KR930010613A - 솔더 마스크(Solder Mask)의 형성방법 - Google Patents

솔더 마스크(Solder Mask)의 형성방법 Download PDF

Info

Publication number
KR930010613A
KR930010613A KR1019920020842A KR920020842A KR930010613A KR 930010613 A KR930010613 A KR 930010613A KR 1019920020842 A KR1019920020842 A KR 1019920020842A KR 920020842 A KR920020842 A KR 920020842A KR 930010613 A KR930010613 A KR 930010613A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
temperature
powder paint
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019920020842A
Other languages
English (en)
Korean (ko)
Inventor
요시까즈 야마가미
아끼오 가시하라
마모루 세이오
히사끼 다나베
Original Assignee
후지이 히로시
닛폰 페인트 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지이 히로시, 닛폰 페인트 가부시끼가이샤 filed Critical 후지이 히로시
Publication of KR930010613A publication Critical patent/KR930010613A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1355—Powder coating of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1019920020842A 1991-04-21 1992-11-06 솔더 마스크(Solder Mask)의 형성방법 Abandoned KR930010613A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP91-100956 1991-04-21
JP91-289839 1991-11-06
JP28983991 1991-11-06
JP10095692 1992-04-21

Publications (1)

Publication Number Publication Date
KR930010613A true KR930010613A (ko) 1993-06-22

Family

ID=26441890

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920020842A Abandoned KR930010613A (ko) 1991-04-21 1992-11-06 솔더 마스크(Solder Mask)의 형성방법

Country Status (6)

Country Link
EP (2) EP0541111B1 (cg-RX-API-DMAC7.html)
KR (1) KR930010613A (cg-RX-API-DMAC7.html)
CA (1) CA2082328A1 (cg-RX-API-DMAC7.html)
DE (1) DE69218341T2 (cg-RX-API-DMAC7.html)
SG (1) SG44517A1 (cg-RX-API-DMAC7.html)
TW (1) TW287247B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6584123B1 (en) * 2000-01-03 2003-06-24 At&T Corp. Apparatus for utilizing spare E1 channels

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5389497A (en) * 1992-06-03 1995-02-14 Nippon Paint Co., Ltd. Method for forming patterned solder mask
WO2005094147A1 (en) * 2004-03-25 2005-10-06 Dsm Ip Assets B.V. A process of forming a solder mask
WO2017183608A1 (ja) * 2016-04-19 2017-10-26 株式会社カネカ プリント配線板およびその製造方法
CN113453439B (zh) * 2021-07-15 2022-11-11 吉安满坤科技股份有限公司 一种传感控制Touch技术印制电路板及其制备方法
CN116600490B (zh) * 2023-06-13 2025-03-18 惠州市惠阳区嘉泰涂料有限公司 一种pcb印刷电路板阻焊层的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63246890A (ja) * 1987-04-02 1988-10-13 関西ペイント株式会社 プリント回路の形成方法
EP0286594A2 (de) * 1987-04-06 1988-10-12 Ciba-Geigy Ag Verfahren zur Herstellung von photostrukturierbaren Ueberzügen
GB8920540D0 (en) * 1989-09-11 1989-10-25 Coates Brothers Plc Resists

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6584123B1 (en) * 2000-01-03 2003-06-24 At&T Corp. Apparatus for utilizing spare E1 channels

Also Published As

Publication number Publication date
DE69218341T2 (de) 1997-08-07
EP0711105A2 (en) 1996-05-08
DE69218341D1 (de) 1997-04-24
CA2082328A1 (en) 1993-05-07
EP0541111B1 (en) 1997-03-19
EP0711105A3 (en) 1998-10-14
TW287247B (cg-RX-API-DMAC7.html) 1996-10-01
EP0541111A1 (en) 1993-05-12
SG44517A1 (en) 1997-12-19

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19921106

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19970821

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19921106

Comment text: Patent Application

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19990331

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee