KR910009379A - Laser processing apparatus and method - Google Patents

Laser processing apparatus and method Download PDF

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Publication number
KR910009379A
KR910009379A KR1019890017497A KR890017497A KR910009379A KR 910009379 A KR910009379 A KR 910009379A KR 1019890017497 A KR1019890017497 A KR 1019890017497A KR 890017497 A KR890017497 A KR 890017497A KR 910009379 A KR910009379 A KR 910009379A
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KR
South Korea
Prior art keywords
laser
laser beam
thin film
processing apparatus
elliptical
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Application number
KR1019890017497A
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Korean (ko)
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KR0137215B1 (en
Inventor
요시아끼 와따나베
히데오 오기노
가즈오 쯔나
준 가다오까
쇼죠 가다마찌
Original Assignee
원본미기재
가부시기가이샤 닛뻬이 도야마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP63135077A external-priority patent/JPH01306089A/en
Priority claimed from JP63135078A external-priority patent/JPH01306095A/en
Priority claimed from JP63135080A external-priority patent/JPH01306088A/en
Priority claimed from JP63135079A external-priority patent/JP2632924B2/en
Application filed by 원본미기재, 가부시기가이샤 닛뻬이 도야마 filed Critical 원본미기재
Publication of KR910009379A publication Critical patent/KR910009379A/en
Application granted granted Critical
Publication of KR0137215B1 publication Critical patent/KR0137215B1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

내용 없음No content

Description

레이저 가공장치 및 방법Laser processing apparatus and method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제4도 및 5도는 본 발명에 따라 제공된 레이저 가공장치 각 부분의 파쇄평면도 및 파쇄측면도.4 and 5 are crushing and crushing side views of respective parts of the laser processing apparatus provided in accordance with the present invention.

제6도는 제4도 및 5도에 도시된 폭방향 Q스위치 레이저 가공부의 슬릿을 도시한 설명도.FIG. 6 is an explanatory view showing slits of the widthwise Q-switched laser machining shown in FIGS. 4 and 5; FIG.

Claims (6)

박막입힌 필름의 박막을 레이저 비임을 사용하여 박막입힌 필름의 이동방향과 그 이동방향의 횡방향으로 가공하기 위한 레이저 가공장치에 있어서, 상기 장치는 폭방향Q스위치 레이저 발전기, 비임형상 변환수단, 다면경,·θ렌즈와 원주형 렌즈를 포함하는 렌즈유니트로 구성되는 폭방향Q스위치의 레이저 가공부와, 이동방향Q스위치에 레이저 발진기, 레이저 분광기, 다수의 광섬유케이블, 다수의 레이저 비임 조사해드를 포함하는이동방향Q스위치 레이저 가공부로 구성되는 것을 특징으로 하는 레이저 가공장치.A laser processing apparatus for processing a thin film of a thin film coated film in a moving direction of the thin film coated film and a transverse direction of the moving direction by using a laser beam, the apparatus comprising: a widthwise Q-switched laser generator, a non-shaped conversion means, circa, A laser processing part of a width Q switch composed of a lens unit including a θ lens and a cylindrical lens, and a laser oscillator, a laser spectrometer, a plurality of optical fiber cables, and a plurality of laser beam irradiation heads in the movement direction Q switch. Laser processing apparatus comprising a moving direction Q switch laser processing unit. 제1항에 있어서, 상기 비임형상 변환수단은 상기 레이저 발진기에 의해 발진된 레이저 비임을 타원형의 레이저 비임으로 변환시키는 것을 특징으로 하는 레이저 가공장치.The laser processing apparatus according to claim 1, wherein the beam shape converting means converts the laser beam oscillated by the laser oscillator into an elliptical laser beam. 제2항에 있어서, 상기 타원형의 레이저 비임의 큰 직경방향이 레이저 비임 가공방향과 일치하도록 상기 비임형상 변환수단을 회전시키는 수단을 추가로 구비하는 것을 특징으로 하는 레이저 가공장치.The laser processing apparatus according to claim 2, further comprising means for rotating said beam shape converting means so that a large radial direction of said elliptical laser beam coincides with a laser beam processing direction. 제1항에 있어서, 상기 비임형상 변환수단은 상기 레이저 비임의 큰 직경을 Y방향으로 확대 또는 축소시키는 X방향의 비임형상 변환수단으로 구성되는 것을 특징으로 하는 레이저 가공장치.The laser processing apparatus according to claim 1, wherein the non-geographic conversion means is constituted by non-geometric conversion means in the X-direction which enlarges or reduces the large diameter of the laser beam in the Y-direction. 제1항에 있어서,상기 박막입힌 필름을 안내하기 위한 다수의 필름 안내수단은 여러위치에 갖추어지고 상기 Q스위치 레이저 가공부는 상기 박막입힌 필름의 필름측에 위치하는 방식으로 상기 필름 안내수단 사이에 배치되는 레이저 조사 부재를 구비하며, 흡진수단은 상기 박막입힌 필름을 통과하여 상기 레이저 조사부재를 향하는 방식으로 상기 박막입힌 필름의 박막측에 갖추어지는 것을 특징으로 하는 레이저 가공방법.According to claim 1, A plurality of film guiding means for guiding the thin film coated film is provided in a number of positions and the Q switch laser processing unit is disposed between the film guide means in a manner located on the film side of the thin film coated film And a laser irradiation member, wherein the suction means is provided on the thin film side of the thin film coated film in such a manner that it passes through the thin film coated film and faces the laser irradiation member. 가공하고자 하는 가공물에 주사레이저 비임을 조사하는 방법에 있어서, 상기 방법은 레이저 발전기에 의해 발전된 레이저 비임을 반사광학시스템을 개재하여 굴절시키고, 상가 주사레이저 비임을 가공물의 이동방향에 대하여 횡방향으로 조사할때 상기 레이저 비임을 비임형상 변환수단에 통과시켜 타원형의 레이저 비임으로 변환하고, 상기 타원형 레이저 비임의 큰직경 방향이 레이저 비임의 주사방향과 일치되게 상기 비임형상 변환 수단을 회전시켜 상기 타원형 레이저 비임의 큰 직경 양이 주사방향 일치되게 타원형의 레이저 비임을 상기 가공물에 조사하는 것을 특징으로 하는 주사레이저 비임 조사방법.A method of irradiating a scanning laser beam to a workpiece to be processed, wherein the method refracts a laser beam generated by a laser generator through a reflection optical system, and irradiates the scanning laser beam laterally with respect to the moving direction of the workpiece. When the laser beam is passed through the beam shape converting means to convert into an elliptical laser beam, the large diameter direction of the elliptical laser beam rotates the beam shape converting means to match the scanning direction of the laser beam, the elliptical laser beam A method of irradiating a scanning laser beam according to claim 1, wherein the workpiece is irradiated with an elliptical laser beam in such a manner that a large diameter of? ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890017497A 1988-06-01 1989-11-30 Laser processing method and apparatus thereof KR0137215B1 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP88-135080 1988-06-01
JP88-135077 1988-06-01
JP63135077A JPH01306089A (en) 1988-06-01 1988-06-01 Irradiation method of scanning laser light
JP88-135079 1988-06-01
JP63135078A JPH01306095A (en) 1988-06-01 1988-06-01 Laser processing device of laser light transmittable material with thin film
JP88-135078 1988-06-01
JP63135080A JPH01306088A (en) 1988-06-01 1988-06-01 Variable beam laser processing device
JP63135079A JP2632924B2 (en) 1988-06-01 1988-06-01 Laser processing equipment

Publications (2)

Publication Number Publication Date
KR910009379A true KR910009379A (en) 1991-06-28
KR0137215B1 KR0137215B1 (en) 1998-07-01

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KR1019890017497A KR0137215B1 (en) 1988-06-01 1989-11-30 Laser processing method and apparatus thereof

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100900466B1 (en) * 2008-05-26 2009-06-02 하나기술(주) Laser surface treatment using beam section shaping and polygon mirror and the method therewith

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