KR930016168U - 진공장비의 오-링 냉각장치 - Google Patents

진공장비의 오-링 냉각장치

Info

Publication number
KR930016168U
KR930016168U KR2019910023232U KR910023232U KR930016168U KR 930016168 U KR930016168 U KR 930016168U KR 2019910023232 U KR2019910023232 U KR 2019910023232U KR 910023232 U KR910023232 U KR 910023232U KR 930016168 U KR930016168 U KR 930016168U
Authority
KR
South Korea
Prior art keywords
cooling system
vacuum equipment
ring cooling
ring
vacuum
Prior art date
Application number
KR2019910023232U
Other languages
English (en)
Other versions
KR0119248Y1 (ko
Inventor
하계수
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019910023232U priority Critical patent/KR0119248Y1/ko
Publication of KR930016168U publication Critical patent/KR930016168U/ko
Application granted granted Critical
Publication of KR0119248Y1 publication Critical patent/KR0119248Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gasket Seals (AREA)
  • Sliding Valves (AREA)
KR2019910023232U 1991-12-21 1991-12-21 진공장비의 오-링 냉각장치 KR0119248Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910023232U KR0119248Y1 (ko) 1991-12-21 1991-12-21 진공장비의 오-링 냉각장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910023232U KR0119248Y1 (ko) 1991-12-21 1991-12-21 진공장비의 오-링 냉각장치

Publications (2)

Publication Number Publication Date
KR930016168U true KR930016168U (ko) 1993-07-28
KR0119248Y1 KR0119248Y1 (ko) 1998-08-01

Family

ID=19325020

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910023232U KR0119248Y1 (ko) 1991-12-21 1991-12-21 진공장비의 오-링 냉각장치

Country Status (1)

Country Link
KR (1) KR0119248Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442472B1 (ko) * 2001-12-24 2004-07-30 동부전자 주식회사 저압화학기상증착 설비에서 플래넘에 쿨런트를 공급하는장치 및 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100929893B1 (ko) * 2008-01-31 2009-12-04 주식회사 채금 인터내셔널 방열핀이 형성된 오링금형

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442472B1 (ko) * 2001-12-24 2004-07-30 동부전자 주식회사 저압화학기상증착 설비에서 플래넘에 쿨런트를 공급하는장치 및 방법

Also Published As

Publication number Publication date
KR0119248Y1 (ko) 1998-08-01

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
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FPAY Annual fee payment

Payment date: 20050221

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee