KR930016251U - Structure of semiconductor integrated circuit package for memory module - Google Patents

Structure of semiconductor integrated circuit package for memory module

Info

Publication number
KR930016251U
KR930016251U KR2019910023087U KR910023087U KR930016251U KR 930016251 U KR930016251 U KR 930016251U KR 2019910023087 U KR2019910023087 U KR 2019910023087U KR 910023087 U KR910023087 U KR 910023087U KR 930016251 U KR930016251 U KR 930016251U
Authority
KR
South Korea
Prior art keywords
integrated circuit
memory module
semiconductor integrated
circuit package
package
Prior art date
Application number
KR2019910023087U
Other languages
Korean (ko)
Other versions
KR0125869Y1 (en
Inventor
이상희
Original Assignee
금성일렉트론주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론주식회사 filed Critical 금성일렉트론주식회사
Priority to KR2019910023087U priority Critical patent/KR0125869Y1/en
Publication of KR930016251U publication Critical patent/KR930016251U/en
Application granted granted Critical
Publication of KR0125869Y1 publication Critical patent/KR0125869Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
KR2019910023087U 1991-12-20 1991-12-20 Structure of package memory module KR0125869Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910023087U KR0125869Y1 (en) 1991-12-20 1991-12-20 Structure of package memory module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910023087U KR0125869Y1 (en) 1991-12-20 1991-12-20 Structure of package memory module

Publications (2)

Publication Number Publication Date
KR930016251U true KR930016251U (en) 1993-07-28
KR0125869Y1 KR0125869Y1 (en) 1998-10-01

Family

ID=19324885

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910023087U KR0125869Y1 (en) 1991-12-20 1991-12-20 Structure of package memory module

Country Status (1)

Country Link
KR (1) KR0125869Y1 (en)

Also Published As

Publication number Publication date
KR0125869Y1 (en) 1998-10-01

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Year of fee payment: 9

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