CN209345436U - A kind of gold-plated printed wiring board structure of no conducting wire - Google Patents
A kind of gold-plated printed wiring board structure of no conducting wire Download PDFInfo
- Publication number
- CN209345436U CN209345436U CN201820436434.XU CN201820436434U CN209345436U CN 209345436 U CN209345436 U CN 209345436U CN 201820436434 U CN201820436434 U CN 201820436434U CN 209345436 U CN209345436 U CN 209345436U
- Authority
- CN
- China
- Prior art keywords
- printed wiring
- wiring board
- gold
- finger pad
- conducting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 9
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 5
- 239000010974 bronze Substances 0.000 claims abstract description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 239000010931 gold Substances 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims abstract description 4
- 101000590281 Homo sapiens 26S proteasome non-ATPase regulatory subunit 14 Proteins 0.000 description 5
- 101001114059 Homo sapiens Protein-arginine deiminase type-1 Proteins 0.000 description 5
- 102100023222 Protein-arginine deiminase type-1 Human genes 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a kind of no gold-plated printed wiring board structures of conducting wire, including printed wiring board, set on the finger PAD of printed wiring plate surface, the chemical layers of copper of other region surfaces on the surface finger PAD and printed wiring board in addition to finger PAD, plating gold over nickelplating outside finger PAD surface chemistry layers of copper, the plating resist bronze ink printing layer of other region surfaces on printed wiring board in addition to finger PAD.The utility model designs rationally without the gold-plated printed wiring board structure of conducting wire, can be used for light news, medical treatment, the fields such as aviation, market popularization value height.
Description
Technical field
The utility model relates to printed wiring board technical field, specifically a kind of no gold-plated printed wiring board structure of conducting wire.
Background technique
Pcb board is the abbreviation of English (Printed Circuie Board) printed wiring board.Usually in insulation material,
By predetermined design, the conductive pattern that printed wiring, printed element or both are composed is made and is known as printed circuit.And it is insulating
The conductive pattern being electrically connected between component, referred to as printed wiring are provided on substrate.Thus printed circuit or track
The production board on road is known as printed wiring board, also known as printed board or printed circuit board.
Now with scientific and technological high speed development, printed wiring board we live in institute's figure it is more and more important, it is close not
It can divide.Product design demand is more and more diversified, and customer requirement is also more and more high-end, promotes printed wiring board manufacture craft continuous
It breaks through.It is with product gold-plated surface processing (letter resistance requirements) and more and more without traverse design demand, develop a kind of no conducting wire
Gold-plated printed wiring board becomes development trend.
Utility model content
The purpose of this utility model is to provide a kind of no gold-plated printed wiring board structures of conducting wire, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the utility model provides the following technical solutions:
A kind of gold-plated printed wiring board structure of no conducting wire, including printed wiring board, set on the finger of printed wiring plate surface
PAD, the chemical layers of copper of other region surfaces on the surface finger PAD and printed wiring board in addition to finger PAD are set to hand
Refer to the plating gold over nickelplating outside PAD surface chemistry layers of copper, other region surfaces on printed wiring board in addition to finger PAD
Plating resist bronze ink printing layer.
As a further solution of the present invention: printed wiring board is formed by several layers line layer.
Compared with prior art, the utility model has the beneficial effects that
The utility model designs rationally without the gold-plated printed wiring board structure of conducting wire, can be used for light news, medical treatment, the neck such as aviation
Domain, market popularization value are high.
Detailed description of the invention
Fig. 1 for the gold-plated printed wiring board structure of no conducting wire structural schematic diagram.
Wherein: 1- finger PAD；2- chemistry layers of copper；3- plating resist bronze ink printing layer；Gold over nickelplating is electroplated in 4-；5- track
Road plate.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
Referring to Fig. 1, a kind of gold-plated printed wiring board structure of no conducting wire, the printed wiring formed including several layers line layer
Plate 5, the finger PAD1 set on 5 surface of printed wiring board are set on the surface finger PAD1 and printed wiring board 5 and remove finger PAD1
The chemical layers of copper 2 of other outer region surfaces, the plating gold over nickelplating 4 outside finger PAD1 surface chemistry layers of copper 2, is set to
The plating resist bronze ink printing layer 3 of other region surfaces on printed wiring board 5 in addition to finger PAD1.
The preferred embodiment of the patent is described in detail above, but this patent is not limited to above-mentioned embodiment party
Formula within the knowledge of one of ordinary skill in the art can also be under the premise of not departing from this patent objective
Various changes can be made.
Claims (2)
1. a kind of gold-plated printed wiring board structure of no conducting wire, which is characterized in that including printed wiring board (5), be set to printed wiring
The finger PAD(1 on plate (5) surface), it is set to finger PAD(1) its on surface and printed wiring board (5) in addition to finger PAD(1)
The chemical layers of copper (2) of his region surface is set to finger PAD(1) the external plating gold over nickelplating (4) of surface chemistry layers of copper (2), if
In the plating resist bronze ink printing layer (3) of other region surfaces on printed wiring board (5) in addition to finger PAD(1).
2. the gold-plated printed wiring board structure of no conducting wire according to claim 1, which is characterized in that printed wiring board (5) by
Several layers line layer is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820436434.XU CN209345436U (en) | 2018-03-29 | 2018-03-29 | A kind of gold-plated printed wiring board structure of no conducting wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820436434.XU CN209345436U (en) | 2018-03-29 | 2018-03-29 | A kind of gold-plated printed wiring board structure of no conducting wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209345436U true CN209345436U (en) | 2019-09-03 |
Family
ID=67743036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820436434.XU Expired - Fee Related CN209345436U (en) | 2018-03-29 | 2018-03-29 | A kind of gold-plated printed wiring board structure of no conducting wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209345436U (en) |
-
2018
- 2018-03-29 CN CN201820436434.XU patent/CN209345436U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190903 |