KR930023424A - Rubber and / or plastic moldings with damping and thermal conductivity - Google Patents

Rubber and / or plastic moldings with damping and thermal conductivity Download PDF

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Publication number
KR930023424A
KR930023424A KR1019920026169A KR920026169A KR930023424A KR 930023424 A KR930023424 A KR 930023424A KR 1019920026169 A KR1019920026169 A KR 1019920026169A KR 920026169 A KR920026169 A KR 920026169A KR 930023424 A KR930023424 A KR 930023424A
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South Korea
Prior art keywords
rubber
filler
plastic
thermal conductivity
metal
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KR1019920026169A
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Korean (ko)
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KR100251658B1 (en
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요네오 히라카와
가지오 마츠오카
히데히사 하마구치
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스미모토 미츠히로
가부시키가이샤 교오와
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/10—Properties of the layers or laminate having particular acoustical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Vibration Prevention Devices (AREA)
  • Laminated Bodies (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

본 발명은 기어펌프, 컴프렛서, 에어콘 리시버, 모터리트렉타등의 진동체의 카바 케이스에 내재시켜 사용하며,특히 에어콘 실외기에 내장된 리트렉타, 모터등 발열진동페를 카바 케이스에 고정할 때 양자의 간극에 충전하여 사용하는 진동을 제진할 수 있을 뿐아니라 열전도성이 뛰어난 고무 및/또는 플라스틱 성형물에 관한 것이다.The present invention is used in the cover case of the vibrating body, such as gear pump, compressor, air conditioner receiver, motor retractor, and in particular, the heating vibration pen such as a retractor, motor built in the air conditioner outdoor unit is fixed to the cover case The present invention relates to a rubber and / or plastic molding having excellent thermal conductivity, as well as vibration damping, which fills the gap between them.

고무 및/또는 플라스틱 기재로 하는 중합체 (2) 및, 금속 분말(3)과 금속산화물, 금속질화물 및 이들 가운데 어느 하나를 함유하는 충전제로 이루어진 군으로부터 선택된 1종 이상의 충전제와, 결정성 실리카, 탄화규소, 산화규소, 및 이들 가운데 어느 하나를 함유하는 충전제로 이루어진 군으로 부터 선택된 1종이상의 충전제로 된 충전제(4)로 구성된 배합물 성형한 성형물(1)을 수득한다.At least one filler selected from the group consisting of polymers based on rubber and / or plastics (2), and metal powders (3) and fillers containing any one of metal oxides, metal nitrides and crystalline silica, carbonization A compound-molded molding (1) consisting of a filler (4) of at least one filler selected from the group consisting of silicon, silicon oxide, and a filler containing any one of these is obtained.

손실탄성율이 2×102n㎏/㎠ 이상이고, 열전도율이 0.4Kcal/m.h.℃이상인, 제진성 및 열전도성을 보율하고, 진동발열체의 진동과 발열을 방지하는 효과를 본 발명의 성형물은 발휘한다.The molded article of the present invention exhibits an effect of controlling vibration damping and heat generation of the vibration heating element, having a loss elastic modulus of 2 × 10 2n kg / cm 2 or more and a thermal conductivity of 0.4 Kcal / mh ° C. or more.

Description

제진성(制振性) 및 열전도성을 가진 고무 및/또는 플라스틱 성형물Rubber and / or plastic moldings with damping and thermal conductivity

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 실시예 하나를 보이는 블럭상(Blook form)성형물의 사시도이고, 제2도는 본 발명의 또 다른 실시예 하나를 보이는 시－트(sheet) 또는 테이프상 성형물의 사시도이고, 제3도는 제2도의 것에 금속띠를 내재 시킨 것을 보이는 단면도이다.1 is a perspective view of a block form molding showing one embodiment of the present invention, and FIG. 2 is a perspective view of a sheet or tape shaped molding showing another embodiment of the present invention. 3 is a cross-sectional view showing a metal band embedded in FIG. 2.

