KR920007282Y1 - Heating equipment for lead frame of semiconductor - Google Patents
Heating equipment for lead frame of semiconductor Download PDFInfo
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- KR920007282Y1 KR920007282Y1 KR2019890017868U KR890017868U KR920007282Y1 KR 920007282 Y1 KR920007282 Y1 KR 920007282Y1 KR 2019890017868 U KR2019890017868 U KR 2019890017868U KR 890017868 U KR890017868 U KR 890017868U KR 920007282 Y1 KR920007282 Y1 KR 920007282Y1
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- gas
- space
- heater block
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Abstract
내용 없음.No content.
Description
제1도는 기존 리드 프레임 환원장치의 일부를 단면처리한 상태의 부분사시도.1 is a partial perspective view of a part of the existing lead frame reduction device in a cross-sectional view.
제2도는 본 고안의 일부를 단면처리한 상태의 부분사시도.Figure 2 is a partial perspective view of a state of the cross section of a part of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1, 1' : 히터블록(Heater Block) 2, 2' : 히터 카트리지(Heater Cartridge)1, 1 ': Heater Block 2, 2': Heater Cartridge
3, 3' : 가이드 레일 4 : 제1덮개3, 3 ': guide rail 4: first cover
5 : 제2덮개 6 : 제1공간5: 2nd cover 6: 1st space
7 : 제2공간 8 : 제1턱부7: second space 8: first jaw portion
9 : 제2턱부 10, 10' : 가스홀9: second jaw 10, 10 ': gas hole
11 : 제1가스파이프 12 : 제2가스파이프11: first gas pipe 12: second gas pipe
13 : 열발생기 14 : 리드프레임13: heat generator 14: lead frame
15 : 가스배출로15: gas discharge furnace
본 고안은 리드 프레임(Lead Frame) 환원장치에 관한 것으로서, 특히, 동선의 환원을 효과적으로 진행시킬수 있는 온도 및 환원제의 조건을 최적상태로 유지할 수 있도록 구성한 리드 프레임(Lead Frame) 환원장치에 관한 것이다.The present invention relates to a lead frame reducing apparatus, and more particularly, to a lead frame reducing apparatus configured to maintain optimal conditions of temperature and reducing agent capable of effectively reducing copper wire.
반도체 조립공정에 있어 다이(Die)와 리드 프레임(Lead Frame)의 리드를 동선(Copper Wire)을 이용하여 본딩(Bonding)시키게 된다.In the semiconductor assembly process, the leads of the die and the lead frame are bonded using copper wires.
이때, 사용되는 리드 프레임은 동으로 되어있어 동의 성질 특성상 다이 접합후의 굽기 공정(Oven curing process) 과정에서 그 피막이 산화되어 와이어 본딩(Wire Bonding)에 장애요소로 작용하게 된다.At this time, the lead frame used is made of copper, the film is oxidized during the oven curing process after the die bonding due to the nature of the copper and acts as an obstacle to wire bonding.
따라서, 와이어 본딩 공정 실시전에 리드 프레임을 환원장치내로 이송시켜 산화된 리드 프레임 표면을 환원시킨후 와이어 본딩을 하여야만 한다.Therefore, before performing the wire bonding process, the lead frame must be transferred into the reduction apparatus to reduce the oxidized lead frame surface before wire bonding.
즉, 제1도에 도시된 바와같은 구조로 이루어진 리드 프레임 환원장치 내부에 산화된 리드 프레임을 통과시켜 그 표면을 환원시킨뒤 와이어 본딩 작업을 실시하여야 한다.That is, a wire bonding operation must be performed after passing the oxidized lead frame through the inside of the lead frame reduction apparatus having the structure as shown in FIG. 1 to reduce the surface thereof.
제1도에 도시된 기존의 리드 프레임 환원장치 구조를 대략적으로 살펴보면, 내측 상부에 턱이 구성된 1쌍의 가이드 레일(3') 사이에 히터 블록(1')(Heater Block)을 위치시킨다(히터 블록의 길이는 가이드 레일 길이와 동일).Referring to the structure of the conventional lead frame reduction apparatus shown in FIG. 1, the heater block 1 'is positioned between a pair of guide rails 3' having a jaw formed on the inner upper portion (heater block). The length of the block is the same as the length of the guide rail).
히터 블록(1')의 전단 중앙부에는 원형의 히터 카트리지(Heater Cartridge) (2')가 설치되며, 환원가스(N2+H2의 혼합가스)를 공급하는 가스홀(10')이 히터블록(1')내에 위치하게 된다.At the front end of the heater block 1 ', a circular heater cartridge 2' is installed, and a gas hole 10 'for supplying reducing gas (mixed gas of N 2 + H 2 ) is provided in the heater block. It is located in (1 ').
