KR950000010B1 - Ion plating method and processing apparatus therefor - Google Patents

Abstract

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Description

Ion Plating Method and Apparatus for the Method

1 is a schematic view showing an ion plating apparatus according to the first embodiment of the present invention,

2 is a graph showing the relationship between the electrodeposition rate and the ionization ratio when using the apparatus of Example 1 and the conventional apparatus of the comparative example,

3 is a schematic view showing an ion plating apparatus of the present invention according to Example 2,

4 is a schematic view showing an ion plating apparatus of the present invention according to Example 3,

5 is a schematic representation of the apparatus disclosed in US Pat. No. 4,828,872 (DE 3,627,151 A1).

The present invention relates to devices for ion plating and ion plating, and more particularly to ion-plating methods and devices suitable for forming films at high speed on a wide range of substrates.

Recently, attempts have been made to increase the added value by forming a film on a wide steel sheet such as a cold rolled steel sheet by a dry process. Among these attempts, ion plating was found to be an excellent method in terms of adhesion, density and productivity of the film. [Material and Process, Vol. 2, pp. 1636-1637 (1989). In order to improve the productivity in ion plating, the film material must be evaporated at high speed, and it is advantageous to use a high power electron gun as the heating means of the material. However, technical difficulties have been encountered when ionizing materials that have been evaporated at high speed at high ionization ratios. No industrial method for wide steel sheet has yet been established.

When the ceramic film is formed by the ion plating method, the metal material which is the main component of the ceramic is heated, evaporated and ionized. At the same time, metal ions are reacted with a reaction gas simultaneously supplied during ionization to form a ceramic film on the substrate. Among ion plating methods, the HCD (Hollow Cathode Discharge) method is useful for simultaneously evaporating and ionizing materials using a plasma gun. This method is used as a reactive ion plating method because it has a high ionization ratio. However, the deposition rate of this method is on the order of 1/10 μm / min, and most practical systems are small batch systems. The economic disadvantage is inevitably caused when this method is applied to a continuous processing apparatus for steel sheet.

Japanese Patent Publication No. 57-57553 proposes a method of using an electron gun as a heating means and arranging a positive electrode near a crucible in order to improve the ionization ratio and the quality of the film. However, this method is only applicable to small batch systems because the emission becomes unstable during film formation at high speeds. Therefore, it is difficult to ion plate steel sheets having a large area at high speed by using a wide crucible.

Japanese Patent Application Laid-Open No. 57-155369 discloses a method of converging vapor particles by a hood located above the crucible and ionizing the vapor particles by a positive electrode and a filament located above the hood. It is proposed. According to this method, a stable release can be obtained even during high-speed evaporation. However, the life of the filament is short, so this method is not applicable to practical continuous equipment.

As schematically shown in FIG. 5, US Pat. No. 4,828,872 (DE 3627 151 A1) completely covers the crucible 3 with an inner chamber 6 having an opening 8, and the hole 8 A method of ionizing the vapor flow from the < RTI ID = 0.0 >) < / RTI > According to this method, stable release is obtained even during high speed evaporation, and the arrangement shown in Fig. 5 can withstand long term operation. However, because the gap between the electrode 9 and the crucible 3 on the upper side of the inner chamber 6 is too wide, it is not possible to sufficiently accelerate the thermoelectrons generated by the vaporous material 4. For this reason, the ionization ratio of the vapor particles is not high enough. In particular, the ionization ratio is greatly reduced during fast evaporation.

The inventors of the present invention have made intensive studies in consideration of these problems. As a result, the hood type having the function of converging the vapor flow on the top of the crucible when the vapor phase material in the crucible is heated and evaporated by an electron gun and ionized by the positive electrode ( By placing a hood-like electrode, the present invention achieves the invention of stabilizing the emission and increasing the ionization ratio even during high evaporation using a simple structure.

An object of the present invention is to provide an ion plating method for forming a high quality metal, alloy and ceramic film on a moving steel sheet by stably ion plating a large scale industrial steel sheet and especially a wide steel sheet with a high deposition rate and a high ionization ratio using a simple structure. It is to provide an apparatus for use in this method.