Claims (8)

고무 및/또는 플라스틱 기재로 하는 중합체에 금속 분말과 (a)금속산화물, 금속질화물 및 이들 가운데 어느 하나를 함유하는 충전제로 이루어진 군으로부터 선택된 1종 이상의 충전제 및 (b)결정성 실리카, 탄화규소, 산화규소, 및 이들 가운데 어느 하나를 함유하는 충전제로 이루어진 군으로부터 선택된 1종이상의 충전제를 배합하여 성형시킨 성형물로서, 손실 탄성율이 2×102n㎏/㎠ 이상이고, 열전도율이 0.4Kcal/m.h.℃이상인, 제진성 및 열전도성을 가짐을 특징으로 하는 제진성 및 열전도성이 있는 고무 및/또는 플라스틱 성형물At least one filler selected from the group consisting of metal powders and (a) metal oxides, metal nitrides and fillers containing any one of them in a polymer based on rubber and / or plastics, and (b) crystalline silica, silicon carbide, A molded article formed by blending and molding one or more fillers selected from the group consisting of silicon oxide and a filler containing any one of them, wherein the loss modulus is 2 × 10 2n kg / cm 2 or more and the thermal conductivity is 0.4 Kcal / mh ° C. or more. , Thermally conductive rubber and / or plastic moldings characterized in that they have a damping and thermal conductivity 제1항에 있어서, 금속분말과 함께 배합하는 충전제가 열전도율이 0.5Kcal/m.h.℃이상의 열전도성을 가짐을 특징으로 하는 제진성 및 열전도성이 있는 고무 및/또는 플라스틱 성형물.The rubber and / or plastic molding having vibration damping and heat conductivity according to claim 1, wherein the filler blended with the metal powder has a thermal conductivity of 0.5 Kcal / m.h. ° C or higher. 제1항 또는 제2항에 있어서, 금속분말과 함께 배합하는 열전도성이 있는 충전제의 양이 고무 및/또는 플라스틱 100중량부에 대하여 총량으로 50 내지 200중량부 임을 특징으로 하는 재진성 및 열전도성이 있는 고무 및/또는 플라스틱 성형물.The retardancy and thermal conductivity according to claim 1 or 2, wherein the amount of the thermally conductive filler blended with the metal powder is 50 to 200 parts by weight in total with respect to 100 parts by weight of rubber and / or plastic. Rubber and / or plastic moldings. 제1항 내지 제3항중 어느 한 항에 있어서, (a) 금속산화물, 금속질화물, 및 이들 가운데 어느 하나를 함유하는 충전제로 이루어진 군으로 부터 선택된 1종 이상의 충전제 및 (b) 결정성 실리카, 탄화규소, 산화규소 및 이들 가운데 어느 하나를 함유하는 충전제로 이루어진 군으로 부터 선택된 1종 이상의 충전제의 배합비율이 7 : 3 내지 3 : 7의 범위임을 특징으로 하는 제진성 및 열전도성이 있는 고무 및/또는 플라스틱 성형물.The method according to any one of claims 1 to 3, wherein at least one filler selected from the group consisting of (a) a metal oxide, a metal nitride, and a filler containing any one of these, and (b) crystalline silica, carbonization. A vibration damping and thermally conductive rubber, characterized in that the blending ratio of at least one filler selected from the group consisting of silicon, silicon oxide and a filler containing any one thereof is in the range of 7: 3 to 3: 7; Or plastic moldings. 제1항 내지 제4항중 어느 한 항에 있어서, 열전도성이 있는 충전제와 함께 배합한느 금속 분말이 100메쉬 이상의 입경을 가진 금속 분말이며, 그 혼합량이 고무 및/또는 플라스틱 100중량부에 대하여 100 내지 400중량부임을 특징으로 하는 제진성 및 열전도성이 있는 고무 및/또는 플라스틱 성형물.The metal powder according to any one of claims 1 to 4, wherein the metal powder blended with the thermally conductive filler is a metal powder having a particle size of 100 mesh or more, and the mixing amount thereof is 100 based on 100 parts by weight of rubber and / or plastic. Rubber and / or plastic molding with a damping and thermal conductivity, characterized in that from 400 parts by weight. 제1항 내지 제5항중 어느 한 항에 있어서, 비중이 1.8이상임을 특징으로 하는 제진성 및 열전도성이 있는 고무 및/또는 플라스틱 성형물.6. Rubber and / or plastic molded article according to any one of claims 1 to 5, characterized in that it has a specific gravity of at least 1.8. 제1항 내지 제6항중 어느 한 항에 있어서, 성형물의 양면 또는 어느 일면 이상의 면에 접착제충을 설치함을 특징으로 하는 제진성 및 열전도성이 있는 고무 및/또는 플라스틱 성형물.The rubber and / or plastic molded article according to any one of claims 1 to 6, wherein an adhesive charge is provided on both surfaces or at least one surface of the molded article. 제1항 내지 제6항중 어느 한 항에 있어서, 성형물이 시트상 또는 테이프상 성형물이고, 금속띠를 내재시키거나 편면에 배설한 적층성형물임을 특징으로 하는 제진성 및 열전도성이 있는 고무 및/또는 플라스틱 성형물The vibration damping and heat conductive rubber according to any one of claims 1 to 6, wherein the molding is a sheet or tape shaped molding, and is a laminated molding having a metal strip embedded therein or disposed on one side thereof. Plastic molding ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920026169A 1992-05-01 1992-12-29 Rubber or plastic mold having anti-damping and thermal conductive properties KR100251658B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP140080/92 1992-05-01
JP14008092A JP3325600B2 (en) 1992-05-01 1992-05-01 Rubber and / or plastic moldings with vibration damping and thermal conductivity

