시하며, 제2b도는 제2a도의 몰딩컴파운드를 가압한 상태의 단면을 도시한다.The process of injecting the molding compound into each cavity using such a mold die and the problems thereof will be described with reference to FIGS. 1, 2a, and 2b. FIG. 2a is a side cross-sectional view of FIG. FIG. 2B is a cross-sectional view of a state in which the molding compound of FIG. 2A is pressed.
몰드다이와는 별도로 설치되는 예열기(Pretheater)에서 예열되어 겔(Gel) 상태로 변화된 몰딩컴파운드(초기에는 고체상태임)를 이송하여 상형다이(1A)에 구성된 포트(5)내에 수용한다(제 2a도의 상태).Molding compound (preliminarily solid state), which is preheated in a preheater installed separately from the mold die, is transferred to a gel state and transported into a port 5 configured in the upper die 1A (see FIG. 2A). condition).
이때, 제2a도에 도시된 바와같이 몰딩컴파운드(9)와 포트(5)의 내벽사이에는 공기(9A)가 존재하게 되며, 포트(5)의 상단연변에는 몰딩컴파운드(9)가 붙게된다.In this case, as shown in FIG. 2A, air 9A is present between the molding compound 9 and the inner wall of the port 5, and the molding compound 9 is attached to the upper edge of the port 5.
이상태에서 플런저(3)와 램-팁(4)을 하향이동시켜 조트(5)내의 몰딩컴파운드(9)를 가압하면, 몰딩컴파운드(9)는 상술한 런너블록의 런너를 통하여 각 캐비티내로 주입되어 각 리드프레임의 상하면에서 경화, 패캐이지화 된다.In this state, when the plunger 3 and the ram tip 4 are moved downward to press the molding compound 9 in the jaw 5, the molding compound 9 is injected into each cavity through the runner of the runner block described above. It is hardened and packaged on the upper and lower surfaces of each lead frame.
제2b도에 도시된 바와같이, 포트(5)내에 수용된 몰딩컴파운드(9)를 램-팁(4)으로 가압하게 되면, 몰딩컴파운드(9)와 포트(5) 내벽사이에 존재하는 공기(제2a도의 9)는 몰딩컴파운드(9) 내부에서 기포(9B)로 존재하게 되며, 따라서 각 캐비티 내로 주입되는 몰딩컴파운드에도 기포가 함유되어 결국 몰딩컴파운드(9)의 와전한 기능을 기대할 수가 없다. 또한 유입당시 포트(5) 상단연변에 묻어있는 몰딩컴파운드가 램-팁(4)의 가압후 그대로 잔류하게되어(제2b도의 9C)시간이 경과된 후 경화되어 포트(5) 상단부가 지저분하게 된다.As shown in FIG. 2B, when the molding compound 9 contained in the port 5 is pressed with the ram tip 4, the air present between the molding compound 9 and the inner wall of the port 5 9a of FIG. 2a is present as a bubble 9B in the molding compound 9, and thus, bubbles are also contained in the molding compound injected into each cavity, so that the full function of the molding compound 9 cannot be expected. In addition, the molding compound buried in the upper edge of the port 5 at the time of inflow is left as it is after pressing the ram-tip 4 (9C in FIG. 2b), and cured after a period of time, and the upper end of the port 5 becomes dirty. .
본 고안의 목적은 기존의 몰드다이에서 발생하는 위와같은 사용상의 문제점을 해결하기 위한 것으로, 포트에 예열기능을 구비시켜 포트내에서 몰딩컴파운드를 곧바로 예열시킬수 있도록 구성한 물드다이를 제공하는데 있다.An object of the present invention is to solve the above-mentioned problems in the use of the mold die, and to provide a mold die configured to preheat the molding compound in the pot by providing a preheating function in the port.
이하, 본고안을 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 일반적인 몰드다이의 개략도, 제2a도는 제1도 "가"부에 몰딩컴파운드가 수용된 상태의 단면도, 제2b도는 제2a도의 몰딩컴파운드를 가압한 상태의 단면도로서, 명세서 서두에서 설명하였기에 중복설명은 생략한다.FIG. 1 is a schematic view of a general mold die, FIG. 2A is a cross-sectional view of a molding compound housed in the "a" part of FIG. 1, and FIG. 2B is a cross-sectional view of the molding compound of FIG. Description is omitted.
제3도는 본고안에 이용된 포트의 일부사시도로서, 본고안의 가장 큰 특징은 몰드다이의 구성부분중 몰딩컴파운드를 수용하는 포트를 예열장치의 기능을 겸비하도록 구성한 것이다.3 is a partial perspective view of the port used in this paper, the biggest feature of this paper is to configure the port of the mold die to accommodate the molding compound to combine the function of the preheater.