According to the present invention, there is provided a method comprising: radiating an electron beam onto at least one material to heat and evaporate the material to generate a vapor flow of the material; Converging the vapor flow of the material by a hooded electrode; Applying a positive voltage to the hood electrode to attract hot electrons from the material and ionize the air flow with the hot electrons; And depositing a condensed and ionized vapor stream onto the steel sheet, thereby providing a method of ion plating a moving steel sheet. In addition, in the case where a ceramic film is to be formed on the steel sheet, the resulting compound is deposited on the steel sheet as a ceramic film by supplying the reaction gas into the electrode and then ionizing the reaction gas flowing in the electrode with the vapor flow.

Also according to the present invention, there is provided a vacuum chamber for passing a steel sheet, having an inlet and an outlet through which the steel sheet to be ion plated is maintained in a vacuum atmosphere; A crucible located below the steel sheet in the vacuum chamber for containing an ion plating material; Spinning means for heating and evaporating the material by radiating an electron beam onto the plating material; Located above the crucible and below the elongated fragment in the vacuum chamber and having a hood shape to cover the top of the crucible, the hole and a hole for accommodating the heated and evaporated material formed at the bottom of the electrode An electrode having a hole for releasing the formed heated and evaporated material toward the steel sheet; And a DC power supply having a positive terminal connected to the electrode and a negative terminal connected to the crucible. In addition, the apparatus for forming the ceramic film on the steel sheet further has an inlet for receiving the reaction gas.

According to the present invention, since the hood type electrode is located above the crucible, it is possible to prevent the diffusion of the vapor flow. In particular, it is possible to suppress vapor disturbance caused by the surface state of the vapor phase material during the high-speed evaporation, and as a result, to stabilize the emission. In addition, even when the vapor pressure on the surface of the vapor phase material is greatly increased during the high-speed evaporation and the mean free path of hot electrons generated from the surface of the vapor phase material is shortened, one end of the electrode is located near the crucible. As a result, the hot electrons are sufficiently accelerated to maintain a high ionization ratio.

Further objects and advantages of the invention will be described in detail below, some of which will become apparent from the description, or will be understood by practice of the invention. In particular, it is possible to realize and obtain the objects and advantages of the present invention using the means pointed out in the appended claims and combinations thereof.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate the presently preferred embodiments of the invention and illustrate the principles of the invention together with the general description as set forth above and the detailed description of the preferred embodiments described below. I will.

Example 1

The invention is described in detail by way of example shown in FIG. The illustrated ion plating apparatus is used for the continuous ion plating process of the moving steel plate 11. Examples of preferred steel sheets 11 are low carbon steel sheets, stainless steel sheets, magnetic plates, Fe-Ni alloy sheets, Al sheets and Ti sheets. When the apparatus includes a suitable cooling apparatus, the apparatus can be applied to a polymer film or the like. Therefore, the substrate processed by the apparatus is not limited to a specific material. The apparatus includes a vacuum chamber 1 for maintaining a vacuum atmosphere. The vacuum chamber 1 has an inlet 14 and an outlet 15 thereon. The steel plate 11 extends and moves through the vacuum chamber 1. The inlet 14 and the outlet 15 have vacuum seals 14a and 15a for holding the vacuum while the steel plate 11 is moving. The vacuum seals 14a and 15a do not need to be used when the pressure in the vacuum chamber adjacent to the vacuum tank 1 is approximately equal to the pressure in the vacuum chamber 1.

Since the evacuation system 2 has to use a vacuum pump when the vacuum degree is less than 10 ^-3 Pa, it is not good in terms of economic efficiency, and when it exceeds 1 Pa, the exhaust system 2 has a bad effect on the ion plated film on which impurity gas molecules are formed. It is arranged above the vacuum chamber 1 to maintain a vacuum in the range of 1 Pa to 1 × 10 ⁻³ Pa. The crucible 3 is located below the vacuum chamber 1, and the vapor phase material 4 is stored in the crucible 3. The width of the crucible 3 is equal to or greater than the width of the steel plate 11. Examples of preferred vapor phase materials are Ni, Co, Fe, Ti, Zr, Ta, V and Hf. Other preferred vapor phase materials are Cr, Mn and the like. The electron gun 12 is provided on one side of the vacuum chamber 1. The electron beam 7 emitted from the electron gun 12 is deflected by the magnetic field generator 20, and the deflected electron beam is incident on the surface of the vapor phase material 4. The hood type electrode 9 is disposed between the crucible 3 and the steel plate 11. The lower part of the electrode 9 is open with respect to the crucible 3. The hooded electrode 9 is tapered narrower towards its top. At the top there is a hole 8. The hole 8 faces the steel plate 11. The width of the hole 8 is equal to or greater than the width of the steel sheet 11. The hole 16 is formed in the side portion of the electrode 9 so that the electron beam can pass through the hole 16. The material of the electrode 9 is preferably copper having a water cooling device to resist heat radiated from the crucible 3 and heat generated during ionization. The side holes 16 through which the electron beams pass are not essential. If the electron beam 7 is incident on the vapor phase material through the space between the electrode 9 and the crucible 3, the side holes 16 may be omitted. The positive terminal of the DC power source 13 is connected to the electrode 9, and the negative terminal of the DC power source 13 is connected to the crucible 13.

In the present device, the electron beam 7 is emitted from the electron gun 13 and is deflected by the magnetic field generator 20. The deflected electron beam 7 is incident on the crucible 3 located at the load core of the vacuum chamber 1 to heat and vaporize the vapor phase material 4. The output of the electron gun 12 is 40-600 Kw, for example. The vapor flow of the material converges into the hooded electrode 9. A positive voltage is applied to the electrode 9 and the vapor flow is ionized by the hot electrons generated from the vapor phase material 4. The voltage applied to the electrode 9 is, for example, in the range of 15 to 100 V, which is in the range of the ionization ratio. When the voltage applied to the hood type electrode is less than + 15V, the electron energy generated from the crucible cannot be increased until the main ionization potential of the metal is reached or higher, so that emission cannot occur, and exceeds + 100V. This is undesirable because unstable emission easily occurs between the electrode and the vacuum chamber. The ionized metal vapor is converged by the electrode 9 and deposited on the upper steel plate 11 through the upper hole 8 of the electrode 9, thereby forming a metal film on the steel plate 11. At this time, if the negative voltage is continuously applied to the steel sheet 11, the ionized vapor particles are accelerated toward the steel sheet 11, as a result can increase the adhesion of the film and improve the formability. When the voltage applied to the steel sheet 11 is higher than -50V, the energy of the steam particles is low to obtain ion plating having excellent adhesion and workability. If the voltage is lower than -100V, the temperature of the steel sheet is excessively high. It is preferable to keep the film in the range of -10 to -1,000V because the excessively increased or formed film can be sputtered.

In this apparatus, since the hood type electrode 9 is disposed above the crucible 3, it is possible to prevent the diffusion of the steam flow. In particular, it is possible to suppress the steam disturbance caused by the surface state of the vapor phase material during the high-speed evaporation, thereby to stabilize the emission. In addition, since the electrode 9 itself has the function of a hood, the structure can be simplified and stabilized for a long time. Since one end of the hooded electrode is located near the crucible, electrons can be sufficiently accelerated to maintain a high ionization rate even when the average free path of hot electrons generated from the surface of the vaporous material is shorter.

FIG. 2 is a graph showing the relationship between deposition rate and ionization ratio when using the apparatus shown in FIG. 1 and the apparatus shown in FIG. In this case, the vapor phase material is Ti, and the electron gun output varies in the range of 40 to 150 Kw. The voltage applied to the electrode is in the range of +30 to + 50V. The ionization ratio is calculated according to the current value flowing through the substrate. As can be clearly seen from FIG. 2, in the conventional method, as the deposition rate is increased, the ionization ratio is rapidly reduced. In contrast, according to the present invention, it is possible to maintain a higher ionization rate than the conventional method even during high-speed deposition.

Example 2

The ion plating apparatus shown in FIG. 3 is basically the same as the apparatus of FIG. 1 except for the following structure. That is, at least two crucibles 3a and 3b are arranged side by side in the lower part of the vacuum chamber 1 in the moving direction of the steel plate 11. Materials 4a and 4b which evaporate and contain the components of the alloy film formed by ion plating are resisted to crucibles 3a and 3b, respectively. Examples of suitable vapor phase materials 4a, 4b are Ti, Hf, Ta, W, V, Zr, Ni, Co, Fe, Cr, Al, Mn and Zn. Among these materials, refractory metals having a large number of hot electrons generated during heating and evaporation are suitable as vapor phase materials. However, vapor materials are not limited to these materials. Compounds other than metals (eg nitrides, oxides, or carbides) may be used depending on the desired alloy. The width of each crucible 3a, 3b is equal to or larger than the width of the steel plate 11.

The electron gun 11 is provided on one side of the vacuum chamber 1. The electron beam 7 is deflected toward the crucible by a deflection magnetic field generated by the magnetic field generator 20. The deflected electron beam is also emitted on the surface of the vapor phase material 4a, 4b. If the electron beam is emitted onto a plurality of crucibles, it preferably includes a Pierce type electron gun. It is also possible to use two or more guns, not limited to pierce type guns.

The hood electrode 9 is disposed between the crucibles 3a and 3b and the steel plate 11. The electrode 9 has the same cross-sectional area from the bottom hole to the top thereof. The electrode 9 has a side hole 16 and an upper hole 8 through which the electron beam 7 passes. The side hole 16 through which the electron beam 7 passes is not essential. For example, the side holes 16 alternately radiate the electron beam 7 onto vapor phase materials 4a and 4b through a space defined between the electrode 9 and the crucibles 3a and 3b. It may be omitted in the case of making it. The width of the upper hole 8 is equal to or larger than the width of the steel plate 11. The positive terminal of the DC power supply 13 is connected to the electrode 9, and the negative terminal of the DC power supply 13 is connected to the crucibles 3a and 3b. At the same time, the crucibles 3a and 3b are grounded.

In the present apparatus, the electron beam 7 is alternately radiated from the electron gun 12 onto the vapor phase materials 4a and 4b in the crucibles 3a and 3b located in the vacuum chamber 1 so that the vapor phase materials 4a, 4b) are evaporated simultaneously. The optimum scanning method is checked so that the film thickness distribution in the steel plate width direction is constant and the resulting film has the desired composition. The electron beam 7 is emitted in this scanning manner. The hot electrons generated by the vapor phase materials 4a and 4b are accelerated by the electrode applied with a positive voltage and collide with the vapor particles to ionize the vapor particles. At this time, the magnetic field for deflecting the electron beam increases the collision probability between the thermoelectrics and the vapor particles by trapping the hot electrons, thereby accelerating the ionization. The ionized vapor phase material is converged by the laryngeal electrode 9 and mixed in the gas phase, and the alloy vapor 30 is deposited on the steel plate 11. As a result, an alloy film is formed on the steel plate 11. At this time, since the ionized vapor particles are accelerated toward the steel sheet 11, a negative voltage is continuously applied to the steel sheet 11 to increase the adhesion of the film and improve the formability. Examples of the alloy of the alloy film formed on the steel sheet are preferably Ti-Cr, Ti-Ni, Ti-Al, Co-Cr and Zn-Mg. These alloys are alloys with poor adhesion and formability according to conventional methods.

In this apparatus, since the hood type electrode 9 is disposed above the crucibles 3a and 3b, the diffusion of the vapor flow can be prevented. In particular, the steam disturbance caused by the surface state of the vapor phase material during the evaporation at high speed can be suppressed, so that the emission can be stabilized. In addition, since the electrode 9 itself has a function of a hood, the structure can be simplified to provide stability for a long time. Since one end of the hooded electrode is located near the crucible, high ionization rates can be maintained because the electrons can be sufficiently accelerated even when the average free path of hot electrons generated from the surface of the vaporous material is shorter.

The ion plating results of the alloy film formed using the apparatus of FIG. 3 and the ion plating results of the comparative apparatus (FIG. 5) having two crucibles instead of one crucible will be described below. In this case, stainless steel was used as the steel sheet, and the vapor phase materials were Ti and Cr. The spinning time of the electron beams incident on Ti and Cr was measured according to the relationship with the alloy composition in the preliminary experiment. The voltage applied to the electrode 9 was set to be + 50V. The ionization ratio was calculated according to the deposition rate and the current flowing through the steel sheet during ion plating. A voltage of -100 V was applied to the steel sheet.

Ion plating was performed with an 80KW output from the electron gun in the apparatus of the present invention, with a deposition rate of 8 μm / min and ionization ratio of 35%. At this time, the deposition rate of the comparative device was about the same as that of the device of the present invention. However, the ionization rate of the comparative device was 8%.

When ion plating was performed at an output of 150 KW from the electron gun, the deposition rate of the apparatus of the present invention was 20 µm / min, and the ionization ratio was 28%. In contrast, the ionization ratio of the comparative device was reduced to 3%.

