KR930015982A - Hybrid I.C circuit board and its formation method - Google Patents

Hybrid I.C circuit board and its formation method Download PDF

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Publication number
KR930015982A
KR930015982A KR1019910022043A KR910022043A KR930015982A KR 930015982 A KR930015982 A KR 930015982A KR 1019910022043 A KR1019910022043 A KR 1019910022043A KR 910022043 A KR910022043 A KR 910022043A KR 930015982 A KR930015982 A KR 930015982A
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KR
South Korea
Prior art keywords
hybrid
circuit board
ceramic
circuit
engineering plastic
Prior art date
Application number
KR1019910022043A
Other languages
Korean (ko)
Inventor
안종성
Original Assignee
황선두
삼성전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황선두, 삼성전기 주식회사 filed Critical 황선두
Priority to KR1019910022043A priority Critical patent/KR930015982A/en
Publication of KR930015982A publication Critical patent/KR930015982A/en

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Abstract

종래의 하이브리드 I.C 회로의 세라믹 기판은 소성해야 함으로써 생산 비용이 높고 기판 위에 형성되는 금속 회로들이 소결 공정중에 손상되거나 세라믹 자체가 깨어지기 쉬운 관계로 많은 문제가 있었다.Since the ceramic substrate of the conventional hybrid IC circuit has to be fired, there are many problems because the production cost is high and the metal circuits formed on the substrate are damaged during the sintering process or the ceramic itself is easily broken.

이 발명에서는 세라믹 대신에 에폭시 수지, 페놀수지, 방향족 폴리에스테르 또는 폴리아미드와 같은 엔지니어링 프라스틱을 회로 기판으로 사용하고 무전해 화학 도금층을 전기 도체로 활용함으로써 가공성이 뛰어나고 기능성이 높은 하이브리도 I.C 회로를 경제적으로 형성할 수 있다.In the present invention, an engineering plastic such as epoxy resin, phenol resin, aromatic polyester or polyamide is used as a circuit board instead of ceramic, and an electroless chemical plating layer is used as an electrical conductor, thereby providing a highly processable and functional hybrid IC circuit. It can be economically formed.

Description

하이브리드 I.C 회로 기판 및 그의 형성 방법Hybrid I.C circuit board and its formation method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (4)

엔지니어링 플라스틱의 기판위에, 무전해 도금, 전해 도금으로 도체 피막된 것을 특징으로 하는 하이브리드 I.C 회로 기판.A hybrid IC circuit board comprising a conductor film coated on an engineering plastic substrate by electroless plating or electrolytic plating. 제1항에 있어서, 무전해 도금층은 니켈 또는 구리인 것을 특징으로 하는 하이브리드 I.C 회로 기판.The hybrid IC circuit board according to claim 1, wherein the electroless plating layer is nickel or copper. 제1항에 있어서 전해 도금층은 구리, 금, 은 또는 백금인 것을 특징으로 하는 하이브리드 I.C 회로 기판.The hybrid IC circuit board according to claim 1, wherein the electroplating layer is copper, gold, silver or platinum. 엔지니어링 프라스틱의 기판 위에, 스크린 인쇄, 무전해 도금, 전해도금, 스크린 인쇄 순으로 도체 피막하는 것으로 이루어지는 것을 특징으로 하는 하이브리드 I.C 회로 기판의 형성방법.A method for forming a hybrid IC circuit board comprising a conductor coating on an engineering plastic substrate in order of screen printing, electroless plating, electroplating, and screen printing. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910022043A 1991-12-03 1991-12-03 Hybrid I.C circuit board and its formation method KR930015982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910022043A KR930015982A (en) 1991-12-03 1991-12-03 Hybrid I.C circuit board and its formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910022043A KR930015982A (en) 1991-12-03 1991-12-03 Hybrid I.C circuit board and its formation method

Publications (1)

Publication Number Publication Date
KR930015982A true KR930015982A (en) 1993-07-24

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ID=67356304

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910022043A KR930015982A (en) 1991-12-03 1991-12-03 Hybrid I.C circuit board and its formation method

Country Status (1)

Country Link
KR (1) KR930015982A (en)

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