KR930015198A - Method of Manufacturing Elastic Interconnector - Google Patents

Method of Manufacturing Elastic Interconnector Download PDF

Info

Publication number
KR930015198A
KR930015198A KR1019920024694A KR920024694A KR930015198A KR 930015198 A KR930015198 A KR 930015198A KR 1019920024694 A KR1019920024694 A KR 1019920024694A KR 920024694 A KR920024694 A KR 920024694A KR 930015198 A KR930015198 A KR 930015198A
Authority
KR
South Korea
Prior art keywords
rubber layer
layer
silicone rubber
uncured
laminate
Prior art date
Application number
KR1019920024694A
Other languages
Korean (ko)
Other versions
KR970001954B1 (en
Inventor
고이찌 야마자끼
Original Assignee
하시모또 마사미
신에쓰폴리머 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하시모또 마사미, 신에쓰폴리머 가부시끼가이샤 filed Critical 하시모또 마사미
Publication of KR930015198A publication Critical patent/KR930015198A/en
Application granted granted Critical
Publication of KR970001954B1 publication Critical patent/KR970001954B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • B29C70/60—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres comprising a combination of distinct filler types incorporated in matrix material, forming one or more layers, and with or without non-filled layers
    • B29C70/603—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres comprising a combination of distinct filler types incorporated in matrix material, forming one or more layers, and with or without non-filled layers and with one or more layers of pure plastics material, e.g. foam layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • B29C2793/0063—Cutting longitudinally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B29C48/0018—Combinations of extrusion moulding with other shaping operations combined with shaping by orienting, stretching or shrinking, e.g. film blowing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B29C48/0022—Combinations of extrusion moulding with other shaping operations combined with cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B29C48/21—Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2021/00—Use of unspecified rubbers as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
    • B29K2105/246—Uncured, e.g. green
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2707/00—Use of elements other than metals for preformed parts, e.g. for inserts
    • B29K2707/04—Carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive

Abstract

본 발명은 작은 피치의 탄성적 인터코넥터의 제조방법에 관한 것이다. 종래의 방법은 전도성 고무화합물과 절연성 고무화합물로된 시트가 적층제가 형성되도록 교대로 적층되어지며 전체적인 경화 그리고 절단되는 것이다.The present invention relates to a method of manufacturing a small pitch elastic interconnector. The conventional method is that sheets made of a conductive rubber compound and an insulating rubber compound are alternately laminated to form a laminating agent, and the entire hardening and cutting are performed.

탄성적 인터코넥터의 제조에 대하여 본 발명은 다음의 단계로 구성된다.Regarding the manufacture of the elastic interconnector, the present invention consists of the following steps.

(a) 회로기판에 충전재없이 전기절연성이며 액상인 실리콘 고무화합물을 코팅하여 경화되지 않은 절연성 실리콘 고무화합물층을 형성하는 단계, (b) 회로기판상의 경화되지 않은 절연성 실리콘 고무층을 경화하여 경화된 절연성 고무층을 만드는 단계, (c) 회로기판상의 경화된 절연성 실리콘 고무층위에 경화되지 않은 전도성 고무화합물을 붙이는 단계, (d) 경화된 절연성 고무층과 경화되지 않은 전도성 고무층의 이중층의 시트를 만들기 위하여 기판을 경화된 절연선 실리콘 고무층으로 부터 제거하는 단계, (e) 경화된 절연선 실리콘 고무층의 미경화된 전도성 고무층과 접하도록 하여 적층체를 형성하도록 다수의 이중층 고무시트를 적층하는 단계, (f) 미경화된 전도성 고무층을 경화하여 하나의 적층체가 형성되도록 고무층의 면에 수직방향으로 압력을 가하면선 그 적층체를 가열하는 단계, (g) 그 적층체를 적층면에 직각방향으로 얇게 절단하는 단계.(a) coating an electrically insulating, liquid silicone rubber compound on the circuit board without a filler to form an uncured insulating silicone rubber compound layer, (b) curing the uncured insulating silicone rubber layer on the circuit board and curing the insulating rubber layer (C) attaching an uncured conductive rubber compound on the cured insulating silicone rubber layer on the circuit board, and (d) curing the substrate to make a bilayer sheet of cured insulating rubber layer and uncured conductive rubber layer. Removing from the insulated silicone rubber layer, (e) laminating a plurality of double layer rubber sheets in contact with the uncured conductive rubber layer of the cured insulated silicone rubber layer to form a laminate, and (f) the uncured conductive rubber layer To harden to form a laminate, and press it in the direction perpendicular to the surface of the rubber layer. Applying the step of heating the laminated body line, (g) the step of thinly cut in a perpendicular direction to the laminate in the laminate surface.

Description

탄성적 인터코넥터의 제조방법Method of Manufacturing Elastic Interconnector

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (5)

(a) 미경화된 절연성 실리콘 고무층을 만들기 위해 기판을 충전제가 없는 액상의 전기절연성 실리콘 고무화합물로 코팅하는 단계와, (b) 기판상의 미경화된 절연성 실리콘 고무층을 경화된 절연성 고무층이 되도록 경화하는 단계와, (c) 기판상의 경화된 절연성 실리콘 고무층의 표면에 이 표면과 일체로 미경화된 전기전도성 고무화합물층을 형성하는 단계와, (d) 경화된 절연성 실리콘 고무층과 미경화된 전기 전도성 고무층으로 구성된 2중층의 고무 시트를 제공하기 위해 경화된 절연성 실리콘 고무층에서 기판을 제거하는 단계와, (e) 적층체를 형성하기 위하여 한 시트의 경화된 절연성 실리콘 고무화합물 층과 인접한 다른 시트의 미경화된 전도성 고무막이 접촉하도록 다수의 이중층 고무시트를 포개어 적층하는 단계와, (f) 미경화된 전기전도성 고무층을 일체의 적층체로 경화하기 위하여 적층면에 수직방향으로 가압하면서 적층체를 가열하는 단계와, (g) 일체화된 적층체를 적층면에 수직한 방향의 상호 평행한 평면들로 얇게 절단하는 단계로 구성되는 탄성적 인터코넥터의 제조방법.(a) coating the substrate with a liquid-free electrically insulating silicone rubber compound without filler to produce an uncured insulating silicone rubber layer, and (b) curing the uncured insulating silicone rubber layer on the substrate to become a cured insulating rubber layer. (C) forming an uncured electrically conductive rubber compound layer integrally with the surface on the surface of the cured insulating silicone rubber layer on the substrate, and (d) with the cured insulating silicone rubber layer and the uncured electrically conductive rubber layer. Removing the substrate from the cured insulating silicone rubber layer to provide a constructed double layer rubber sheet, and (e) uncuring the other sheet adjacent to the cured insulating silicone rubber compound layer of one sheet to form a laminate. Stacking and stacking a plurality of double layer rubber sheets so that the conductive rubber films are in contact with each other, and (f) the uncured electrically conductive high Heating the laminate while pressing in a direction perpendicular to the laminate surface to cure the layer into an integral laminate, and (g) thinly cutting the integrated laminate into mutually parallel planes in a direction perpendicular to the laminate surface. Method of manufacturing an elastic interconnector consisting of. 제1항에 있어서, 상기 기판이 10에서 100㎛까지의 두께를 가지는 플라스틱 수지 필름인 것을 특징으로 하는 탄성적 인터코넥터의 제조방법.The method of claim 1, wherein the substrate is a plastic resin film having a thickness of 10 to 100㎛. 제1항에 있어서, 상기 (a)단계에서 성형된 미경화된 절연성 고무층이 3에서 30㎛까지의 두께를 가지는 것을 특징으로 하는 탄성적 인터코넥터의 제조방법.The method of claim 1, wherein the uncured insulating rubber layer formed in the step (a) has a thickness of 3 to 30㎛. 제1항에 있어서, 상기 액상의 전기 절연성 실리콘 고무 화합물이 25℃에서 50에서 1000푸아제까지의 점도를 가지는 것을 특징으로 하는 탄성적 인터코넥터의 제조방법.The method of claim 1, wherein the liquid electrically insulating silicone rubber compound has a viscosity from 25 to 50 to 1000 fuze. 제1항에 있어서, 상기 (c) 단계에서 성형된 미경화된 전기전도성 고무화합물이 25에서 35㎛까지의 두께를 가지는 것을 특징으로 하는 탄성적 인터코넥터의 제조방법.The method of manufacturing an elastic interconnector according to claim 1, wherein the uncured electrically conductive rubber compound formed in step (c) has a thickness of 25 to 35 µm. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920024694A 1991-12-20 1992-12-17 Manufacturing method of elastic interconnectors KR970001954B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3355167A JP2849609B2 (en) 1991-12-20 1991-12-20 Manufacturing method of elastic connector
JP91-355167 1991-12-20

