KR930014655A - Solid Electrolytic Capacitors and Manufacturing Method Thereof - Google Patents

Solid Electrolytic Capacitors and Manufacturing Method Thereof Download PDF

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Publication number
KR930014655A
KR930014655A KR1019920025662A KR920025662A KR930014655A KR 930014655 A KR930014655 A KR 930014655A KR 1019920025662 A KR1019920025662 A KR 1019920025662A KR 920025662 A KR920025662 A KR 920025662A KR 930014655 A KR930014655 A KR 930014655A
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South Korea
Prior art keywords
terminal
chip
electrode terminal
positive electrode
anode
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KR1019920025662A
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Korean (ko)
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KR960010110B1 (en
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시게키 기바야시
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사토 겐이치로
롬 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

본 발명은 고체 전해 콘덴서, 특히 모울딩된 수지성 팩키지 안에 밀폐된 방식의 고체 전해 콘덴서 및 그 제조방법에 관한 것으로서, 칩 본체 및 상기 칩 본체의 바깥으로 돌출하는 양극 와이어를 가지는 콘덴서 칩과, 상기 칩 본체에 전기적으로 접속된 음극단자와, 상기 양극와이어에 전기직으로 접속된 양극단자와, 상기 음극 및 양극 단자의 일부와 함께 칩 본체를 밀폐하는 수지성 팩키지로 구성되며, 상기 양극와이어가 미끄럼 끼워 맞춤되는 배치홈을 가지는 것을 특징으로 하는 고체 전해 콘덴서와, 적어도 하나의 음극단자와 상기 음극단자와 쌍으로 되는 적어도 하나의 양극단자를 가지는 리드프에임을 제작하는 단계와, 상기 음극단자에 전기적으로 접속되는 칩 본체와 상기 양극단자에 전기적으로 접속되는 양극와이어를 가지는 콘덴서 칩을 상리 리드프레임에 장착하는 단계와, 상기 음극 및 양극단자의 일부와 함께 콘덴서 칩을 밀폐하는 수지성 팩키지를 모울딩하는 단계와, 상기 리트프레임으로 부터 상기 음극 및 양극 단자를 분리하는 단계로 구성되며, 상기 양극단자에는 배치홈이 구비되며, 상기 콘덴서 칩의 장착이 양극 와이어가 배치홈에 미그럼 끼워 맞춤되는 방법으로 수행되는 것을 특징으로 하는 고체 전해 콘덴서 제조방법에 제공된다.The present invention relates to a solid electrolytic capacitor, in particular a solid electrolytic capacitor sealed in a molded resin package, and a method for manufacturing the same, comprising: a capacitor chip having a chip body and an anode wire protruding out of the chip body; And a negative electrode terminal electrically connected to the chip main body, a positive electrode terminal electrically connected to the positive electrode wire, and a resin package that seals the chip main body together with a part of the negative electrode and the positive terminal. Fabricating a lead electrolyte having a solid electrolytic capacitor, characterized in that it has an alignment groove, at least one cathode terminal and at least one anode terminal paired with the cathode terminal, and electrically connected to the cathode terminal. A capacitor chip having a chip main body and an anode wire electrically connected to the anode terminal. Mounting to the lead frame, molding a resin package sealing the capacitor chip together with a part of the cathode and anode terminals, and separating the cathode and anode terminals from the litframe, The anode terminal is provided with a placement groove, and the mounting of the capacitor chip is provided in the method of manufacturing a solid electrolytic capacitor, characterized in that the anode wire is fitted in a way to fit the placement groove.

Description

고체 전해 콘덴서및 그 제조방법Solid Electrolytic Capacitors and Manufacturing Method Thereof

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 방법을 수행하기 위해 사용되는 리드프레임을 도시하는 사시도,1 is a perspective view showing a leadframe used to carry out the method of the present invention,

제2도는 제1도와 유사한 도면으로서 굽힘가공을 받는 동일한 리드 프레임을 도시하는 사시도,FIG. 2 is a perspective view similar to that of FIG. 1 showing the same lead frame subjected to bending; FIG.

제3도는 제1도와 유사한 도면으로서 칩 장착시의 동일한 리드프레임을 도시하는 사시도,3 is a perspective view similar to that of FIG. 1 showing the same lead frame when the chip is mounted;

제4도는 본 발명에 따른 방법으로 얻을 수 있는 고체 전해 콘덴서 팩키지를 도시하는 단면도.4 is a cross-sectional view showing a solid electrolytic capacitor package obtainable by the method according to the present invention.

Claims (7)

