KR930023424A - Rubber and / or plastic moldings with damping and thermal conductivity - Google Patents
Rubber and / or plastic moldings with damping and thermal conductivity Download PDFInfo
- Publication number
- KR930023424A KR930023424A KR1019920026169A KR920026169A KR930023424A KR 930023424 A KR930023424 A KR 930023424A KR 1019920026169 A KR1019920026169 A KR 1019920026169A KR 920026169 A KR920026169 A KR 920026169A KR 930023424 A KR930023424 A KR 930023424A
- Authority
- KR
- South Korea
- Prior art keywords
- rubber
- filler
- plastic
- thermal conductivity
- metal
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/10—Properties of the layers or laminate having particular acoustical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Vibration Prevention Devices (AREA)
- Laminated Bodies (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
본 발명은 기어펌프, 컴프렛서, 에어콘 리시버, 모터리트렉타등의 진동체의 카바 케이스에 내재시켜 사용하며,특히 에어콘 실외기에 내장된 리트렉타, 모터등 발열진동페를 카바 케이스에 고정할 때 양자의 간극에 충전하여 사용하는 진동을 제진할 수 있을 뿐아니라 열전도성이 뛰어난 고무 및/또는 플라스틱 성형물에 관한 것이다.The present invention is used in the cover case of the vibrating body, such as gear pump, compressor, air conditioner receiver, motor retractor, and in particular, the heating vibration pen such as a retractor, motor built in the air conditioner outdoor unit is fixed to the cover case The present invention relates to a rubber and / or plastic molding having excellent thermal conductivity, as well as vibration damping, which fills the gap between them.
고무 및/또는 플라스틱 기재로 하는 중합체 (2) 및, 금속 분말(3)과 금속산화물, 금속질화물 및 이들 가운데 어느 하나를 함유하는 충전제로 이루어진 군으로부터 선택된 1종 이상의 충전제와, 결정성 실리카, 탄화규소, 산화규소, 및 이들 가운데 어느 하나를 함유하는 충전제로 이루어진 군으로 부터 선택된 1종이상의 충전제로 된 충전제(4)로 구성된 배합물 성형한 성형물(1)을 수득한다.At least one filler selected from the group consisting of polymers based on rubber and / or plastics (2), and metal powders (3) and fillers containing any one of metal oxides, metal nitrides and crystalline silica, carbonization A compound-molded molding (1) consisting of a filler (4) of at least one filler selected from the group consisting of silicon, silicon oxide, and a filler containing any one of these is obtained.
손실탄성율이 2×102n㎏/㎠ 이상이고, 열전도율이 0.4Kcal/m.h.℃이상인, 제진성 및 열전도성을 보율하고, 진동발열체의 진동과 발열을 방지하는 효과를 본 발명의 성형물은 발휘한다.The molded article of the present invention exhibits an effect of controlling vibration damping and heat generation of the vibration heating element, having a loss elastic modulus of 2 × 10 2n kg / cm 2 or more and a thermal conductivity of 0.4 Kcal / mh ° C. or more.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명의 실시예 하나를 보이는 블럭상(Blook form)성형물의 사시도이고, 제2도는 본 발명의 또 다른 실시예 하나를 보이는 시-트(sheet) 또는 테이프상 성형물의 사시도이고, 제3도는 제2도의 것에 금속띠를 내재 시킨 것을 보이는 단면도이다.1 is a perspective view of a block form molding showing one embodiment of the present invention, and FIG. 2 is a perspective view of a sheet or tape shaped molding showing another embodiment of the present invention. 3 is a cross-sectional view showing a metal band embedded in FIG. 2.
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP140080/92 | 1992-05-01 | ||
JP14008092A JP3325600B2 (en) | 1992-05-01 | 1992-05-01 | Rubber and / or plastic moldings with vibration damping and thermal conductivity |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930023424A true KR930023424A (en) | 1993-12-18 |
KR100251658B1 KR100251658B1 (en) | 2000-04-15 |
Family
ID=15260501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920026169A KR100251658B1 (en) | 1992-05-01 | 1992-12-29 | Rubber or plastic mold having anti-damping and thermal conductive properties |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3325600B2 (en) |
KR (1) | KR100251658B1 (en) |
TW (1) | TW228534B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0868441A (en) * | 1994-08-29 | 1996-03-12 | Tokai Rubber Ind Ltd | Dynamic damper, material for molding thereof and manufacture thereof |
JP4369594B2 (en) * | 2000-04-28 | 2009-11-25 | 古河電気工業株式会社 | Thermally conductive molded body |
KR100782259B1 (en) * | 2000-11-16 | 2007-12-04 | 엘지전자 주식회사 | EMI shielding heat sink using carbon nanotube and manufacturing method thereof |
KR100422570B1 (en) * | 2001-10-20 | 2004-03-11 | 최재영 | Resin Composition for Heat Sink and a Method of Manufacturing Sheets for Heat Sink Using the Same |
US6777026B2 (en) * | 2002-10-07 | 2004-08-17 | Lord Corporation | Flexible emissive coatings for elastomer substrates |
CA2477740A1 (en) * | 2002-03-08 | 2003-09-18 | Lord Corporation | Flexible coatings for elastomer substrates |
KR20040009219A (en) * | 2002-07-19 | 2004-01-31 | 최명부 | The Production of Functional Foor Materials Able to prevent Harmful Electromagnetic Waves |
KR100760128B1 (en) | 2005-10-05 | 2007-09-18 | 엘지전자 주식회사 | Ceiling type air conditioner |
DE102007049973A1 (en) * | 2007-10-18 | 2009-04-23 | Robert Bosch Gmbh | Heating device for liquid fuels and the like |
JP2015033808A (en) * | 2013-08-09 | 2015-02-19 | 日東電工株式会社 | Adhesive damping material |
JP6324801B2 (en) * | 2014-05-12 | 2018-05-16 | ブリヂストンケービージー株式会社 | Vibration and heat dissipation composite structure |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6233888A (en) * | 1985-08-01 | 1987-02-13 | Nippon Mining Co Ltd | Flexible composite material |
-
1992
- 1992-05-01 JP JP14008092A patent/JP3325600B2/en not_active Expired - Lifetime
- 1992-12-11 TW TW081109942A patent/TW228534B/zh not_active IP Right Cessation
- 1992-12-29 KR KR1019920026169A patent/KR100251658B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3325600B2 (en) | 2002-09-17 |
JPH05310993A (en) | 1993-11-22 |
TW228534B (en) | 1994-08-21 |
KR100251658B1 (en) | 2000-04-15 |
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