KR920011677A - Process of ejector pin hole in cavity block of semiconductor mold - Google Patents

Process of ejector pin hole in cavity block of semiconductor mold Download PDF

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Publication number
KR920011677A
KR920011677A KR1019900020597A KR900020597A KR920011677A KR 920011677 A KR920011677 A KR 920011677A KR 1019900020597 A KR1019900020597 A KR 1019900020597A KR 900020597 A KR900020597 A KR 900020597A KR 920011677 A KR920011677 A KR 920011677A
Authority
KR
South Korea
Prior art keywords
ejector pin
pin hole
resin
cavity block
package
Prior art date
Application number
KR1019900020597A
Other languages
Korean (ko)
Other versions
KR930010752B1 (en
Inventor
곽노권
Original Assignee
곽노권
주식회사 한미금형
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 곽노권, 주식회사 한미금형 filed Critical 곽노권
Priority to KR1019900020597A priority Critical patent/KR930010752B1/en
Publication of KR920011677A publication Critical patent/KR920011677A/en
Application granted granted Critical
Publication of KR930010752B1 publication Critical patent/KR930010752B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/26—Moulds or cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Abstract

내용 없음No content

Description

반도체 금형의 캐비티 블록내에 이젝터 핀 호울을 가공하는 방법Process of ejector pin hole in cavity block of semiconductor mold

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 반도체 금형의 캐비티 블록(CAVITY BLOCK)부위에 대한 예시도, 제3도는 숄더(SHOULDER)가 개량된 반도체 팩키지(PACKAGE)에 대한 예시도, 제4도는 이젝터 핀이 팩키지를 캐비티블럭으로부터 분리시킬때에 잔폐물이 형성되는 이유를 설명하기 위한 도면, 제7도는 본 발명에 따른 이젝터 핀 작동시의 캐피티 블록과 밀착상태를 도시한 도면, 제9도는 명세서 중 표(1) 및 표(2)의 조건하에서 이젝터 핀과 호울 틈새와 에폭시 수지 누출거리와의 관계를 나타내는 그래프이다.FIG. 1 illustrates an example of a cavity block of a semiconductor mold, and FIG. 3 illustrates an example of a semiconductor package having an improved shoulder. FIG. 4 illustrates an ejector pin separating a package from a cavity block. Figure 7 is a view for explaining the reason why the residue is formed when, Figure 7 is a view showing a state of close contact with the capacitive block during the ejector pin operation according to the present invention, Figure 9 is a table (1) and table ( This graph shows the relationship between ejector pin and hole clearance and epoxy resin leakage distance under the conditions of 2).

Claims (2)

반도체 팩키지 성형용 모울드 금형의 캐비티 블럭으로부터 팩키지를 분리시켜 주기 위한 이젝터 핀이 승강되어지도록 이젝터 핀 호울을 성형시키는 방법에 있어서, 상기 이젝터 핀 (10)과 이젝터 핀 호울 (15)간의 최대 틈새는 에폭시수지 혼합물(17)이 흘러들어갈 수 있는 틈새(0.007∼0.013㎜)를 유지시키며, 이젝터 핀 호울(15) 표면은 중심선 평균거칠기 (RA = 0.8 ∼3.0㎛)로 거칠게 가공하여, 레진 브리드 (16)가 반도체 백키지(13) 면에 붙어 있는 면적보다 이젝터 핀 호울 (15)표면적이 더 넓어서 이젝터 핀 (10) 승강시 레진브리드가 이젝터 핀 호울에 고착된 힘이 더 큼에 따라 팩키지 상하면에는 형성되지 않도록 한 것을 특징으로 하는 반도체 금형의 캐비티 블록내에 이젝터 핀 호울을 가공하는 방법.In the method of forming the ejector pin hole so that the ejector pin for lifting the package from the cavity block of the mold mold for semiconductor package molding is lifted, the maximum gap between the ejector pin 10 and the ejector pin hole 15 is epoxy The resin mixture 17 maintains a gap (0.007 to 0.013 mm) through which the resin mixture 17 can flow, and the surface of the ejector pin hole 15 is roughened to have a centerline average roughness (RA = 0.8 to 3.0 µm), so that the resin bleed (16) Has a larger surface area on the ejector pin hole (15) than the area attached to the surface of the semiconductor back package (13), so that when the ejector pin (10) is lifted up, the resin bridging is greater on the ejector pin hole, And processing the ejector pin holes in the cavity block of the semiconductor mold. 제1항에 있어서, 레진브리드가 이미 형성된 때에는 이젝터 핀(10)이 캐비티블럭(14)에서 이젝트될 때 레진브리드(16)가 반도체 팩키지(13)면에서 떨어져 이젝터 핀 호울(15)에 그대로 남게 하여 이젝터 핀(10)과 레진브리드(16)사이의 틈새를 극소화시켜 주도록 하므로써 다음 팩키지 가공시 레진브리드형성이 방지되도록 하는 것을 특징으로 하는 반도체 금형의 캐비티 블록내에 이젝터 핀 호울을 가공하는 방법.The method of claim 1, wherein when the resin bridging has already been formed, the resin bridging 16 is separated from the semiconductor package 13 surface and remains in the ejector pin hole 15 when the ejector pin 10 is ejected from the cavity block 14. And minimizing the gap between the ejector pins (10) and the resin bridging (16), thereby preventing resin bridging during the next package processing. ※ 참고사항：최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900020597A 1990-12-14 1990-12-14 Ejector pin holl processing method of semiconductor molding cavity block KR930010752B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900020597A KR930010752B1 (en) 1990-12-14 1990-12-14 Ejector pin holl processing method of semiconductor molding cavity block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900020597A KR930010752B1 (en) 1990-12-14 1990-12-14 Ejector pin holl processing method of semiconductor molding cavity block

Publications (2)

Publication Number Publication Date
KR920011677A true KR920011677A (en) 1992-07-24
KR930010752B1 KR930010752B1 (en) 1993-11-10

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Application Number Title Priority Date Filing Date
KR1019900020597A KR930010752B1 (en) 1990-12-14 1990-12-14 Ejector pin holl processing method of semiconductor molding cavity block

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KR (1) KR930010752B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102245770B1 (en) 2013-10-29 2021-04-28 삼성전자주식회사 Semiconductor Package Device

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KR930010752B1 (en) 1993-11-10

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