리드프레임의 인입부에 구성된 가스홀(10')은 외부의 가스파이프와 연통되며, 히터 카트리지(2')에 의하여 설정된 조건의 적정온도를 유지한 상태로 가스홀(10')을 통과한 환원가스는 리드 프레임의 이송로(덮개(16)와 히터블록(1') 표면간의 공간) 전길이에 걸쳐 확산되어 연속적인 이송이 이루어지는 다량의 리드 프레임을 환원시키는 구조이다.The gas hole 10 'configured at the lead portion of the lead frame is in communication with an external gas pipe and is reduced through the gas hole 10' while maintaining an appropriate temperature under the condition set by the heater cartridge 2 '. The gas diffuses over the entire length of the lead frame transfer path (the space between the lid 16 and the surface of the heater block 1 ') to reduce a large amount of lead frames in which continuous transfer is performed.
그러나, 이와같은 환원장치는 장치자체의 길이 즉 레일(3')의 길이가 길고, 가스의 유입부가 장치의 단부에 치중되어 있어 장치의 후단부로 갈수록 유입된 환원 가스의 농도가 옅어지기 때문에 균일한 환원을 위하여 많은 양의 혼합가스가 소요되며, 또한 환원조건의 하나인 혼합가스의 온도는 약 300℃ 정도가 적당하나 비교적 긴 이송로를 혼합가스가 거쳐가기 때문에 장치의 후단부 이송로내의 가스온도는 적정온도 이하로 떨어지기 때문에 완전한 리드 프레임의 환원이 이루어지지 않게 된다.However, such a reducing device has a uniform length because the length of the device itself, that is, the length of the rail 3 ', the inlet of the gas is concentrated at the end of the device, and the concentration of the reducing gas introduced into the device becomes lighter toward the rear end of the device. A large amount of mixed gas is required for the reduction, and the temperature of the mixed gas, which is one of the reducing conditions, is about 300 ° C, but the mixed gas passes through a relatively long transport path, so the gas temperature in the transport path of the rear end of the apparatus is reduced. Since the temperature falls below the proper temperature, the reduction of the complete lead frame is not achieved.
본 고안은 상술한 바와같은 리드프레임 환원장치의 미비점을 보완한 것으로, 1쌍의 덮개를 설치하여 리드프레임의 환원조건을 최적으로 유지시킬 수 았는 환원장치를 제공하는데 그 목적이 있다.The present invention is to compensate for the shortcomings of the lead frame reduction device as described above, it is an object of the present invention to provide a reduction device that was able to optimally maintain the reduction conditions of the lead frame by installing a pair of covers.
본 고안의 특징은 히터 카트리지(2) 및 상기 히터 카트리지(2) 연변에 형성된 가스홀(10)을 내장한 소정길이의 히터블록(1)과, 상기 히터 블록(1) 양측면에 각각 고착되고, 내측상부에 소정수의 턱부(8 및 9)를 형성하여 제1가스파이프(11) 장착 및 리드 프레임 안착기능을 수행하도록 구성한 1쌍의 가이드 레일(3)과, 상기 1쌍의 가이드 레일(3)에 고착되며, 부재 저면과 상기 히터 블록(1)간에 소정의 제1공간(6)이 형성되고, 부재상부면과 하부의 상기 제1공간(6)이 연통되도록 구성한 제1덮개(4)와, 외부에서 설치된 제2가스 파이프(12)를 내장한 상태로 상기 제1덮개(4)에 고착되며, 부재저면과 상기 제1덮개(4)간에 소정의 제2공간(7)이 형성되도록 구성한 제2덮개(5) 및, 상기 제2덮개(5)에 일부가 내장된 상기 제2가스파이프(12)와 연결된 열발생기(13)로 이루어진 것을 특징으로 한다.A feature of the present invention is a heater block (1) of a predetermined length having a heater cartridge (2) and a gas hole (10) formed around the heater cartridge (2) and fixed to both sides of the heater block (1), A pair of guide rails 3 and a pair of guide rails 3 configured to form a predetermined number of jaws 8 and 9 on the inner side to perform the first gas pipe 11 mounting and lead frame seating functions. A first cover 6 formed between the bottom surface of the member and the heater block 1 and configured to communicate the upper surface of the member with the first space 6 below. And fixed to the first cover 4 in a state in which the second gas pipe 12 installed from the outside is embedded, and a predetermined second space 7 is formed between the bottom of the member and the first cover 4. The second cover 5 and the heat generator 13 connected to the second gas pipe 12 having a part embedded in the second cover 5 And a gong.
이하, 본 고안을 첨부한 도면을 참고하여 상세히 설명하면, 제1도는 기존의 리드프레임 환원장치의 일부를 단면처리한 부분 사시도로서, 명세서 서두에서 설명하였기에 중복설명을 생략한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings, FIG. 1 is a partial perspective view of a part of a conventional lead frame reduction apparatus, which has been described at the beginning of the specification, and thus redundant description will be omitted.
제2도는 본 고안의 일부사시도로서, 편의상 그 전면을 단면으로 처리하여 그 내부로 도시하였다.Figure 2 is a partial perspective view of the present invention, the front surface is shown in the cross section for convenience.
내측상부 2개소에 턱이 형성된 1쌍의 가이드 레일(3) 사이에 히터 블록(1)(Heater Block)을 장착하며(히터블록의 길이는 가이드 레일의 길이와 동일하며 가스의 누출을 방지하기 위하여 밀착한 상태로 장착), 히터블록(1)의 중앙부에는 소정 직경의 히터 카트리지(2)(Heater Cartridge)를 위치시킨다. 히터 블록(1) 내부에는 원형 히터 카트리지(2) 저부 및 양측부를 경유하여 히터 블록(1) 상부면으로 통하는 가스홀(10)를 구성한다.Heater block 1 (Heater Block) is mounted between a pair of guide rails 3 formed with jaws in two upper upper parts (the length of the heater block is the same as the length of the guide rail and to prevent the leakage of gas. In a state of being in close contact with each other, a heater cartridge 2 having a predetermined diameter is placed at the center of the heater block 1. In the heater block 1, a gas hole 10 is connected to the upper surface of the heater block 1 via the bottom and both sides of the circular heater cartridge 2.
각 가이드 레일(3) 내면에 형성한 2개소의 턱중 하부의 턱(9) 평면상에는 각각 별도의 제1가스파이프(11) (외부에서 연결되나 도시하지 않았으며 파이프상에는 절개부를 구성하여 가스가 분출되도록 구성하였다)가 위치하며, 상부의 턱(8) 평면상에는 리드 프레임(14)의 양단이 각각 안착된다.On the plane of the lower jaw 9 of the two jaws formed on the inner surface of each guide rail 3, each of the separate first gas pipes 11 (connected from the outside, but not shown, the gas is blown out by forming an incision on the pipe. And both ends of the lead frame 14 are seated on the upper jaw 8 plane.
여기서 히터블록(1) 내의 가스홀(10)과 각 가이드레일(3)의 제2턱부(9)에 안착되는 제1가스파이프(11)는 외부에서 유입되는 환원가스(N2와 H2를 90 : 10의 비율로 혼합한 가스)의 통로로서, 가스홀(10) 상단과 제1가스파이프(11)의 상부절개면은 각 가이드레일(3)의 각 제1턱부(8)에 양단이 걸린 상태로 이송되는 리드 프레임(14) 저면과 대응된다(리드 프레임이 이송되는 방법은 일반적인 것이므로 생략한다).Herein, the first gas pipe 11 seated on the gas hole 10 in the heater block 1 and the second jaw portion 9 of each guide rail 3 receives the reducing gases N 2 and H 2 introduced from the outside. 90: 10 gas in the ratio), the upper end of the gas hole 10 and the upper cut surface of the first gas pipe 11 are both ends of each of the first jaw portion 8 of each guide rail (3). Corresponds to the bottom surface of the lead frame 14 which is conveyed in a jammed state (the method of conveying the lead frame is a general one and will be omitted).
각 가이드 레일(3)의 상단에는 가이드 레일(3)의 제1턱부(8)에 안착된 리드 프레임(14)과 소정공간을 유지하는 제1덮개(4)(Cover)를, 제1덮개(4)상에는 제1덮개(4)와 소정간격을 유지하는 구조의 제2덮개(5)를 각각 고정한다(이때 각 부재는 가스의 누출방지를 위하여 완전 밀착을 이루는 상태이다).At the upper end of each guide rail 3, a lead frame 14 seated on the first jaw portion 8 of the guide rail 3 and a first cover 4 (Cover) for maintaining a predetermined space are provided. 4) the first cover 4 and the second cover 5 having a structure maintaining a predetermined distance are respectively fixed (in this case, each member is in a state of being in close contact with each other to prevent leakage of gas).
제1덮개(4)에는 부재를 상하로 관통하는 다수의 가스배출로(15)를 형성하며, 각 가스배출로(15)의 유입구는 제2덮개(5)와 제1덮개(4)간의 제2공간(7)에, 유출구는 리드 프레임(14)의 이송로인 제1공간(6)에 대응한다.The first cover 4 is formed with a plurality of gas discharge passage 15 penetrating the member up and down, the inlet of each gas discharge passage 15 is the first cover between the second cover 5 and the first cover (4) In the two spaces 7, the outlet port corresponds to the first space 6, which is a transfer path of the lead frame 14.
다수의 가스배출로(15)는 제1덮개(4)의 전길이에 걸쳐 설치된다.The plurality of gas discharge passages 15 are installed over the entire length of the first cover 4.
내부에 코일이 내장되어 열을 발생시키는 열발생기(13)(Heat Generater)와 연결된 다수의 제2가스파이프(12)는 열발생기(13)와 병렬로 연결되어 제2덮개(5)를 관통한 상태로 제1덮개(4)와 제2덮개(5) 사이의 제2공간(7)에 연통된다. 제2도에 도시된 바와같이 다수의 제2가스파이프(12)는 제2덮개(5)의 전길이에 걸쳐 일정간격을 두고 설치한다.A plurality of second gas pipes 12 connected to a heat generator 13 (Heat Generater) for generating heat by embedding a coil therein are connected in parallel with the heat generator 13 to penetrate the second cover 5. It is in communication with the second space 7 between the first cover 4 and the second cover 5 in a state. As shown in FIG. 2, a plurality of second gas pipes 12 are installed at regular intervals over the entire length of the second cover 5.
이상과 같은 구조의 본 고안에 대한 동작을 설명하면, 제1파이프(11) 및 제2파이프(12) 및 가스홀(10)을 통하여 본고안 내부로 환원가스(N2+H2혼합가스)를 주입하면, 가스홀(10) 내부를 유동하는 환원가스는 히터블록(1) 내에서 히터 카트리지(2)의 발생열로 인하여 간접가열된 상태에서 제1공간(6)(이동하는 리드프레임(14) 저면으로)으로 유출되나, 제1파이프(11) 내의 환원가스는 상온상태로 공급되어 제1공간(6)의 온도를 내리게 된다. 이를 보상하기 위하여 제2파이프(12)로 공급되는 환원가스는 중간에 열발생기(13)를 거쳐(환원가스는 이로인하여 약 400℃의 온도로 가열됨) 제2공간(7)으로 유입되고, 제1덮개(4)에 구성한 다수의 가스 배출구(15)를 통하여 제1공간(6)내의 리드 프레임(14) 상으로 배출된다.Referring to the operation of the present invention of the structure as described above, through the first pipe 11 and the second pipe 12 and the gas hole 10 to the inside of the present reducing gas (N 2 + H 2 mixed gas) Injecting the reducing gas flowing in the gas hole 10 is the first space 6 (moving lead frame 14 in the indirectly heated state due to the generated heat of the heater cartridge 2 in the heater block 1. ), But the reducing gas in the first pipe 11 is supplied at room temperature to lower the temperature of the first space 6. In order to compensate for this, the reducing gas supplied to the second pipe 12 is introduced into the second space 7 through the heat generator 13 (the reduced gas is heated to a temperature of about 400 ° C. thereby), The gas is discharged onto the lead frame 14 in the first space 6 through the plurality of gas discharge ports 15 formed in the first cover 4.
제1덮개(4)에 구성된 다수의 가스배출구(15)는 제2파이프(12)를 통하여 제2공간(7)으로 유입된 환원가스를 제1공간(6) 내부를 이동하는 리드프레임(14)의 전평면 상으로 균일하게 분산시키는 기능을 수행한다.The plurality of gas outlets 15 formed in the first cover 4 are lead frames 14 for moving the reducing gas introduced into the second space 7 through the second pipe 12 into the first space 6. It uniformly disperses onto the entire plane of).
이상과 같은 본 고안은 열발생기로 인하여 유입되는 환원가스의 온도를 적정온도(약 300℃)로 계속유지할수 있으며, 이송되는 리드 프레임상의 전면에 걸쳐 환원가스를 공급함으로서 리드 프레임의 균일하고도 완전한 환원상태를 기대할 수 있는 효과가 있다.The present invention as described above can maintain the temperature of the reducing gas introduced due to the heat generator at an appropriate temperature (about 300 ℃), by supplying the reducing gas over the entire surface on the lead frame to be transported uniform and complete of the lead frame It is effective to expect a reduced state.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019890017868U KR920007282Y1 (en) | 1989-11-30 | 1989-11-30 | Heating equipment for lead frame of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019890017868U KR920007282Y1 (en) | 1989-11-30 | 1989-11-30 | Heating equipment for lead frame of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR910009933U KR910009933U (en) | 1991-06-29 |
| KR920007282Y1 true KR920007282Y1 (en) | 1992-10-09 |
Family
ID=19292526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019890017868U KR920007282Y1 (en) | 1989-11-30 | 1989-11-30 | Heating equipment for lead frame of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR920007282Y1 (en) |
-
1989
- 1989-11-30 KR KR2019890017868U patent/KR920007282Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR910009933U (en) | 1991-06-29 |
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