Publications (2)

Publication Number Publication Date
KR930015198A true KR930015198A (en) 1993-07-24
KR970001954B1 KR970001954B1 (en) 1997-02-19

Family

ID=18442333

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920024694A KR970001954B1 (en) 1991-12-20 1992-12-17 Manufacturing method of elastic interconnectors

Country Status (4)

Country Link
JP (1) JP2849609B2 (en)
KR (1) KR970001954B1 (en)
GB (1) GB2262474B (en)
TW (1) TW220011B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020061549A (en) * 2002-05-02 2002-07-24 심재택 the method of manufacturing mesh pannel
KR100451701B1 (en) * 2002-11-06 2004-10-08 심재택 the method of manufacturing mesh panel
DE102014201689A1 (en) * 2014-01-30 2015-07-30 Wacker Chemie Ag Process for the preparation of silicone multilayer composites
JP7153605B2 (en) * 2019-04-25 2022-10-14 信越ポリマー株式会社 Method for manufacturing anisotropically conductive sheet

Also Published As

Publication number Publication date
KR970001954B1 (en) 1997-02-19
JPH05174937A (en) 1993-07-13
GB9225074D0 (en) 1993-01-20
GB2262474B (en) 1995-08-02
JP2849609B2 (en) 1999-01-20
GB2262474A (en) 1993-06-23
TW220011B (en) 1994-02-11

Similar Documents

Publication Publication Date Title
US20010005304A1 (en) Printed circuit board capacitor structure and method
KR890013829A (en) Adhesive heat-sealed interconnector and its manufacturing method
KR960703722A (en) MULTIPLE LAYER PRINTED CIRCUIT BOARDS AND METHOD OF MANUFACTURE
JPH02126578A (en) Elastic connector
EP1422055A4 (en) Capacitor layer forming both-side copper-clad laminated heet and production method therefor
US6574090B2 (en) Printed circuit board capacitor structure and method
KR900004225A (en) Printed wiring boards, methods of making such plates and insulating films for use in such plates
KR930015198A (en) Method of Manufacturing Elastic Interconnector
KR960044004A (en) Multilayer printed wiring board and manufacturing method thereof
JP3744970B2 (en) Manufacturing method of flex rigid wiring board
TW200520640A (en) Sheet for flexible printed circuit board and method for manufacture thereof
EP0377332A3 (en) Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface
JPH04264791A (en) Flexible circuit board
JPH07154068A (en) Adhesive sheet and production thereof, metal based wiring board employing adhesive sheet and production thereof
US3234060A (en) Method of fabricating a laminated printed circuit structure
GB2216435A (en) Prepreg sheet
JPS59232846A (en) Laminated board for electric wiring board and manufacture thereof
JPH0735414Y2 (en) Multilayer circuit board for mounting electronic components
BR9306894A (en) Process for the manufacture of a multilayer printed circuit board
CN113707424A (en) Planar winding unit and manufacturing method thereof, planar winding and planar electronic device
SU1140274A1 (en) Multilayer printed circuit board
CN115066042A (en) Heatable flexible circuit board and manufacturing method thereof
JPH07130586A (en) Surface treatment method of butyl rubber and composite material formed thereof
JPH10303553A (en) Manufacture for printed wiring board
JPS5917997B2 (en) printed wiring board

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120724

Year of fee payment: 16

EXPY Expiration of term