KR930003872Y1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR930003872Y1 KR930003872Y1 KR2019900019502U KR900019502U KR930003872Y1 KR 930003872 Y1 KR930003872 Y1 KR 930003872Y1 KR 2019900019502 U KR2019900019502 U KR 2019900019502U KR 900019502 U KR900019502 U KR 900019502U KR 930003872 Y1 KR930003872 Y1 KR 930003872Y1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- heat sink
- semiconductor chip
- tab tape
- tab
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP150344/1 | 1989-12-26 | ||
JP1989150344U JPH0388350U (US07922777-20110412-C00004.png) | 1989-12-26 | 1989-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910013038U KR910013038U (ko) | 1991-07-30 |
KR930003872Y1 true KR930003872Y1 (ko) | 1993-06-23 |
Family
ID=15494942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019900019502U KR930003872Y1 (ko) | 1989-12-26 | 1990-12-11 | 반도체 장치 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0388350U (US07922777-20110412-C00004.png) |
KR (1) | KR930003872Y1 (US07922777-20110412-C00004.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101301782B1 (ko) * | 2011-03-30 | 2013-08-29 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그 제조 방법 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5243364A (en) * | 1975-10-01 | 1977-04-05 | Hitachi Ltd | Power semiconductor device and process for production of same |
JPH01304738A (ja) * | 1988-06-01 | 1989-12-08 | Mitsubishi Electric Corp | 半導体装置のパッケージ構造 |
-
1989
- 1989-12-26 JP JP1989150344U patent/JPH0388350U/ja active Pending
-
1990
- 1990-12-11 KR KR2019900019502U patent/KR930003872Y1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101301782B1 (ko) * | 2011-03-30 | 2013-08-29 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPH0388350U (US07922777-20110412-C00004.png) | 1991-09-10 |
KR910013038U (ko) | 1991-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20040609 Year of fee payment: 12 |
|
LAPS | Lapse due to unpaid annual fee |