KR930011188A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device Download PDF

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Publication number
KR930011188A
KR930011188A KR1019910019690A KR910019690A KR930011188A KR 930011188 A KR930011188 A KR 930011188A KR 1019910019690 A KR1019910019690 A KR 1019910019690A KR 910019690 A KR910019690 A KR 910019690A KR 930011188 A KR930011188 A KR 930011188A
Authority
KR
South Korea
Prior art keywords
pad
lead frame
ring
wire bonding
semiconductor device
Prior art date
Application number
KR1019910019690A
Other languages
Korean (ko)
Other versions
KR940008340B1 (en
Inventor
김경섭
박범열
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019910019690A priority Critical patent/KR940008340B1/en
Publication of KR930011188A publication Critical patent/KR930011188A/en
Application granted granted Critical
Publication of KR940008340B1 publication Critical patent/KR940008340B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

반도체 소자(c)를 지지하기 위한 사각형의 다이패드(32)와; 상기 다이패드를 일단에서 지지하는 3개이상의 타이바(16)와; 그리고 상기 반도체 소자(c)의 칩 패드(7)를 와이어로 연결하는 다핀구조의 내부리이드(21)와로 구성되는 리이드 프레임에 있어서, 상기 다이패드(32)의 사각 네모서리에서 중앙까지 연장되는 타이 바(16)와, 상기 타이바의 내방으로 연장되도록 하는 내부 리이드(21)의 중앙부에 링 형태의 링 패드(4)를 형성하고, 상기링 패드(4)는 본딩 패드 영역으로 사용하여 이중으로 와이어 본딩을 하게 된다.A rectangular die pad 32 for supporting the semiconductor element c; Three or more tie bars 16 supporting the die pad at one end thereof; And a lead frame composed of a multi-pin internal lead 21 connecting the chip pad 7 of the semiconductor element c with a wire, wherein the tie extends from the rectangular corner of the die pad 32 to the center thereof. A ring-shaped ring pad 4 is formed at the center of the bar 16 and the inner lead 21 to extend inwardly of the tie bar, and the ring pad 4 is used as a bonding pad area to double the Wire bonding is performed.

따라서, 상기와 같은 링 형태의 링 패드를 설계함으로써 이중 와이어 본딩이나 이중 연속 와이어 본딩이 가능하게 되어 반도체 장치의 조립공정에서 생기게 되는 제반불량 발생을 방지할 수 있다.Therefore, by designing the ring pad as described above, double wire bonding or double continuous wire bonding can be performed, thereby preventing occurrence of various defects generated in the assembling process of the semiconductor device.

Description

반도체 장치용 리이드 프레임Lead frame for semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 이 발명에 링 패드(ring pad)의 리이드 프레임 평면도.3 is a plan view of a lead frame of a ring pad in the present invention.

제4도는 제3도에 나타낸 링 패드(ringpad)의 리이드 프레임 부분확대 단면도.4 is an enlarged cross-sectional view of a lead frame of the ring pad shown in FIG.

제5도 (가)는 제4도에 나타낸 링 패드의 이중본딩의 일실시예에 의한 리이드 프레임 부분확대 단면도, 제5도 (나)는 제4도에 나타낸 링 패드의 이중본딩의 다른 실시예에 의한 리이드 프레임부분확대 단면도.FIG. 5A is a cross-sectional enlarged cross-sectional view of a lead frame according to an embodiment of double bonding of a ring pad shown in FIG. 4, and FIG. 5B is another embodiment of double bonding of a ring pad shown in FIG. Lead frame part enlarged sectional view by

Claims (4)

반도체 소자(c)를 지지하기 위한 사각형의 다이패드(32)와; 상기 다이패드를 일단에서 지지하는 3개이상의 타이바(16)와; 그리고 상기 반도체 소자(c)의 칩 패드(7)를 와이어로 연결하는 다핀구조의 내부리이드(21)와로 구성되는 리이드 프레임에 있어서, 상기 다이패드(32)의 사각 네모서리에서 중앙까지 연장되는 타이 바(16)와, 상기 타이바의 내방으로 연장되도록 하는 내부 리이드(21)의 중앙부에 링 헝태의 링 패드(4)를 형성하고, 상기 링 패드(4)는 본딩 패드 영역으로 사용하여 이중으로 와이어 본딩을 하게 됨을 특징으로 하는 반도체 장치용 리이드 프레임.A rectangular die pad 32 for supporting the semiconductor element c; Three or more tie bars 16 supporting the die pad at one end thereof; And a lead frame composed of a multi-pin internal lead 21 connecting the chip pad 7 of the semiconductor element c with a wire, wherein the tie extends from the rectangular corner of the die pad 32 to the center thereof. A ring pad 4 of a ring shape is formed in the center of the bar 16 and the inner lead 21 which extends inwardly of the tie bar, and the ring pad 4 is used as a bonding pad area in a double manner. A lead frame for a semiconductor device, characterized in that the wire bonding. 제1항에 있어서, 상기 링 패드(4)는, 전도성을 갖는 폴리마이드 테이프를 사용함을 특징으로 하는 반도체장치용 리이드 프레임.The lead frame according to claim 1, wherein the ring pad (4) uses a conductive polyamide tape. 제1항에 있어서. 상기 링 패드(4)는, 링 패드(15), 절연성 테이프(50) 및 금속물질(60)의 구조를 적용하는 특징으로 하는 반도체 장치용 리이드 프레임.The method of claim 1. The ring pad (4) is a lead frame for a semiconductor device, characterized in that the structure of the ring pad (15), insulating tape (50) and the metal material (60). 제1항에 있어서, 와이어 본딩은, 이중으로 와이어 본딩을 하거나 이중 연속와이어 본딩중 어느 하나를 실시하게 됨을 특징으로 하는 반도체 장치용 리이드 프레임.The lead frame for a semiconductor device according to claim 1, wherein the wire bonding is performed by double wire bonding or double continuous wire bonding. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910019690A 1991-11-06 1991-11-06 Leadframe for semiconductor device KR940008340B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910019690A KR940008340B1 (en) 1991-11-06 1991-11-06 Leadframe for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910019690A KR940008340B1 (en) 1991-11-06 1991-11-06 Leadframe for semiconductor device

Publications (2)

Publication Number Publication Date
KR930011188A true KR930011188A (en) 1993-06-23
KR940008340B1 KR940008340B1 (en) 1994-09-12

Family

ID=19322368

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910019690A KR940008340B1 (en) 1991-11-06 1991-11-06 Leadframe for semiconductor device

Country Status (1)

Country Link
KR (1) KR940008340B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100352120B1 (en) * 1996-12-06 2003-01-24 앰코 테크놀로지 코리아 주식회사 Structure of lead frame and semiconductor package using the same
KR100861511B1 (en) * 2002-07-24 2008-10-02 삼성테크윈 주식회사 Lead Frame, Semi-Conductor Package therewith and Manufacturing Method for the Same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100352120B1 (en) * 1996-12-06 2003-01-24 앰코 테크놀로지 코리아 주식회사 Structure of lead frame and semiconductor package using the same
KR100861511B1 (en) * 2002-07-24 2008-10-02 삼성테크윈 주식회사 Lead Frame, Semi-Conductor Package therewith and Manufacturing Method for the Same

Also Published As

Publication number Publication date
KR940008340B1 (en) 1994-09-12

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