The test results of the adhesion and formability of the alloy film and the test results of the film formed by vacuum deposition are summarized in Table 1 below. As can be seen from Table 1, the alloy film formed by ion plating using the apparatus of the present invention has a higher ionization ratio by high speed deposition than the comparative example, and has better adhesion and better moldability.

In Example 2, the two crucibles are located in close proximity to each other. However, three or more crucibles may be placed in close proximity to one another.

Example 3

The ion plating apparatus shown in FIG. 4 is used to form a ceramic film on the steel plate surface. The vapor phase material 4 in the crucible 3 is one of the components constituting the ceramic film, for example, Ti, Hf, Ta, W, V, Zr, Ni, Co, Fe, Cr, Al, Mn and Zn It was. Among these materials, refractory metals with a large number of hot electrons generated during heating and evaporation are suitable as vapor phase materials. However, vapor materials are not limited to these materials. Compounds other than metals (eg nitrides, oxides, or carbides) may be used depending on the desired alloy. The number of crucibles is not limited to one. Multiple crucibles may be arranged in close proximity to one another and other materials may be evaporated simultaneously to form a ceramic film containing two or more metal components. The width of the crucible 3 is preferably equal to or larger than the width of the steel sheet.

The electron gun 12 is mounted on one side of the vacuum chamber 1. The electron beam 7 is deflected towards the crucible due to the deflection magnetic field generated by the magnetic field generator 20. The deflected electron beam is incident on the surface of the vapor phase material 4. The electron gun 12 preferably consists of a pierce type electron gun which operates safely even if the pressure in the vacuum chamber 1 increases as the reaction gas is supplied.

The hood electrode 9 is disposed between the crucible 3 and the steel plate 11. This structure is basically the same as that of FIG. Since the same reference numerals as those in FIG. 1 denote the same parts in FIG. 4, their detailed descriptions are omitted. This electrode 9 has inlets 17a and 17b formed at its sides and top to receive the reaction gas 18 so that the reaction gas 18 is supplied to the inside and top of the hooded electrode 9. It should be noted that At the end of each gas inlet 17a, 17b is a metal restrictor device. The water cooling device is arranged as needed. The gas pipe to the gas inlet is made of insulating material. The reaction gas 18 supplied to the gas inlets 17a and 17b contains one or more components constituting the desired ceramic. Examples of such components may be N 2, O 2, CH₄, C 2 H 2, H 2, and any gas may be determined depending on the desired ceramic film. The number of components is not limited to one. Two or more gases may be mixed to form a hybrid compound, for example, to form a film of carbon nitride.

In the device, the electron beam 7 from the electron gun 12 is incident on the vapor phase material 4 stored in the crucible 3 which is placed in the vacuum chamber 1 to evaporate the vapor phase material 4. The optimum scanning method of the electron beam 7 is selected so that the film thickness distribution of the width direction of a steel plate may become uniform. The electron beam 7 will radiate in this scanning manner. The hot electrons generated by the vapor phase material 4 are accelerated by the electrode 9 to which a positive voltage is applied, which collides with the vapor particles and the reaction gas to ionize the vapor particles and the reaction gas. At this time, the magnetic field for deflecting the electron beam increases the collision probability between the hot electrons, steam particles and the reaction gas, thereby accelerating ionization. The ionized vapor phase material and the reactant gas converge by the hood type electrode 9 and react with each other in the compound. At this time, this compound is deposited on the steel sheet 11. At this time, a negative voltage is continuously applied to the steel sheet 11 so that the ionized vapor particles accelerate the reaction gas in the direction of the steel sheet 11 to accelerate the reaction, increase the adhesion of the film and improve the formability. In this way, a compound film such as a ceramic film is formed on the steel sheet 11. Examples of film forming ceramics are TiN, TiC, CrN, TiAlN and TiCN. In the case of ion plating the ceramic film, the vacuum degree of the vacuum chamber is within the range of 10 Pa to 1 × 10 ^-3 Pa, and when the ceramic film is less than 1 × 10 ^-3 Pa, the amount of the reactant that can be introduced into the vacuum chamber is small. The ceramic having can be produced at high speed, and if it exceeds 10 Pa, since the electron beam is diffused by the atmospheric gas, the effect of generating the electron beam required to vaporize the material is low, and thus the rate at which the ion-plated film is also formed low.