칩 본체 및 상기 칩 본체의 바깥으로 돌출하는 양극와이어를 가지는 콘덴서 칩과, 상기 칩 본체에 전기적으로 접속된 음극단자와, 상기 양극와이어에 전기적으로 접속된 양극 단자와, 상기 음극 및 양극단자의 일부와 함께 칩본체를 밀폐하는 수지성 팩키지로 구성되며, 상기 양극단자는 양극 와이어가 미끄럼 끼워 맞춤되는 배치홈을 가지는 것을 특징으로 하는 고체 전해 콘덴서.A capacitor chip having a chip body and positive wires protruding out of the chip body, a negative electrode terminal electrically connected to the chip body, a positive electrode terminal electrically connected to the positive wire, and a portion of the negative electrode and positive electrode terminal; Comprising a resin package for sealing the chip body together, the positive electrode terminal characterized in that the positive electrode wire has a placement groove for sliding fitting. 제1항에 있어서, 상기 배치홈이 상기 양극단자와 일체로 형성되며 상기 양극단자위로 굽혀 접혀지는 평행한 한싸의 홈형성 돌출부에 의해 형성되는 것을 특징으로 하는 고체 전해 콘덴서.The solid electrolytic capacitor according to claim 1, wherein the placement groove is formed by a parallel groove-shaped protrusion formed integrally with the anode terminal and bent and folded over the anode terminal. 제1항에 있어서, 상기 배치홈이 상기 양극단자의 프레싱 부분에 의해 형성되는 것을 특징으로 하는 고체 전해 콘덴서.The solid electrolytic capacitor according to claim 1, wherein said placement groove is formed by a pressing portion of said positive terminal. 제1항에 있어서, 상기 콘덴서 칩 본체가 퓨즈를 통해 음극단자에 전기적으로 접속되는 것을 특징으로 하는 고체 전해 콘덴서.The solid electrolytic capacitor according to claim 1, wherein the capacitor chip main body is electrically connected to the negative terminal through a fuse. 적어도 하나의 음극단자와 상기 음극단자와 쌍으로 되는 적어도 하나의 양극단자를 가지는 리드프레임을 제작하는 단계와, 상기 음극단자에 전기적으로 접속되는 칩 본체와 상기 양극단자에 전기적으로 접속되는 양극와이어를 가지는 콘덴서 칩을 상기 리드프레임에 장착되는 단계와, 상기 음극 및 양극단자의 일부와 함께 콘덴서칩을 밀폐하느 수지성 팩키지를 모울딩하는 단계와, 상기 리드프레임으로부터 상기 음극 및 양극 단자를 분리하는 단계로 구성되며, 상기 양극 단자애는 배치홈이 구비되며, 상기 콘댄서칩의 장착이 양극와이어가 배치홈에 미끄럼 끼워맞춤되는 방법으로 수행되는 것을 특징으로 하는 고채 전해 콘덴서 제조방법.Manufacturing a lead frame having at least one negative electrode terminal and at least one positive electrode terminal paired with the negative electrode terminal, a chip body electrically connected to the negative electrode terminal, and a positive electrode wire electrically connected to the positive electrode terminal Mounting a capacitor chip on the lead frame, molding a resin package enclosing the capacitor chip together with a portion of the cathode and anode terminals, and separating the cathode and anode terminals from the lead frame. And the anode terminal is provided with an arrangement groove, and the mounting of the condenser chip is performed by a method in which the anode wire is slid into the arrangement groove. 제5항에 있어서, 상기 양극단자에는 평행한 한쌍의 홈형성 돌출부가 구비되며, 상기 배치홈이 상기 홈형성돌출부를 상기 양극단자 위로 굽히고 접어서 형성되는 것을 특징으로 하는 고체 전해 콘덴서 제조방법.The method of claim 5, wherein the positive electrode terminal is provided with a pair of parallel groove forming protrusions, wherein the arrangement groove is formed by bending and folding the groove forming protrusion over the positive electrode terminal. 제5항에 있어서, 상기 배치홈이 상기 양극단자의 일부분을 프레싱하여 형성되는 것을 특징으로 하는 고체 전해 콘덴서 제조방법.The method of claim 5, wherein the placement groove is formed by pressing a portion of the positive electrode terminal. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920025662A 1991-12-27 1992-12-24 Solid electrolytic capacitor and method making the same KR960010110B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-347545 1991-12-27
JP3347545A JPH05182873A (en) 1991-12-27 1991-12-27 Manufacture of solid electrolytic capacitor and solid electrolytic capacitor manufactured thereby

Publications (2)

Publication Number Publication Date
KR930014655A true KR930014655A (en) 1993-07-23
KR960010110B1 KR960010110B1 (en) 1996-07-25

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Application Number Title Priority Date Filing Date
KR1019920025662A KR960010110B1 (en) 1991-12-27 1992-12-24 Solid electrolytic capacitor and method making the same

Country Status (4)

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JP (1) JPH05182873A (en)
KR (1) KR960010110B1 (en)
DE (1) DE4243897A1 (en)
GB (1) GB2262840B (en)

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Publication number Priority date Publication date Assignee Title
KR100914891B1 (en) * 2007-12-21 2009-08-31 삼성전기주식회사 Solid electrolytic condenser and method for manufacturing the same

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JP4862204B2 (en) 2007-12-06 2012-01-25 三洋電機株式会社 Solid electrolytic capacitor
JP5041995B2 (en) 2007-12-07 2012-10-03 三洋電機株式会社 Solid electrolytic capacitor
JP5573396B2 (en) * 2010-06-15 2014-08-20 富士通株式会社 Solid electrolytic capacitor and power circuit

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Publication number Priority date Publication date Assignee Title
KR100914891B1 (en) * 2007-12-21 2009-08-31 삼성전기주식회사 Solid electrolytic condenser and method for manufacturing the same

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Publication number Publication date
GB2262840A (en) 1993-06-30
GB9226972D0 (en) 1993-02-17
KR960010110B1 (en) 1996-07-25
GB2262840B (en) 1995-10-11
JPH05182873A (en) 1993-07-23
DE4243897A1 (en) 1993-07-29

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