(본고안에서 이용되는 플런저 및 램팁, 상형다이, 하형다이, 상, 하체이스 블록, 런너블록 및 캐비티 블록은 제1도에서 설명한 일반적인 몰드다이의 구성과 동일함으로 이에 대한 설명은 생략한다)(The plunger and ram tip, upper die, lower die, upper, lower chase block, runner block and cavity block used in this paper are the same as those of the general mold die described in FIG.
즉, 제1도에 도시된 바와같은 중공원통형의 포트(10)전 외주면에 테프론과 같은 절연재(11)를 코팅하거나, 시이트(Sheet) 형태로 부착시키고, 절연재(11) 외주면에 전원이 연결되어 있는 1쌍의 전극(12A, 12B)에서 열이발생됨에 따라 포트(10)역시 가열되어 포트(10) 자체가 예열기능을 갖게 된다.That is, the insulating material 11 such as Teflon is coated on the outer circumferential surface of the hollow core cylindrical port 10 as shown in FIG. 1 or attached in the form of a sheet, and the power is connected to the outer circumferential surface of the insulating material 11. As the heat is generated from the pair of electrodes 12A and 12B, the port 10 is also heated so that the port 10 itself has a preheating function.
컴파운드를 예열시키는 과정을 제1도 및 제3도를 참조하여 설명하면, 먼저 리드프레임을 몰드다이에 재치시킨후, 상,하형 다이(1A, 2A)를 가압시킨다. 이후, 가열되지 않은 고체상태의 컴파운드를 포트(10)에 집어넣은뒤 전원을 인가함과 동시에 플런저(3) 및 램-팁(4)을 작동시키게 된다.The process of preheating the compound will be described with reference to FIGS. 1 and 3, first, the lead frame is placed on a mold die, and then the upper and lower dies 1A and 2A are pressed. Thereafter, the unheated solid compound is inserted into the port 10 and the power is applied to the plunger 3 and the ram tip 4.
전극(12A, 12B)에서 발생되는 열로 인하여 컴파운드는 포트(10)내에서 가열되면서 가압되는 램-팁(5)에 의하여 런너블록의 런너를 통하여 각 캐비티내로 주입된다.Due to the heat generated in the electrodes 12A and 12B, the compound is injected into each cavity through the runner of the runner block by the ram-tip 5 which is pressed while being heated in the port 10.
이상과 같은 본고안의 사용상 효과를 설명하면, (가) 컴파운드를 포트내에서 직접 가열함으로서 가열시간 및 컴파운드의 포트내 수용시간이 감소되며, (나) 고체상태의 컴파운드를 포트내에 수용함으로서 겔상태의 컴파운드 보다는 수용이 용이하게 이루어질 뿐아니라 포트외부의 이물질이 컴파운드에 달라붙지 않게된다.As described above, the use effect of the present proposal can be explained by (a) heating the compound directly in the pot to reduce the heating time and the compounding time in the pot, and (b) containing the solid compound in the pot to obtain the gel state. Not only is it easier to receive than compound, it also prevents foreign matter from sticking to the compound.
(다) 컴파운드가 가열됨과 동시에 램팁에 의하여 가압됨으로서 포트내에서 공기가 쉽게 빠져나가 기존의 방법에서 발생되는 몰딩컴파운드내의 공기존재의 문제점(겔상태의 몰딩컴파운드와 포트내벽에 존재하는 공기)이 간단하게 해결되며, 따라서 제품의 품질향상이 가능하다.(C) As the compound is heated and pressurized by the ram tip, air is easily released from the port, and the problem of the presence of air in the molding compound (gel-forming molding compound and air present in the port inner wall) generated by the conventional method is simple. It is possible to improve the quality of the product.
(라) 또한 컴파운드를 포트내에서 직접 가열하게 되어 외부에서 가열된 몰딩컴파운드를 포트내로 이송하는 과정에서 발생하는 열손실을 방지할 수 있어 원활한 몰딩작업을 수행할 수 있다.(D) In addition, since the compound is directly heated in the pot, it is possible to prevent the heat loss generated in the process of transferring the externally heated molding compound into the pot, thereby enabling smooth molding operation.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910023202U KR950000049Y1 (en) | 1991-12-21 | 1991-12-21 | Mold-die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910023202U KR950000049Y1 (en) | 1991-12-21 | 1991-12-21 | Mold-die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930016191U KR930016191U (en) | 1993-07-28 |
| KR950000049Y1 true KR950000049Y1 (en) | 1995-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910023202U KR950000049Y1 (en) | 1991-12-21 | 1991-12-21 | Mold-die |
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| Country | Link |
|---|---|
| KR (1) | KR950000049Y1 (en) |
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1991
- 1991-12-21 KR KR2019910023202U patent/KR950000049Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR930016191U (en) | 1993-07-28 |
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