KR940012680A - Lead frame for plastic optical device package and package manufacturing method using same - Google Patents

Lead frame for plastic optical device package and package manufacturing method using same Download PDF

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Publication number
KR940012680A
KR940012680A KR1019920021982A KR920021982A KR940012680A KR 940012680 A KR940012680 A KR 940012680A KR 1019920021982 A KR1019920021982 A KR 1019920021982A KR 920021982 A KR920021982 A KR 920021982A KR 940012680 A KR940012680 A KR 940012680A
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KR
South Korea
Prior art keywords
lead
package
lead frame
optical device
manufacturing
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Application number
KR1019920021982A
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Korean (ko)
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KR950008852B1 (en
Inventor
허기록
Original Assignee
문정환
금성일렉트론 주식회사
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Priority to KR1019920021982A priority Critical patent/KR950008852B1/en
Publication of KR940012680A publication Critical patent/KR940012680A/en
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Publication of KR950008852B1 publication Critical patent/KR950008852B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명은 플리스틱 광학소자 패키지용 리드프레임 및 그를 이용한 패키지 제조방법에 관한 것으로, 패키지 제조공정을 보다 간편, 용이하게 하기 위하여 리드프레임을 구성함에 있어서 리드프레임의 다이패들을 윈도우형패들 프레임과 그 프레임의 상, 하부에 소정높이로 각각 부착된 글래스 리드탑재용 절연필름 및 광학소자 부착용 절연필름으로 형성하여, 이 다이패들의 하부 필름에는 광학 소자를 부착함과 아울러 상부 필름에는 글래스 리드를 탑재하여 다이본딩 공정을 행한후, 다이어 본딩공정을 행하고, 몰딩공정을 행한다음 통상적인 트림/포밍공정을 행함으로써 플라스틱 광학소자 패키지를 제조하는 패키지 제조방법을 제공함을 특징으로 하고 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for a plastic optical device package and a method for manufacturing a package using the same. It is formed of an insulating film for mounting a glass lead and an insulating film for attaching an optical element, respectively attached to upper and lower portions of the frame, and an optical element is attached to the lower film of the die paddle and a glass lead is mounted on the upper film After the die bonding step is performed, the die bonding step is carried out, the molding step is carried out, and then a normal trim / forming process is performed to provide a package manufacturing method for manufacturing a plastic optical device package.

이와같이된 본 발명의 리드프레임 및 패키지 제조방법에 의하면, 글래스 리드의 탑재가 보다 정확하면서도 간편하게 이루어지는등 전체 패키지 제조공정이 간편, 용이 해지는 효과가 있고, 광학적 특성이 개선 될뿐만아니라 보다 향상된 신뢰성을 갖는 패키지를 제작할 수 있는등의 효과가 있다.According to the lead frame and package manufacturing method of the present invention as described above, the entire package manufacturing process is simple and easy, such as the mounting of the glass lead is more precise and simple, and the optical characteristics are improved and the reliability is improved. It can be used to produce a package.

Description

플리스틱 광학소자 패키지용 리드프레임 및 그를 이용한 패키지 제조방법Lead frame for plastic optical device package and package manufacturing method using same

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도 및 제4도는 본 발명에 의한 플라스틱 광학소자 패키지용 리드프레임의 구조를 보인 도면으로서,3 and 4 are views showing the structure of a lead frame for a plastic optical device package according to the present invention,

제3도는 평면도이고,3 is a plan view,

제4도는 제3도의 A-A′선 단면도.4 is a cross-sectional view taken along the line A-A 'of FIG.

제5도 및 제6도는 본 발명 리드프레임을 이용하여 제작한 플라스틱 광학소자 패키지를 도시한 것으로,5 and 6 illustrate a plastic optical device package manufactured using the lead frame of the present invention.

제5도는 리드프레임의 패들에 소자가 본딩되어 와이어 본딩된 상태를 보인 평면도이고,5 is a plan view showing a state in which a device is wire-bonded to a paddle of a lead frame,

제6도는 본 발명 플라스틱 광학소자 패키지를 보인 종단측면도.Figure 6 is a longitudinal side view showing the plastic optical device package of the present invention.

Claims (4)

사이드레일(11)(11′)의 내측에 광학소자(12)가 부착되는 다이패들(13)이 타이바(14)(14′)에 의하여 지지되고, 상기 다이패들(13)의 양측에 인접하게는 상기 소자(12)에 와이어 본딩되는 다수개의 인너리드(15)가 배열된 반도체 패키지용 리드프레임에 있어서, 상기 다이패들(13)이 일정한 폭을 갖는 윈도우형 패들 프레임(13a)의 상, 하부에 소정높이의 글래스리드 탑재용 절연필름(13b)과 광학소자 부착용 절연필름(13c)를 각각 부착한 구조를 갖는 것을 특징으로 하는 플라스틱 광학소자 패키지용 리드프레임.The die paddle 13 to which the optical element 12 is attached to the inside of the side rails 11 and 11 'is supported by the tie bars 14 and 14', and both sides of the die paddle 13 are supported. In a lead frame for a semiconductor package in which a plurality of inner leads 15 are wire bonded to the element 12 adjacent to the window paddle frame 13a, the die paddle 13 has a constant width. A lead frame for a plastic optical element package having a structure in which a glass lid mounting insulating film (13b) and an optical device attachment insulating film (13c) are attached to upper and lower portions thereof, respectively. 제1항에 있어서, 상기 다이패들(13)은 그 양측에 배열된 인너리드(15)의 위치보다 상측에 위치하는 업-셋구조로 형성됨을 특징으로 하는 플라스틱 광학소자 패키지용 리드프레임.The lead frame of claim 1, wherein the die paddle (13) is formed in an up-set structure located above the position of the inner lead (15) arranged at both sides thereof. 제1항에 있어서, 상기 절연필름(13b)(13c)은 열경화성 수지 또는 열가소성 수지 계열인것을 특징으로 하는 플라스틱 광학소자 패키지용 리드프레임.The lead frame for a plastic optical device package according to claim 1, wherein the insulation films (13b) and (13c) are thermosetting resins or thermoplastic resins. 플라스틱 광학소자 패키지를 제조하는 방법에 있어서, 리드프레임의 다이패들(13)을 구성하는 윈도우형 패들 프레임(13a)의 하부 절연필름(13c)에 광학소자(12)를 부착함과 아울러 상부 절연필름(13b)에 글래스리드(16)를 탑재하여 다이패들(13)에 광학소자(12)와 글래스리드(16)를 본딩하는 단계와, 상기 광학소자(12)와 리드프레임의 인너리드(15)를 금속와이어(17)를 이용하여 전기적으로 접속 연결시키는 와이어 본딩단계와, 상기 광학소자(12)와 리드프레임의 인너리드(15)를 포함하는 일정면적을 플라스틱 몰드수지(18)로 성형하여 패키지 몸체를 형성하는 몰딩단계 및 통상적인 트림/포밍 단계로 구성함을 특징으로 하는 플라스틱 광학소자 패키지 제조방법.In the method of manufacturing a plastic optical device package, the optical device 12 is attached to the lower insulating film (13c) of the window paddle frame (13a) constituting the die paddle 13 of the lead frame as well as the upper insulation Bonding the optical lead 12 and the glass lead 16 to the die paddle 13 by mounting the glass lead 16 on the film 13b, and the inner lead of the optical element 12 and the lead frame ( The wire bonding step of electrically connecting 15 to the metal wire 17 and forming a predetermined area including the optical element 12 and the inner lead 15 of the lead frame with a plastic mold resin 18. The plastic optical device package manufacturing method comprising a molding step of forming a package body and a conventional trim / forming step. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920021982A 1992-11-21 1992-11-21 Pccd type leadframe and method KR950008852B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920021982A KR950008852B1 (en) 1992-11-21 1992-11-21 Pccd type leadframe and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920021982A KR950008852B1 (en) 1992-11-21 1992-11-21 Pccd type leadframe and method

Publications (2)

Publication Number Publication Date
KR940012680A true KR940012680A (en) 1994-06-24
KR950008852B1 KR950008852B1 (en) 1995-08-08

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KR1019920021982A KR950008852B1 (en) 1992-11-21 1992-11-21 Pccd type leadframe and method

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KR950008852B1 (en) 1995-08-08

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