KR920011303A - Printed wiring boards, printed circuit boards and electronic devices - Google Patents

Printed wiring boards, printed circuit boards and electronic devices Download PDF

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Publication number
KR920011303A
KR920011303A KR1019910020132A KR910020132A KR920011303A KR 920011303 A KR920011303 A KR 920011303A KR 1019910020132 A KR1019910020132 A KR 1019910020132A KR 910020132 A KR910020132 A KR 910020132A KR 920011303 A KR920011303 A KR 920011303A
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KR
South Korea
Prior art keywords
printed wiring
terminals
hole
electronic
wiring board
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Application number
KR1019910020132A
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Korean (ko)
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KR100245633B1 (en
Inventor
다까시 우에끼
가쓰히도 사까이
고오이찌 간다
히데오 가미야
Original Assignee
후지이 레이지
도오교오 가스 가부시기가시야
아오끼 겐조오
아이찌 도께이 덴끼 가부시기가이샤
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Publication of KR920011303A publication Critical patent/KR920011303A/en
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Publication of KR100245633B1 publication Critical patent/KR100245633B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F7/00—Volume-flow measuring devices with two or more measuring ranges; Compound meters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
    • G01F1/20—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow
    • G01F1/32—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow using swirl flowmeters
    • G01F1/3227—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow using swirl flowmeters using fluidic oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10863—Adaptations of leads or holes for facilitating insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Volume Flow (AREA)

Abstract

내용 없음No content

Description

인쇄배선판, 인쇄회로기판 및 전자장치Printed wiring boards, printed circuit boards and electronic devices

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제6도는 인쇄배선판과 유체가스계량기를 결합한 본 발명의 실시예를 도시한 투시도, 제14도는 인쇄배선판과 유체가스계량기의 또 다른 실시예를 도시한 투시도, 제15도는 인쇄배선판이 유체가스계량기에 설치되고 이의 단말이 인쇄배선판의 관통구멍에 고정된 상태에서 제14도의 실시예를 도시한 배면도.6 is a perspective view showing an embodiment of the present invention in which a printed wiring board and a fluid gas meter are combined, and FIG. 14 is a perspective view showing another embodiment of a printed wiring board and a fluid gas meter, and FIG. 15 is a printed wiring board in a fluid gas meter. Back view showing the embodiment of FIG. 14 with its terminal fixed to the through hole of the printed wiring board.

Claims (12)

절연판(4)의 하나의 면에 형성되어 도체로 만들어진 각각의 도체패턴(2)과 랜드(3) (land)을 구성하는 인쇄배선판(124)에 있어서, 전자 부품용 관통구명(9)은 랜드에 형성되어 있고 절연판을 관통하는 V자 모양의 안내글 루우브는 관통구멍과 연통하도록 형성되어 있으며 구멍은 안내글루오브의 확대단의 절연판에 형성되어 있는 것을 특징으로 하는 인쇄배선판.In the printed wiring board 124 formed on one surface of the insulating plate 4 and constituting each of the conductor patterns 2 and lands 3 made of a conductor, the through hole names 9 for electronic components are lands. And a V-shaped guide groove which is formed in the through hole and communicates with the through hole, and the hole is formed in the insulating plate of the enlarged end of the guide glue of the printed wiring board. 제1항에 있어서, 다수의 관통구멍(9) 및 V자모양의 안내글루우브(10)가 절연판에 마련되어 있고 각각의 관통구멍은 상응하는 하나의 V자 모양의 안내글루우브와 연통되어 있고 V자 모양의 안내글루우브들은 세로가 같은 방향을 향하는 것을 특징으로 하는 인쇄배선판.2. A plurality of through holes (9) and V-shaped guide grooves (10) are provided in the insulating plate, each through hole being in communication with a corresponding one V-shaped guide groove. The shaped guide grooves are printed wiring boards characterized in that the vertical direction is in the same direction. 제1항 또는 제2항중 한항에 있어서, 전자부품 및/또는 장치를 포함하는 인쇄회로기판에 있어서, 전자부품 및/또는 장치의 단자가 인쇄배선판의 상응하는 구멍에 끼워지도록 인쇄기판에 전기적으로 연결되어 있고 전자부품 및/또는 장치는 단말이 인쇄배선판의 관통구멍에 들어가도록 인쇄배선기판에 대해 이동한 후 단자가 납땜에 의해 랜드에 접착되는 것을 특징으로 하는 인쇄배선판.The printed circuit board according to claim 1, wherein the printed circuit board comprises electronic components and / or devices, wherein the terminals of the electronic components and / or devices are electrically connected to the printed board so that the terminals of the electronic components and / or devices are inserted into corresponding holes of the printed wiring board. And the electronic component and / or device are moved relative to the printed wiring board so that the terminal enters the through hole of the printed wiring board, and then the terminals are bonded to the land by soldering. 제1항 또는 제2항중 한항에 있어서, 전자장치은 프레임에 기계적으로 정확히 고정된 전자부품 및/또는 장치 (13-17)을 포함하고 전자부품 및/또는 장치의 단자들은 납땜에 의해 인쇄배선판의 랜드에 접착되어 있는 것을 특징으로 하는 인쇄배선판.3. An electronic device according to any one of the preceding claims, wherein the electronic device comprises electronic components and / or devices (13-17) mechanically fixed to the frame and the terminals of the electronic components and / or devices are soldered to lands of the printed wiring board. Printed wiring board, characterized in that bonded to. 유체소자, 차단밸브(13), 압력스위치(16), 흐름센서(14), 압전필름센서(13), 전자회로유닛(17), 모기판으로서 역활을 하는 배선판이 마련된 흐름로구조에 있어서 각각의 차단밸브, 압력스위치 흐름센서 및 압전필름 센서는 흐름로구조에 고정되어 있고 전자회로유닛은 계수판 및 제어회로판(20)을 구성하는 계수판은 흐름센서 및 압전필름센서의 흐름비율신호를 계수하는 전자회로뿐 아니라 소비된 가스량을 표시하는 액정디스플레이장치(18)가 설치되어 있과 제어회로판은 차단밸브를 제어하는 제어회로에 설치되어 있는 유체가스계량기에 있어서, 각각의 차단밸브, 압력스위치, 흐름센서, 압전필름센서 및 전자회로유닛에는 인쇄배선판에 수직으로 연장한 다수의 단말이 마련되어 있고 인쇄배선판에는 단자들 사이를 서로 연결하는 인쇄회로가 마련되어 있고 단자들은 인쇄배선판과 전기적으로 연결되어 있는 것을 특징으로 하는 유제가스계량기.In a flow path structure in which a fluid element, a shutoff valve 13, a pressure switch 16, a flow sensor 14, a piezoelectric film sensor 13, an electronic circuit unit 17, and a wiring board serving as a mother substrate are provided. The shutoff valve, the pressure switch flow sensor and the piezoelectric film sensor are fixed to the flow path structure, and the electronic circuit unit comprises the counter plate and the control circuit board 20 to count the flow rate signals of the flow sensor and the piezoelectric film sensor. The liquid crystal display device 18 is provided which displays not only the electronic circuit but also the amount of gas consumed. The control circuit board has a fluid gas meter installed in the control circuit for controlling the shutoff valve. The flow sensor, the piezoelectric film sensor, and the electronic circuit unit are provided with a plurality of terminals extending perpendicular to the printed wiring board, and the printed circuit board is provided with a printed circuit connecting the terminals to each other. And terminals emulsions gas meter, characterized in that connected to the printed circuit board and electrically. 제5항에 있어서, 각각의 차단밸브(13), 압력스위치(16), 흐름센서(14), 압전필름센서(13) 및 전자회로(17)의 다수의 단말들은 서로가 평행이 되도록 수평면과 수직평면중 하나에 위치되어 있는 것을 특징으로 하는 유제가스계량기.A plurality of terminals of each of the shut-off valves 13, the pressure switch 16, the flow sensor 14, the piezoelectric film sensor 13 and the electronic circuit 17 is a horizontal plane and Emulsion gas meter, characterized in that located in one of the vertical plane. 제5항 및 제6항중 한항에 있어서, 전자회로유닛은 흐름로주조(25)의 윗쪽에 위치하고 흐름센서 및 압전필름 센서는 직렬로 흐름로구조의 유출구측에 위치되어 있는 것을 특징으로 하는 유제가스계량기.Emulsion gas according to any one of claims 5 and 6, wherein the electronic circuit unit is located above the flow furnace casting 25, and the flow sensor and the piezoelectric film sensor are located in the outlet side of the flow path structure in series. meter. 제5항에 있어서, 안내구멍은 인쇄배선판의 중심에 형성되어 있고 흐름로구조(25)에는 안내구멍에 고정된 안내측이 마련되어 있는 것을 특징으로 하는 유제가스계량기.6. The emulsion gas meter according to claim 5, wherein the guide hole is formed at the center of the printed wiring board, and the flow path structure (25) is provided with a guide side fixed to the guide hole. 