Publications (2)

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KR930023424A true KR930023424A (en) 1993-12-18
KR100251658B1 KR100251658B1 (en) 2000-04-15

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0868441A (en) * 1994-08-29 1996-03-12 Tokai Rubber Ind Ltd Dynamic damper, material for molding thereof and manufacture thereof
JP4369594B2 (en) * 2000-04-28 2009-11-25 古河電気工業株式会社 Thermally conductive molded body
KR100782259B1 (en) * 2000-11-16 2007-12-04 엘지전자 주식회사 EMI shielding heat sink using carbon nanotube and manufacturing method thereof
KR100422570B1 (en) * 2001-10-20 2004-03-11 최재영 Resin Composition for Heat Sink and a Method of Manufacturing Sheets for Heat Sink Using the Same
US6777026B2 (en) * 2002-10-07 2004-08-17 Lord Corporation Flexible emissive coatings for elastomer substrates
CA2477740A1 (en) * 2002-03-08 2003-09-18 Lord Corporation Flexible coatings for elastomer substrates
KR20040009219A (en) * 2002-07-19 2004-01-31 최명부 The Production of Functional Foor Materials Able to prevent Harmful Electromagnetic Waves
KR100760128B1 (en) 2005-10-05 2007-09-18 엘지전자 주식회사 Ceiling type air conditioner
DE102007049973A1 (en) * 2007-10-18 2009-04-23 Robert Bosch Gmbh Heating device for liquid fuels and the like
JP2015033808A (en) * 2013-08-09 2015-02-19 日東電工株式会社 Adhesive damping material
JP6324801B2 (en) * 2014-05-12 2018-05-16 ブリヂストンケービージー株式会社 Vibration and heat dissipation composite structure

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Publication number Priority date Publication date Assignee Title
JPS6233888A (en) * 1985-08-01 1987-02-13 Nippon Mining Co Ltd Flexible composite material

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JP3325600B2 (en) 2002-09-17
JPH05310993A (en) 1993-11-22
TW228534B (en) 1994-08-21
KR100251658B1 (en) 2000-04-15

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