KR930009351U - Flip chip testing device - Google Patents
Flip chip testing deviceInfo
- Publication number
- KR930009351U KR930009351U KR2019910017062U KR910017062U KR930009351U KR 930009351 U KR930009351 U KR 930009351U KR 2019910017062 U KR2019910017062 U KR 2019910017062U KR 910017062 U KR910017062 U KR 910017062U KR 930009351 U KR930009351 U KR 930009351U
- Authority
- KR
- South Korea
- Prior art keywords
- testing device
- flip chip
- chip testing
- flip
- testing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910017062U KR950000410Y1 (en) | 1991-10-14 | 1991-10-14 | Flip chip testing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910017062U KR950000410Y1 (en) | 1991-10-14 | 1991-10-14 | Flip chip testing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930009351U true KR930009351U (en) | 1993-05-26 |
KR950000410Y1 KR950000410Y1 (en) | 1995-01-25 |
Family
ID=19320541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019910017062U KR950000410Y1 (en) | 1991-10-14 | 1991-10-14 | Flip chip testing apparatus |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR950000410Y1 (en) |
-
1991
- 1991-10-14 KR KR2019910017062U patent/KR950000410Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950000410Y1 (en) | 1995-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20021223 Year of fee payment: 9 |
|
LAPS | Lapse due to unpaid annual fee |