In this apparatus, since the hood type electrode 9 is disposed above the crucible 3, it is possible to prevent the diffusion of the steam flow. In particular, it is possible to suppress the steam disturbance caused by the surface state of the vapor phase material during the high-speed evaporation to stabilize the emission. In addition, one end of the hooded electrode is located adjacent to the crucible, which allows to increase the vapor pressure and the pressure of the reaction gas on the surface of the vapor phase material during high-speed deposition, resulting in sufficient acceleration of the electrons and maintaining the ionization rate. The reaction between the vapor particles and the reactant gas can be accelerated even if the mean free stroke of the hot electrons generated by the deflection electrons of the vapor phase material and electron beam is shorter.

The ion plating results of the compound film formed using the apparatus shown in FIG. 4 and the ion plating results using the comparative apparatus (FIG. 5) in which the reaction gas inlet is further formed will be described below. Stainless steel was used as the steel sheet, Ti was used as the vapor phase material, and N 2 was used as the reaction gas. A voltage of +50 V was applied to the electrode 9 and a voltage of -100 V was applied to the steel sheet.

When performing ion plating in the apparatus shown in FIG. 4 due to the 120KW output from the electron gun and the electrode current 1,250A, a gold film, the only color for TiN, was formed at a deposition rate of 9 μm / min. Abnormal release did not occur during the deposition for 3 hours, and the release was stable. The resulting film was a dense structure with a smooth surface according to SEM (scanning electron microscopy) observation. The adhesion of the film in the scratch test was 7 kgf and the Vickers hardness was 2,200 kg / m 2.

On the other hand, when the film was formed using the comparative apparatus at the same deposition rate, the maximum electrode current was 750 A, and the film obtained was dark brown. SEM observation showed that the film was a brittle structure with a rough surface. The adhesion of the film in the scratch test was 3.5 kgf and the Vickers hardness was 850 kg / m 2. This film was inferior in quality to that of Example 3.

Those skilled in the art will readily be able to make additional advantages and modifications. Accordingly, the invention in its broader aspects is not limited to the specific details, representative apparatus, and illustrated embodiments described in the text. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

TABLE 1

IP: ion plating

VD: Vacuum Deposition

Adhesiveness was evaluated by the degree of peeling after each sample was bent at 180 ° and then subjected to a tape peeling test.

The workability was evaluated by the degree of cracking after Ot contact bending of each sample and SEM observation of the bent portion.

Claims (31)

Radiating a cell beam onto the ion plating material to heat and evaporate the ion plating material to generate a vapor flow of the ion plating material; Converging the vapor flow of the bimetallic material by a hood-like electrode; Applying a positive voltage to the hood type electrode to generate hot electrons from the ion plating material, and ionizing the vapor flow with the hot electrons; And depositing a converged and ionized vapor stream onto the surface of the steel sheet; Ion plating method on a steel plate, including. The method of claim 1 wherein the method is carried out in a vacuum atmosphere within the range of 1 to 1 × 10 ⁻³ Pa. The method of claim 1, wherein the voltage applied to the hooded electrode is in a range of +15 to + 100V. The method of claim 1, wherein a voltage in the range of -50 to -1,000V is applied to the steel sheet. A vacuum chamber for passing the steel sheet, having an inlet and an outlet through which the steel sheet to be ion plated is maintained in a vacuum atmosphere; A crucible located below the steel sheet in the vacuum chamber for containing an ion plating material; Spinning means for heating and evaporating the material by radiating an electron beam onto the plating material; Located above the crucible and below the steel plate in the vacuum chamber and having a hood-like shape to cover the top of the crucible, openings formed in the lower part of the electrode to accommodate heated and evaporated material and heated and evaporated And a DC power supply having a positive terminal and a negative terminal connected to the crucible. 6. The apparatus of claim 5 wherein the inlet and outlet of the vacuum chamber are sealed such that the interior of the vacuum chamber is maintained in a vacuum atmosphere during movement of the steel sheet. 6. The apparatus of claim 5, wherein the crucible has a width not less than the width of the steel sheet. An apparatus according to claim 5, wherein said spinning means is provided on the side of said vacuum chamber. 6. The apparatus of claim 5, wherein the electrode has a shape in which a diameter of the lower portion facing the crucible is larger and the tip is narrowed toward the upper portion. 6. The apparatus of claim 5, further comprising magnetic field generating means for deflecting the electron beam towards the crucible. Radiating an electron beam onto at least two different ion plating materials constituting a component of an alloy film to heat and evaporate the ion plating material to generate a vapor flow of the ion plating material; Converging the vapor flow of the ion plated material by a hooded electrode; Applying a positive voltage to the hood type electrode to simultaneously generate vapor particles of the at least two ion plating materials, and then ionizing the vapor phase particles; And forming an alloy film on the surface of the steel sheet by depositing condensed and ionized vapor particles on the surface of the steel sheet. The method of claim 11, wherein the method is performed in a vacuum atmosphere in the range of 1 to 1 × 10 ⁻³ Pa. 12. The method of claim 11 wherein the voltage applied to the hooded electrode is in a range of +15 to + 100V. The method of claim 11, wherein a voltage in the range of -50 to -1,000V is applied to the steel sheet. A vacuum chamber for passing the steel sheet, having an inlet and an outlet through which the steel sheet to be ion plated is maintained in a vacuum atmosphere; At least two crucibles located below the steel sheet in the vacuum chamber for containing an ion plating material constituting a component of an alloy film formed on the steel sheet; Spinning means for heating and evaporating the material by radiating an electron beam onto the material; It is located above the crucible and below the steel plate in the vacuum chamber, and has a hood shape to cover the top of the crucible, and has holes formed in the lower part of the electrode to accommodate the heated and evaporated material and the heated and evaporated material. An electrode having a hole formed in an upper portion of the electrode to discharge toward the steel sheet; And a DC power supply having a positive terminal connected to the electrode and a negative terminal connected to the crucible. The apparatus of claim 15 wherein said vacuum chamber is maintained in a vacuum atmosphere within the range of 1 to 1 × 10 ⁻³ Pa. The apparatus of claim 15 wherein the inlet and outlet of the vacuum chamber are sealed to maintain in the vacuum atmosphere. The apparatus of claim 15, wherein each crucible has a width no less than the width of the steel sheet. The apparatus according to claim 15, wherein said spinning means is provided on the side of said vacuum chamber. The apparatus of claim 15, wherein the electrode has a shape in which a diameter of a lower portion facing the crucible is larger and an end thereof narrows toward an upper portion of the crucible. 16. The apparatus of claim 15 further comprising magnetic field generating means for deflecting the electron beam towards the crucible. Radiating an electron beam onto an ion plated material to heat and evaporate the ion plated material to generate a vapor flow of the ion plated material; Converging the vapor particles of the bimetallic material by a hooded electrode; Supplying a reaction gas into the hood type electrode; Applying a positive voltage to the hood electrode to ionize vapor particles and a reactor body; And depositing ionized vapor particles and ionized reactant gases onto the steel sheet to form a ceramic film on the steel sheet. The method of claim 22, wherein the method is performed in a vacuum atmosphere within the range of 1 to 1 × 10 ⁻³ Pa. 23. The method of claim 22 wherein the voltage applied to the electrode is in the range of +15 to + 100V. 23. The method of claim 22, wherein a voltage in the range of -50 to -1,000V is applied to the steel sheet. A vacuum chamber for passing the steel sheet, having an inlet and an outlet through which the steel sheet to be ion plated is maintained in a vacuum atmosphere; A crucible located below the steel sheet in the vacuum chamber for containing an ion plating material constituting a component of an alloy film formed on the steel sheet; Spinning means for heating and evaporating the material by radiating an electron beam onto the material; It is located above the crucible and below the steel plate in the vacuum chamber, and has a hood shape to cover the top of the crucible, and has holes formed in the lower part of the electrode to accommodate the heated and evaporated material and the heated and evaporated material. An electrode having a hole formed in the upper portion of the electrode for discharging toward the steel sheet, and having a reaction gas inlet for the reaction gas; And a DC power supply having a positive terminal connected to the electrode and a negative terminal connected to the crucible. 27. The apparatus of claim 26, wherein the vacuum chamber is maintained in a vacuum atmosphere within the range of 10 to 1 x 10 < ^-3 > Pa. 27. The apparatus of claim 26, wherein the inlet and outlet of the vacuum chamber are sealed such that the interior of the vacuum chamber is maintained in the atmosphere. 27. The apparatus of claim 26, wherein the crucible has a width no less than the width of the steel sheet. 27. An apparatus according to claim 26, wherein said spinning means is provided on the side of said vacuum chamber. 27. The apparatus of claim 26, further comprising magnetic field generating means for deflecting the electron beam towards the crucible.