KR900701455A - Perfluoroheptaglyme-improved vapor phase solder - Google Patents

Perfluoroheptaglyme-improved vapor phase solder

Info

Publication number
KR900701455A
KR900701455A KR1019900701118A KR900701118A KR900701455A KR 900701455 A KR900701455 A KR 900701455A KR 1019900701118 A KR1019900701118 A KR 1019900701118A KR 900701118 A KR900701118 A KR 900701118A KR 900701455 A KR900701455 A KR 900701455A
Authority
KR
South Korea
Prior art keywords
solder
perfluoroheptaglyme
vapor phase
improved vapor
phase solder
Prior art date
Application number
KR1019900701118A
Other languages
Korean (ko)
Inventor
토마스 알. 비에르세닉
티모티 쥴케
하지뮤 가와
리챠드 제이. 라고우
Original Assignee
티모티 쥴케
익스플루오르 리서치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 티모티 쥴케, 익스플루오르 리서치 코포레이션 filed Critical 티모티 쥴케
Publication of KR900701455A publication Critical patent/KR900701455A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00—Ethers; Compounds having groups, groups or groups
    • C07C43/02—Ethers
    • C07C43/03—Ethers having all ether-oxygen atoms bound to acyclic carbon atoms
    • C07C43/04—Saturated ethers
    • C07C43/12—Saturated ethers containing halogen
    • C07C43/126—Saturated ethers containing halogen having more than one ether bond
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • B23K35/386—Selection of media, e.g. special atmospheres for surrounding the working area for condensation soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

내용 없음No content

Description

과플루오르헵타글라임-개선된 증기상 납땜액Perfluoroheptaglyme-improved vapor phase solder

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (5)

부품 및 땜납을 과플루오르헵타글라임 함유의 중기 배드에 침지시켜 땜납을 용융시키고; 납땜된 부품을 증기 배드로부터 꺼내는 것을 특징으로 하는, 부품 납땜 방법.The parts and solder are immersed in a medium bed containing perfluoroheptaglyme to melt the solder; A method of soldering a part, characterized in that the soldered part is taken out of the vapor bed. 제1항에 있어서, 땜납의 융점이 200℃ 이하인 방법.The method of claim 1, wherein the melting point of the solder is 200 ° C. or less. 제2항에 있어서, 땜납이 60/40 주석/납 땜납인 방법.The method of claim 2 wherein the solder is 60/40 tin / lead solder. 제1항에 있어서, 부품이 전기 부품인 방법.The method of claim 1 wherein the component is an electrical component. 과플루오르헵타글라임의 증기상 납땜액으로서의 용도.Use of perfluoroheptaglyme as vapor phase solder liquid. ※ 참고사항：최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900701118A 1988-09-28 1989-09-28 Perfluoroheptaglyme-improved vapor phase solder KR900701455A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25040088A 1988-09-28 1988-09-28
US250,400 1988-09-28
PCT/US1989/004258 WO1990003246A1 (en) 1988-09-28 1989-09-28 Perfluoroheptaglyme - an improved vapor-phase soldering fluid

Publications (1)

Publication Number Publication Date
KR900701455A true KR900701455A (en) 1990-12-03

Family

ID=22947581

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900701118A KR900701455A (en) 1988-09-28 1989-09-28 Perfluoroheptaglyme-improved vapor phase solder

Country Status (5)

Country Link
EP (1) EP0436635A1 (en)
JP (1) JPH04503187A (en)
KR (1) KR900701455A (en)
AU (1) AU4406289A (en)
WO (1) WO1990003246A1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8301506D0 (en) * 1983-01-20 1983-02-23 Electricity Council Fluorinated ethers
GB8312503D0 (en) * 1983-05-06 1983-06-08 Isc Chemicals Ltd Vapour phase soldering
IT1200385B (en) * 1985-02-13 1989-01-18 Montefluos Spa OXETANIC STRUCTURE FLUIDS HAVING IMPROVED CHARACTERISTICS FOR SPECIAL APPLICATIONS
IT1213537B (en) * 1986-11-21 1989-12-20 Ausimont Spa PROCEDURE FOR THE PREPARATION OF PERFLUOROETERS BY FLUORURATION WITH ELEMENTARY FLUORINE.

Also Published As

Publication number Publication date
JPH04503187A (en) 1992-06-11
WO1990003246A1 (en) 1990-04-05
AU4406289A (en) 1990-04-18
EP0436635A1 (en) 1991-07-17

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Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid