KR930009043A - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
KR930009043A
KR930009043A KR1019910018873A KR910018873A KR930009043A KR 930009043 A KR930009043 A KR 930009043A KR 1019910018873 A KR1019910018873 A KR 1019910018873A KR 910018873 A KR910018873 A KR 910018873A KR 930009043 A KR930009043 A KR 930009043A
Authority
KR
South Korea
Prior art keywords
semiconductor device
semiconductor chip
bonding pads
bonded
inner leads
Prior art date
Application number
KR1019910018873A
Other languages
Korean (ko)
Inventor
김경섭
정현조
권오식
윤종상
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019910018873A priority Critical patent/KR930009043A/en
Publication of KR930009043A publication Critical patent/KR930009043A/en

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Abstract

내부리드의 일단을 절곡시켜 본딩패드에 본딩시키고 절곡되지 않은 부분을 상기 테이프의 두께만큼 이격되어 반도체칩과 수평을 이루도록 하여 단락을 방지하며, 또한 열팽창계수가 반도체칩과 내부리드들의 중간이 도전성 금속층을 본딩패드들과 본딩되는 내부리드들에 형성도어 응력을 완충한다. 따라서 반도체칩과 내부리드들을 테이프의 두께만큼만 이격시키므로 패키지의 박형화에 유리하며, 또한 본딩패드들과 내부리드들 사이의 응력을 완충하여 본딩된 것이 떨어지는 것을 방지할 수 있다.One end of the inner lead is bent and bonded to the bonding pad, and the unfolded portion is spaced apart by the thickness of the tape so as to be parallel to the semiconductor chip to prevent short circuit, and the thermal expansion coefficient between the semiconductor chip and the inner lead is a conductive metal layer. It buffers the formed door stress on the inner leads to be bonded to the bonding pads. Therefore, since the semiconductor chip and the inner leads are separated only by the thickness of the tape, it is advantageous for the thinning of the package, and also it is possible to buffer the stress between the bonding pads and the inner leads to prevent the bond from falling.

Description

반도체장치Semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 이 발명에 따른 반도체장치의 평면도2 is a plan view of a semiconductor device according to the present invention.

제3도는 제2도를 A-A'선으로 자른 단면도이다3 is a cross-sectional view taken along the line A-A 'of FIG.

Claims (5)

반도체장치에 있어서, 다수의 본딩패드들을 가지는 반도체칩과, 상기 본딩패드들과 반도체칩의 모서리 사이에 위치한 절연성 테이프와, 상기 절연성 테이프를 개재시켜 절곡된 일단이 본딩패드들과 본딩되며 나머지 부분은 상기 반도체칩과 수평을 이루는 내부리드들을 구비한 반도체장치.In a semiconductor device, a semiconductor chip having a plurality of bonding pads, an insulating tape positioned between the bonding pads and an edge of the semiconductor chip, and one end bent through the insulating tape are bonded to the bonding pads, and the remaining portions are bonded to the bonding pads. A semiconductor device having internal leads parallel to the semiconductor chip. 제1항에 있어서, 상기 절연성 테이프가 1~8mil 정도의 두께를 가지는 반도체장치.The semiconductor device of claim 1, wherein the insulating tape has a thickness of about 1 to 8 mils. 제1항에 있어서, 상기 내부리드들의 본딩도는 부분에 열팽창계수가 반도체칩과 내부리드들의 중간정도인 도전성 금속층이 형성된 반도체장치.The semiconductor device of claim 1, wherein a bonding degree of the inner leads is formed at a portion of which a conductive metal layer having a thermal expansion coefficient approximately between the semiconductor chip and the inner leads is formed. 제3항에 있어서, 상기 도전성 금속층이 Ag로 이루어진 반도체장치.4. The semiconductor device of claim 3, wherein the conductive metal layer is made of Ag. 제3항에 있어서, 상기 도전성 금속층이 도금되어 형성된 반도체장치.The semiconductor device of claim 3, wherein the conductive metal layer is plated. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910018873A 1991-10-25 1991-10-25 Semiconductor device KR930009043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910018873A KR930009043A (en) 1991-10-25 1991-10-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910018873A KR930009043A (en) 1991-10-25 1991-10-25 Semiconductor device

Publications (1)

Publication Number Publication Date
KR930009043A true KR930009043A (en) 1993-05-22

Family

ID=67348284

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910018873A KR930009043A (en) 1991-10-25 1991-10-25 Semiconductor device

Country Status (1)

Country Link
KR (1) KR930009043A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100428467B1 (en) * 2001-04-09 2004-04-27 곽영대 The fixed tool of spout-hose

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100428467B1 (en) * 2001-04-09 2004-04-27 곽영대 The fixed tool of spout-hose

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E601 Decision to refuse application