KR930009043A - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- KR930009043A KR930009043A KR1019910018873A KR910018873A KR930009043A KR 930009043 A KR930009043 A KR 930009043A KR 1019910018873 A KR1019910018873 A KR 1019910018873A KR 910018873 A KR910018873 A KR 910018873A KR 930009043 A KR930009043 A KR 930009043A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- semiconductor chip
- bonding pads
- bonded
- inner leads
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
내부리드의 일단을 절곡시켜 본딩패드에 본딩시키고 절곡되지 않은 부분을 상기 테이프의 두께만큼 이격되어 반도체칩과 수평을 이루도록 하여 단락을 방지하며, 또한 열팽창계수가 반도체칩과 내부리드들의 중간이 도전성 금속층을 본딩패드들과 본딩되는 내부리드들에 형성도어 응력을 완충한다. 따라서 반도체칩과 내부리드들을 테이프의 두께만큼만 이격시키므로 패키지의 박형화에 유리하며, 또한 본딩패드들과 내부리드들 사이의 응력을 완충하여 본딩된 것이 떨어지는 것을 방지할 수 있다.One end of the inner lead is bent and bonded to the bonding pad, and the unfolded portion is spaced apart by the thickness of the tape so as to be parallel to the semiconductor chip to prevent short circuit, and the thermal expansion coefficient between the semiconductor chip and the inner lead is a conductive metal layer. It buffers the formed door stress on the inner leads to be bonded to the bonding pads. Therefore, since the semiconductor chip and the inner leads are separated only by the thickness of the tape, it is advantageous for the thinning of the package, and also it is possible to buffer the stress between the bonding pads and the inner leads to prevent the bond from falling.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 이 발명에 따른 반도체장치의 평면도2 is a plan view of a semiconductor device according to the present invention.
제3도는 제2도를 A-A'선으로 자른 단면도이다3 is a cross-sectional view taken along the line A-A 'of FIG.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910018873A KR930009043A (en) | 1991-10-25 | 1991-10-25 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019910018873A KR930009043A (en) | 1991-10-25 | 1991-10-25 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR930009043A true KR930009043A (en) | 1993-05-22 |
Family
ID=67348284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910018873A KR930009043A (en) | 1991-10-25 | 1991-10-25 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR930009043A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100428467B1 (en) * | 2001-04-09 | 2004-04-27 | 곽영대 | The fixed tool of spout-hose |
-
1991
- 1991-10-25 KR KR1019910018873A patent/KR930009043A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100428467B1 (en) * | 2001-04-09 | 2004-04-27 | 곽영대 | The fixed tool of spout-hose |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |