KR940016735A - Method for manufacturing metal wiring of semiconductor device - Google Patents
Method for manufacturing metal wiring of semiconductor device Download PDFInfo
- Publication number
- KR940016735A KR940016735A KR1019920027327A KR920027327A KR940016735A KR 940016735 A KR940016735 A KR 940016735A KR 1019920027327 A KR1019920027327 A KR 1019920027327A KR 920027327 A KR920027327 A KR 920027327A KR 940016735 A KR940016735 A KR 940016735A
- Authority
- KR
- South Korea
- Prior art keywords
- metal wiring
- forming
- semiconductor device
- manufacturing
- cell
- Prior art date
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
본 발명은 셀(Cell)과 주변회로(Periphery)에 서로 다른 단차를 갖는 반도체 소자의 금속 배선 제조 방법에 있어서, 셀과 동일하게 주변회로에 단차유발층(9a, 9b, 10)을 형성하는 제 1 단계, 상기 제 1 단계후에 전체 구조 상부에 절연막(11)을 도포하고 콘택홀을 형성하여 플러그(13)를 형성한 다음에 금속배선층(14)을 형성하는 제 2 단계를 포함하여 이루어지는 것을 특징으로 하는 반도체 소자의 금속 배선 제조 방법에 관한 것이다.The present invention provides a method for manufacturing a metal wiring of a semiconductor device having different steps in a cell and a peripheral circuit, wherein the step-inducing layers 9a, 9b, and 10 are formed in the peripheral circuit in the same manner as the cell. And a second step of forming the plug 13 by applying the insulating film 11 over the entire structure after the first step, forming a contact hole, and then forming the metallization layer 14. It relates to a metal wiring manufacturing method of a semiconductor device.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제 4 도는 본 발명에 따를 워드라인 스트랩핑 평면도, 제 5 도는 제 4 도의 a-a'단면도, 제 6 도는 제 4 도 b-b' 단면도.4 is a plan view of a word line strapping according to the present invention, FIG. 5 is a cross-sectional view taken along line a-a 'of FIG. 4, and FIG.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920027327A KR940016735A (en) | 1992-12-31 | 1992-12-31 | Method for manufacturing metal wiring of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920027327A KR940016735A (en) | 1992-12-31 | 1992-12-31 | Method for manufacturing metal wiring of semiconductor device |
Publications (1)
Publication Number | Publication Date |
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KR940016735A true KR940016735A (en) | 1994-07-25 |
Family
ID=67220082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920027327A KR940016735A (en) | 1992-12-31 | 1992-12-31 | Method for manufacturing metal wiring of semiconductor device |
Country Status (1)
Country | Link |
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KR (1) | KR940016735A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100748821B1 (en) * | 1997-12-18 | 2007-10-16 | 엘피다 메모리, 아이엔씨. | Semiconductor integrated circuit device and process for manufacturing the same |
-
1992
- 1992-12-31 KR KR1019920027327A patent/KR940016735A/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100748821B1 (en) * | 1997-12-18 | 2007-10-16 | 엘피다 메모리, 아이엔씨. | Semiconductor integrated circuit device and process for manufacturing the same |
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