KR920014717A - Plating wastewater treatment system for semiconductor products - Google Patents

Abstract

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Description

Plating wastewater treatment system for semiconductor products

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FIG. 1 is a schematic diagram showing a wastewater generated in a plating process of a semiconductor product by a conventional chemical treatment method, and FIG. 2 is a schematic diagram showing a plating wastewater treatment system for semiconductor products according to an embodiment of the present invention. Figures 4 and 5 show the plating wastewater treatment system shown in FIG. 2 in detail, and FIG. 4 and FIG. 5 show the copper-containing state before and after passing through the heavy metal recovery device shown in FIG.

Claims (7)

In the plating wastewater treatment apparatus for treating a large amount of wastewater containing copper, tin, lead, and non-metals and other impurities of heavy metals according to the surface treatment process of a semiconductor product, the wastewater is a copper-containing wastewater and tin / man A heavy metal recovery device (4) and the tin / lead containing wastewater, which are separated into wastewater and nonmetallic wastewater, and the copper-containing wastewater is recovered using copper ion exchange resin and electroplating to produce treated water that meets the water quality standards. Membrane separation treatment device 5 for generating sludge cake treatment and water treatment standards using the membrane module, and generating the supernatant water suitable for treatment and sludge cake treatment using the non-metallic waste water sedimentation tank. The small continuous chemical treatment device 6 and the high concentration waste plating solution and the pairing solution are subjected to batch treatment to treat the supernatant with the small continuous chemical treatment device. 6) each of the wastewater treatment by the ash analysis processing device (9) to be sent to the final reservoir (7), and the treated water of the final reservoir (7) by using a re-recovery device (8) Plating a semiconductor product, which is configured to generate water as the flushing water in the etching process, the flushing water in the chemical polishing process, and the final flushing water in the plating process, and to discharge only about 10% of the inflow water corresponding to the wastewater quality. Wastewater treatment system. 2. The heavy metal recovery device (4) according to claim 1, wherein the heavy metal recovery device (4) includes a collecting tank (10) for storing a large amount of copper-containing waste water and a pH adjustment, and a pH adjusting tank (11) for adjusting pH for proper regeneration. Micro filter (12) and activated carbon filter (13) to remove impurities, complex ion exchange resin tower (14) and regenerant to pass adsorption ion exchange resin during regeneration to produce copper that adsorbs and removes water to meet water quality standards Plating wastewater treatment system for a semiconductor product, characterized in that consisting of a regeneration waste water tank (15) and an electrolytic bath (16) for recovering the copper plate (16). The plating wastewater treatment system for semiconductor products according to claim 2, wherein the copper-containing wastewater is wastewater generated in a PCB manufacturing process. 2. The thin film separation apparatus (5) according to claim 1, wherein the thin-film separation apparatus (5) includes a collecting tank (21) for storing a large amount of tin / lead-containing wastewater and uniformizing the concentration, and a pH adjusting reactor (22) for adjusting and increasing the pH. (23), the membrane module 24 for producing the production water and concentrated water by removing particles of 0.1㎛ or more, and a dehydrator 25 for treating with sludge cake and returning the dehydrated water to another treatment device, characterized in that Plating wastewater treatment system for semiconductor products. 5. The plating wastewater treatment system for semiconductor products according to claim 4, wherein the membrane module (24) is made of a membrane having pores of 0.1 mu m for use in other wastewater treatment. According to claim 1, wherein the small continuous chemical treatment apparatus 6 is characterized in that the reaction tank 32, the flocculation tank 33 and the settling tank 34 are not separated into one and treated as soon as they are introduced rather than stagnant. Plating wastewater treatment system for semiconductor products. 2. The plating wastewater for semiconductor products according to claim 1, wherein the reclaiming device (8) comprises a low pressure reverse osmosis device (42), a high pressure reverse osmosis device (46), and a mixed phase ion exchange resin (47). Processing system. ※ Note: This is to be disclosed by the original application.