제7항에 있어서, 인쇄배선판(124)에는 신호를 외부측에 전송하는 외부단자가 마련되어 있는 것을 특징으로 하는 유제가스계량기.8. The emulsion gas meter according to claim 7, wherein the printed wiring board is provided with an external terminal for transmitting a signal to the outside. 절연판(1)의 제1주부분, 액정디스플레이부분이 마련된 상기 제1주부분 및 절연판의 제2주부분, 회로부분이 마련된 제2주부분, 절연판이 제1주부분과 제2주부분 사이에 샌드위치된 제1 제2주부분과 경계부분에서 분리되도록 제1주부분과 분리되어 절연판을 이동시키는 제2주부분을 포함하는 전자회로 유닛에 있어서, 하나의 조그마한 연결부분이 인접구멍 사이에 놓이도록 다수의 구멍이 절연판을 이동시키는 방향을 따라 경계부분에 형성되어 있고 액정디스플레이 부분이 제1주부분위에 형성되고 회로부분이 제2주부분에 형성되어 있고 액정디스플레이부분과 회로부분이 평면케이블과 가요성 인쇄판과 같은 하나의 연결부재를 통해 서로가 전기적으로 연결된 후 연결부재가 서로에게서 제1 및 제2주부분을 분리하도록 굽어져 있는 것을 특징으로 하는 전자회로 유닛.The first main portion of the insulating plate 1, the first main portion provided with the liquid crystal display portion and the second main portion of the insulating plate, the second main portion provided with the circuit portion, the insulating plate sandwiched between the first main portion and the second main portion An electronic circuit unit comprising a first first main portion and a second main portion separated from the first main portion to move the insulating plate so as to be separated from the boundary portion, wherein a plurality of holes are formed so that one small connecting portion is placed between adjacent holes. The liquid crystal display part is formed on the first main part, the circuit part is formed on the second main part, and the liquid crystal display part and the circuit part are formed on the flat cable and the flexible printed plate. Characterized in that the connecting members are bent to separate the first and second main parts from each other after they are electrically connected to each other through the same one connecting member. Unit as a subsidiary. 제10항에 있어서, 부분과 구멍을 연결하는 결합이 절연판을 이동시키는 방향으로 부분과 구멍을 연결하는 결합에 평행이 되도록 절연판에 추가적으로 형성되어 있고 구멍들중 하나의 단이 절연판의 면 에지에 형성되어 있는 것을 특징으로 하는 전자회로 유닛.12. The insulating plate according to claim 10, wherein the coupling connecting the portion and the hole is further formed in the insulating plate such that the coupling connecting the portion and the hole is parallel to the coupling connecting the portion and the hole, and one end of the holes is formed at the face edge of the insulating plate. An electronic circuit unit, characterized in that. 코드의 도선을 전자계량기에 연결하는 연결구조는 다수의 단자가 마련된 전자계량기, 상기 단자는 소정의 간격으로 직선을 따라 배열되어 있고 노치(124-127)는 V자모양의 구멍과 각각의 단자에 형성된 V자 모양의 바닥에서 연장한 좁은 구멍을 형성하여 V자모양의 구멍이 각각의 단말의 윗쪽에 형성되고 단말의 좁은 구멍이 서로가 평행이 되고 한쌍의 평행돌출부(308b), (308c)가 마련된 유지부재를 포함하고 각각의 돌출부는 죔부분으로 사용하기 위해 소정의 간격에서 다수의 노치를 갖고 코드의 각각의 다수의 도선은 신장상태로 돌출부의 한싸의 노치에 의해 잡혀져 돌출부에 의해 신장된 도선의 부분이 단자의 노치와 마주하도록 유지부재가 전자계량기에 설치되는 것을 특징으로 하는 연결구조.The connecting structure for connecting the lead of the cord to the electronic meter is an electronic meter provided with a plurality of terminals, the terminals are arranged along a straight line at predetermined intervals, and the notches 124-127 are formed in the V-shaped holes and the respective terminals. V-shaped holes are formed on the upper side of each terminal by forming a narrow hole extending from the formed V-shaped bottom, and the narrow holes of the terminal are parallel to each other, and a pair of parallel protrusions 308b and 308c are formed. A retaining member provided, each projection having a plurality of notches at predetermined intervals for use as a fastening portion, each of the plurality of conductors of the cord being stretched by the projections being held by a single notch of the projection in an extended state; And a retaining member is installed in the electronic meter so that a portion thereof faces the notch of the terminal. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910020132A 1990-11-15 1991-11-13 Fluidic gas meter provided with a printed wiring board KR100245633B1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP90-310702 1990-11-15
JP2310701A JP2721036B2 (en) 1990-11-15 1990-11-15 Fluidic gas meter
JP90-310701 1990-11-15
JP90-120199 1990-11-15
JP90-129632 1990-11-30

Publications (2)

Publication Number Publication Date
KR920011303A true KR920011303A (en) 1992-06-27
KR100245633B1 KR100245633B1 (en) 2000-02-15

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KR1019910020132A KR100245633B1 (en) 1990-11-15 1991-11-13 Fluidic gas meter provided with a printed wiring board

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JP (1) JP2721036B2 (en)
KR (1) KR100245633B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100422864B1 (en) * 2002-03-28 2004-03-12 주식회사 호서텔넷 Radio remote monitoring and meter reading system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100422864B1 (en) * 2002-03-28 2004-03-12 주식회사 호서텔넷 Radio remote monitoring and meter reading system

Also Published As

Publication number Publication date
JPH04181122A (en) 1992-06-29
KR100245633B1 (en) 2000-02-15
JP2721036B2 (en) 1998-03-04

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