KR920005305A - 본딩 옵션(Bonding Option)회로 - Google Patents

본딩 옵션(Bonding Option)회로

Info

Publication number
KR920005305A
KR920005305A KR1019900013418A KR900013418A KR920005305A KR 920005305 A KR920005305 A KR 920005305A KR 1019900013418 A KR1019900013418 A KR 1019900013418A KR 900013418 A KR900013418 A KR 900013418A KR 920005305 A KR920005305 A KR 920005305A
Authority
KR
South Korea
Prior art keywords
bonding option
option circuit
circuit
bonding
option
Prior art date
Application number
KR1019900013418A
Other languages
English (en)
Other versions
KR930004123B1 (ko
Inventor
안계호
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to KR1019900013418A priority Critical patent/KR930004123B1/ko
Publication of KR920005305A publication Critical patent/KR920005305A/ko
Application granted granted Critical
Publication of KR930004123B1 publication Critical patent/KR930004123B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Logic Circuits (AREA)
KR1019900013418A 1990-08-29 1990-08-29 본딩 옵션(Bonding Option)회로 KR930004123B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900013418A KR930004123B1 (ko) 1990-08-29 1990-08-29 본딩 옵션(Bonding Option)회로

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900013418A KR930004123B1 (ko) 1990-08-29 1990-08-29 본딩 옵션(Bonding Option)회로

Publications (2)

Publication Number Publication Date
KR920005305A true KR920005305A (ko) 1992-03-28
KR930004123B1 KR930004123B1 (ko) 1993-05-20

Family

ID=19302879

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900013418A KR930004123B1 (ko) 1990-08-29 1990-08-29 본딩 옵션(Bonding Option)회로

Country Status (1)

Country Link
KR (1) KR930004123B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100344838B1 (ko) * 2000-07-24 2002-07-20 주식회사 하이닉스반도체 본딩 옵션 회로

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100344838B1 (ko) * 2000-07-24 2002-07-20 주식회사 하이닉스반도체 본딩 옵션 회로

Also Published As

Publication number Publication date
KR930004123B1 (ko) 1993-05-20

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20060502

Year of fee payment: 14

LAPS Lapse due to unpaid annual fee