KR920005305A - 본딩 옵션(Bonding Option)회로 - Google Patents
본딩 옵션(Bonding Option)회로Info
- Publication number
- KR920005305A KR920005305A KR1019900013418A KR900013418A KR920005305A KR 920005305 A KR920005305 A KR 920005305A KR 1019900013418 A KR1019900013418 A KR 1019900013418A KR 900013418 A KR900013418 A KR 900013418A KR 920005305 A KR920005305 A KR 920005305A
- Authority
- KR
- South Korea
- Prior art keywords
- bonding option
- option circuit
- circuit
- bonding
- option
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Logic Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900013418A KR930004123B1 (ko) | 1990-08-29 | 1990-08-29 | 본딩 옵션(Bonding Option)회로 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900013418A KR930004123B1 (ko) | 1990-08-29 | 1990-08-29 | 본딩 옵션(Bonding Option)회로 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920005305A true KR920005305A (ko) | 1992-03-28 |
KR930004123B1 KR930004123B1 (ko) | 1993-05-20 |
Family
ID=19302879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900013418A KR930004123B1 (ko) | 1990-08-29 | 1990-08-29 | 본딩 옵션(Bonding Option)회로 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR930004123B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100344838B1 (ko) * | 2000-07-24 | 2002-07-20 | 주식회사 하이닉스반도체 | 본딩 옵션 회로 |
-
1990
- 1990-08-29 KR KR1019900013418A patent/KR930004123B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100344838B1 (ko) * | 2000-07-24 | 2002-07-20 | 주식회사 하이닉스반도체 | 본딩 옵션 회로 |
Also Published As
Publication number | Publication date |
---|---|
KR930004123B1 (ko) | 1993-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060502 Year of fee payment: 14 |
|
LAPS | Lapse due to unpaid annual fee |