KR930003582U - IC package forming device - Google Patents

IC package forming device

Info

Publication number
KR930003582U
KR930003582U KR2019910010434U KR910010434U KR930003582U KR 930003582 U KR930003582 U KR 930003582U KR 2019910010434 U KR2019910010434 U KR 2019910010434U KR 910010434 U KR910010434 U KR 910010434U KR 930003582 U KR930003582 U KR 930003582U
Authority
KR
South Korea
Prior art keywords
forming device
package forming
package
forming
Prior art date
Application number
KR2019910010434U
Other languages
Korean (ko)
Other versions
KR0116841Y1 (en
Inventor
방홍엽
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019910010434U priority Critical patent/KR0116841Y1/en
Publication of KR930003582U publication Critical patent/KR930003582U/en
Application granted granted Critical
Publication of KR0116841Y1 publication Critical patent/KR0116841Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019910010434U 1991-07-09 1991-07-09 Package forming apparatus KR0116841Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910010434U KR0116841Y1 (en) 1991-07-09 1991-07-09 Package forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910010434U KR0116841Y1 (en) 1991-07-09 1991-07-09 Package forming apparatus

Publications (2)

Publication Number Publication Date
KR930003582U true KR930003582U (en) 1993-02-26
KR0116841Y1 KR0116841Y1 (en) 1998-04-22

Family

ID=19316168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910010434U KR0116841Y1 (en) 1991-07-09 1991-07-09 Package forming apparatus

Country Status (1)

Country Link
KR (1) KR0116841Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100359144B1 (en) * 1995-10-25 2003-01-15 우에노 세이끼 가부시키가이샤 Method of bending outside leads of semiconductor package and an apparatus therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100359144B1 (en) * 1995-10-25 2003-01-15 우에노 세이끼 가부시키가이샤 Method of bending outside leads of semiconductor package and an apparatus therefor

Also Published As

Publication number Publication date
KR0116841Y1 (en) 1998-04-22

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