KR940010295A - Power module - Google Patents

Power module Download PDF

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Publication number
KR940010295A
KR940010295A KR1019920018783A KR920018783A KR940010295A KR 940010295 A KR940010295 A KR 940010295A KR 1019920018783 A KR1019920018783 A KR 1019920018783A KR 920018783 A KR920018783 A KR 920018783A KR 940010295 A KR940010295 A KR 940010295A
Authority
KR
South Korea
Prior art keywords
power module
terminal
holder
wiring pattern
module according
Prior art date
Application number
KR1019920018783A
Other languages
Korean (ko)
Other versions
KR100216988B1 (en
Inventor
권홍규
전기영
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019920018783A priority Critical patent/KR100216988B1/en
Publication of KR940010295A publication Critical patent/KR940010295A/en
Application granted granted Critical
Publication of KR100216988B1 publication Critical patent/KR100216988B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

파워 트랜지스터등의 반도체 장치가 상부에 탑재되며 배선 패턴이 형성되어 있는 기판과, 상기 배선 패턴과 연결되어 접촉 잭으로 사용되는 단자의 상기 단자가 탑재되는 홀더를 구비하는 파워 모듈에서 상기 단자를 소정 지름의 와이어를 절단 절곡하여 형성하고, 상기 홀더를 사각틀채형상으로 형성하고 그 외측벽에 가이드홈을 형성하여 상기 단자를 탑재하였다. 또한 상기 기판의 배선 패턴은 상기 단자가 접속되는 부분이 상기 기판의 주변부에 위치하도록 형성하였다.A semiconductor module such as a power transistor is mounted on the upper portion of the power module and a substrate having a wiring pattern formed thereon, and the terminal is connected to the wiring pattern and a holder on which the terminal of the terminal used as a contact jack is mounted. The wire was cut and formed, the holder was formed in a rectangular frame shape, and a guide groove was formed on the outer wall thereof to mount the terminal. In addition, the wiring pattern of the substrate was formed such that the portion to which the terminal is connected is located at the periphery of the substrate.

따라서, 파워 모듈의 단자의 형성 공정이 간단하며, 상기 단자들이 홀더의 외곽에만 위치하므로 파워 모듈 제조 공정시 홀더의 접촉 공정을 다양화할 수 있고, 상기 배선패턴과 단자의 접착의 여부를 육안으로 확인 가능하여 파워 모듈의 신뢰성을 향상시킬 수 있다.Therefore, the process of forming the terminal of the power module is simple, and since the terminals are located only outside the holder, it is possible to diversify the contact process of the holder during the power module manufacturing process, and visually confirm whether the wiring pattern and the terminal are bonded. It is possible to improve the reliability of the power module.

Description

파워 모듈Power module

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제6도는 이 발명에 따른 파워 모듈의 단자의 정면도,6 is a front view of a terminal of a power module according to the present invention,

제7도는 이 발명에 따른 파워 모듈의 단자의 측면도.7 is a side view of a terminal of a power module according to the present invention.

제8도는 이 발명에 따른 파워 모듈의 홀더의 사시도,8 is a perspective view of a holder of a power module according to the present invention,

제9도는 이 발명에 따른 파워 모듈의 홀더의 평면도,9 is a plan view of a holder of a power module according to the present invention,

제10도는 이 발명에 따른 파워 모듈의 개략도이다.10 is a schematic diagram of a power module according to this invention.

Claims (9)

상부에 반도체 장치들이 탑재되고 배선 패턴이 형성되어 있는 기판과, 상기 배선패턴 상에 접착되어 외부로 돌출되는 단자들과, 상기 단자들이 탑재되는 홀더와, 상기 기판의 하부에 장착되는 히트싱크를 구비하는 파워모듈에 있어서, 상기 배선패턴의 단자와 연결되는 부분들이 주변부에 형성되어 있는 기판과, 소정지름의 와이어를 절곡하여 형성되어 있으며 외부와 연결되는 상단부와 상기 배선패턴상에 탑재되는 하단부와 홀더에 탑재되는 중단부로 구성되어 있는 단자와, 틀체 형상의 외측 둘레에 상기 단자를 탑재하기 위한 탑재부가 형성되어 있는 홀더를 구비하는 파워 모듈.A substrate on which semiconductor devices are mounted and a wiring pattern is formed, terminals bonded to the wiring pattern to protrude to the outside, a holder on which the terminals are mounted, and a heat sink mounted on the bottom of the substrate In the power module, the part connected to the terminal of the wiring pattern is formed by bending a wire having a predetermined diameter, the upper end connected to the outside and the lower end and the holder mounted on the wiring pattern are formed by bending a wire having a predetermined diameter. A power module having a terminal comprising a stopping portion mounted on the holder and a holder having a mounting portion for mounting the terminal on an outer circumference of the frame shape. 제1항에 있어서, 상기 기판이 세라믹 재질로 형성되어 있는 파워 모듈.The power module of claim 1, wherein the substrate is formed of a ceramic material. 제1항에 있어서, 상기 단차는 지름은 상기 홀더를 지탱할 수 있는 정도의 크기인 파워 모듈.The power module of claim 1, wherein the step diameter is large enough to support the holder. 제1항에 있어서, 상기 단자가 Cu, Ni, Fe 및 그 합금들로 이루어지는 군에서 임의로 선택되는 도전 물질로 형성되어 있는 파워 모듈.A power module according to claim 1, wherein said terminal is formed of a conductive material arbitrarily selected from the group consisting of Cu, Ni, Fe, and alloys thereof. 제1항에 있어서, 상기 단자의 상단부와 배선패턴상에 접착되는 부분을 제외한 부분이 절연코팅되어 있는 파워 모듈.The power module according to claim 1, wherein portions other than the upper end portion of the terminal and the portion bonded to the wiring pattern are insulated. 제1항에 있어서, 상기 단자의 하단부가 열팽창을 고려하여 S자 형상으로 굴곡되어 있는 파워 모듈.The power module according to claim 1, wherein the lower end of the terminal is bent in an S shape in consideration of thermal expansion. 제1항에 있어서, 상기 홀더의 탑재부가 반원 형상의 홈으로 형성되어 있는 파워 모듈.The power module according to claim 1, wherein the mounting portion of the holder is formed of a semicircular groove. 제1항에 있어서, 상기 단자가 상기 홀더의 탑재부에 접착제로 접착되어 탑재되는 파워 모듈.The power module according to claim 1, wherein the terminal is mounted by adhesive bonding to a mounting portion of the holder. 제1항에 있어서, 상기 홀더의 탑재부가 상기 단자의 지름과 같거나 큰 정도의 지름을 갖는 관통구로 형성되어 있는 파워 모듈.The power module according to claim 1, wherein the mounting portion of the holder is formed of a through hole having a diameter equal to or larger than the diameter of the terminal. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920018783A 1992-10-13 1992-10-13 Power module KR100216988B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920018783A KR100216988B1 (en) 1992-10-13 1992-10-13 Power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920018783A KR100216988B1 (en) 1992-10-13 1992-10-13 Power module

Publications (2)

Publication Number Publication Date
KR940010295A true KR940010295A (en) 1994-05-24
KR100216988B1 KR100216988B1 (en) 1999-09-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920018783A KR100216988B1 (en) 1992-10-13 1992-10-13 Power module

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KR (1) KR100216988B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006088393A3 (en) * 2005-02-17 2007-01-11 Rdinnovation Aps Method for producing an anti-cancer agent

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101430831B1 (en) 2012-11-28 2014-08-18 주식회사 케이이씨 Power Module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006088393A3 (en) * 2005-02-17 2007-01-11 Rdinnovation Aps Method for producing an anti-cancer agent

Also Published As

Publication number Publication date
KR100216988B1 (en) 1999-09-01

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