KR920011307A - Manufacturing method of high density multilayer printed circuit board - Google Patents

Manufacturing method of high density multilayer printed circuit board Download PDF

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Publication number
KR920011307A
KR920011307A KR1019900018261A KR900018261A KR920011307A KR 920011307 A KR920011307 A KR 920011307A KR 1019900018261 A KR1019900018261 A KR 1019900018261A KR 900018261 A KR900018261 A KR 900018261A KR 920011307 A KR920011307 A KR 920011307A
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KR
South Korea
Prior art keywords
pattern
primary
adhesive
circuit board
printed circuit
Prior art date
Application number
KR1019900018261A
Other languages
Korean (ko)
Other versions
KR930000640B1 (en
Inventor
김용길
Original Assignee
김용길
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김용길 filed Critical 김용길
Priority to KR1019900018261A priority Critical patent/KR930000640B1/en
Publication of KR920011307A publication Critical patent/KR920011307A/en
Application granted granted Critical
Publication of KR930000640B1 publication Critical patent/KR930000640B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

내용 없음No content

Description

고밀도 다층 인쇄회로기판의 제조방법Manufacturing method of high density multilayer printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 고밀도 다층 인쇄회로기판의 제조과정을 개략적으로 도시한 도면이다.1 is a view schematically illustrating a manufacturing process of a high density multilayer printed circuit board according to the present invention.

Claims (3)

a) 세라믹 또는 전도성 재료로된 모재에 절연피막층을 형성시키고: b) 절연피막층이 형성된 모재와 제1동박판에 접착제를 도포하여 열간압착시켜 1차기재를 제조하고: c) 상기 1차기재의 동박면에 레지스트에 의한 배선패턴을 형성하고, 상기의 동박면의 전면에 감광제 및 내부식성 코팅제를 도포하여 노광 및 에칭한후 상기의 코팅제를 제거하여 1차패턴을 만들며 : d) 상기 1차패턴위에 글라스울과 제2동박판을 접착제로서 도포하여 접착시켜 2차기재를 제조하고 : e) 상기의 (c)단계와 같은 방법을 이용하여 상기의 1차기재에 1차패턴을 만들며 : f) 상기의 1차패턴과 1차패턴을 소정의 연결수단을 이용하여 연결시켜 다층을 형성시킴을 특징으로하는 고밀도 다층 인쇄회로기판의 제조방법.a) forming an insulating film layer on a base material made of ceramic or conductive material: b) applying an adhesive to the base material and the first copper plate on which the insulating film layer is formed and hot pressing to prepare a primary material: c) of the primary material Forming a wiring pattern by resist on the copper foil surface, applying a photosensitive agent and a corrosion-resistant coating agent on the entire surface of the copper foil surface, exposing and etching, and removing the coating agent to make a primary pattern: d) the primary pattern Applying a glass wool and a second copper plate on the adhesive as an adhesive to prepare a secondary substrate: e) making a primary pattern on the primary substrate using the same method as in step (c): f) A method of manufacturing a high density multilayer printed circuit board, characterized in that to form a multilayer by connecting the primary pattern and the primary pattern using a predetermined connection means. 제1항에 있어서, 상기의 1차패턴과 2차패턴은 레이져용접에 의해 상호 연결됨을 특징으로 하는 고밀도 다층 인쇄회로기판의 제조방법.The method of claim 1, wherein the first pattern and the second pattern are interconnected by laser welding. 제1항에 있어서, 상기의 1차패턴 및 2차패턴은 초음파 용접에 의해 상호 연결됨을 특징으로 하는 고밀도 다층 인쇄회로기판의 제조방법.The method of claim 1, wherein the primary pattern and the secondary pattern are interconnected by ultrasonic welding. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900018261A 1990-11-12 1990-11-12 Manufacturing method of multi layer printed circuit board KR930000640B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900018261A KR930000640B1 (en) 1990-11-12 1990-11-12 Manufacturing method of multi layer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900018261A KR930000640B1 (en) 1990-11-12 1990-11-12 Manufacturing method of multi layer printed circuit board

Publications (2)

Publication Number Publication Date
KR920011307A true KR920011307A (en) 1992-06-27
KR930000640B1 KR930000640B1 (en) 1993-01-28

Family

ID=19305898

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900018261A KR930000640B1 (en) 1990-11-12 1990-11-12 Manufacturing method of multi layer printed circuit board

Country Status (1)

Country Link
KR (1) KR930000640B1 (en)

Also Published As

Publication number Publication date
KR930000640B1 (en) 1993-01-28

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