KR900700555A - 벤조사이클로부텐계 오가노실란 접착보조제 - Google Patents

벤조사이클로부텐계 오가노실란 접착보조제

Info

Publication number
KR900700555A
KR900700555A KR1019890702163A KR890702163A KR900700555A KR 900700555 A KR900700555 A KR 900700555A KR 1019890702163 A KR1019890702163 A KR 1019890702163A KR 890702163 A KR890702163 A KR 890702163A KR 900700555 A KR900700555 A KR 900700555A
Authority
KR
South Korea
Prior art keywords
benzocyclobutene
adhesion aid
organosilane adhesion
based organosilane
aid
Prior art date
Application number
KR1019890702163A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR900700555A publication Critical patent/KR900700555A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
KR1019890702163A 1988-03-23 1989-11-21 벤조사이클로부텐계 오가노실란 접착보조제 KR900700555A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/172,060 US4831172A (en) 1988-03-23 1988-03-23 Benzocyclobutene-based organosilane adhesion aids
PCT/US1989/001078 WO1989009658A1 (en) 1988-03-23 1989-03-16 Benzocyclobutene-based organosilane adhesion aids

Publications (1)

Publication Number Publication Date
KR900700555A true KR900700555A (ko) 1990-08-16

Family

ID=22626201

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890702163A KR900700555A (ko) 1988-03-23 1989-11-21 벤조사이클로부텐계 오가노실란 접착보조제

Country Status (8)

Country Link
US (1) US4831172A (ko)
EP (1) EP0334269A3 (ko)
JP (1) JPH02504168A (ko)
KR (1) KR900700555A (ko)
MY (1) MY103985A (ko)
PH (1) PH25816A (ko)
WO (1) WO1989009658A1 (ko)
ZA (1) ZA892220B (ko)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026892A (en) * 1984-08-27 1991-06-25 The Dow Chemical Company Novel poly(arylcyclobutenes)
FR2654105B1 (fr) * 1989-11-09 1992-02-21 Univ Rouen Nouveaux dienoxysilanes, leur procede d'obtention, et nouveaux aldehydes alpha-ethyleniques alpha-halogenes auxquels ils donnent acces.
US5264646A (en) * 1991-03-28 1993-11-23 The Dow Chemical Company Process for preparing vinylically-unsaturated compounds
US5136069A (en) * 1991-03-28 1992-08-04 The Dow Chemical Company Process for preparing vinylically-unsaturated compounds (II)
ATE212611T1 (de) * 1991-03-28 2002-02-15 Dow Chemical Co Verfahren zur herstellung von vinyl-ungesättigten verbindungen
US5138081A (en) * 1991-04-30 1992-08-11 The Dow Chemical Company Process for purifying vinylically-unsaturated organosilicon compounds
EP0616701B1 (en) * 1991-12-10 2002-02-13 The Dow Chemical Company Photocurable cyclobutarene compositions
US5391650A (en) * 1992-12-30 1995-02-21 The Dow Chemical Company Bisbenzocyclobutene thermosetting compounds and process for preparing the same
US5276228A (en) * 1993-01-25 1994-01-04 The Dow Chemical Company Liquid bisarylcyclobutene monomers and polymers
DE4306642B4 (de) * 1993-03-03 2004-07-08 3M Espe Ag Verfahren zur Präparation von Substratoberflächen für Verklebungen
US5994489A (en) * 1994-10-24 1999-11-30 The Dow Chemical Company Adhesion promoter and self-priming arylcyclobutene resin compositions
US5668210A (en) * 1994-10-24 1997-09-16 The Dow Chemical Company Adhesion promoter and self-priming arylcyclobutene resin compositions
US5912313A (en) * 1995-11-22 1999-06-15 The B. F. Goodrich Company Addition polymers of polycycloolefins containing silyl functional groups
US5670651A (en) * 1996-02-12 1997-09-23 The United States Of America As Represented By The Secretary Of The Air Force Thermosetting resins derived from 4-hydroxy- and 4-trimethylsiloxy-benzocyclobutene
US5616765A (en) * 1996-02-12 1997-04-01 The United States Of America As Represented By The Secretary Of The Air Force Method for the preparation of 4-hydroxy-and 4-trimethylsiloxybenzocyclobutene
US6184284B1 (en) 1998-08-24 2001-02-06 The Dow Chemical Company Adhesion promoter and self-priming resin compositions and articles made therefrom
US6342572B1 (en) * 1999-12-28 2002-01-29 Honeywell International Inc. Flame retardant benzocyclobutene resin with reduced brittleness
KR100561068B1 (ko) * 2002-07-10 2006-03-15 주식회사 엘지화학 노보넨-에스테르계 부가중합체 및 이의 제조방법
US7989571B2 (en) * 2002-07-10 2011-08-02 Lg Chem, Ltd. Method for producing norbornene monomer composition, norbornene polymer prepared therefrom, optical film comprising the norbornene polymer, and method for producing the norbornene polymer
WO2004007564A1 (en) * 2002-07-10 2004-01-22 Lg Chem, Ltd. Method for preparing norbornene based addition polymer containing ester or acetyl functional group
WO2004050726A1 (en) * 2002-12-05 2004-06-17 Lg Chem, Ltd. Method for polymerizing cycloolefin polymer containing polar functional groups and electronic devices employing the polymerized cycloolefins
DE602005025550D1 (de) * 2004-10-13 2011-02-03 Dow Global Technologies Inc Polymerformulierungen auf Benzocyclobutenbasis
KR101986859B1 (ko) 2011-07-04 2019-06-07 캠브리지 디스플레이 테크놀로지 리미티드 중합체, 단량체 및 중합체의 형성 방법
CN113666956B (zh) * 2021-08-25 2023-04-25 上海橡实化学有限公司 一种水杨醛亚胺硅烷偶联剂及其制备方法和应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328350A (en) * 1966-07-05 1967-06-27 Union Carbide Corp Stabilized organosilicon polymers
CA1257038A (en) * 1984-10-24 1989-07-04 Robert Edelman Siloxane-containing polymers
US4759874A (en) * 1987-08-03 1988-07-26 The Dow Chemical Company Benzocyclobutene-based die attach adhesive compositions

Also Published As

Publication number Publication date
JPH02504168A (ja) 1990-11-29
ZA892220B (en) 1990-11-28
EP0334269A3 (en) 1990-11-07
PH25816A (en) 1991-11-05
MY103985A (en) 1993-10-30
US4831172A (en) 1989-05-16
EP0334269A2 (en) 1989-09-27
WO1989009658A1 (en) 1989-10-19

Similar Documents

Publication Publication Date Title
KR900700555A (ko) 벤조사이클로부텐계 오가노실란 접착보조제
BR8900885A (pt) Pa aerofolica
ES2024060B3 (es) Persiana
FR2635110B1 (fr) Adhesif pregelifiable
FR2637622B1 (fr) Revetement
DK0410443T3 (da) Organosilanforbindelser
DK532589D0 (da) Referenceelektrode
DK35691A (da) Klaebende forbinding
ATA106389A (de) Klebstoff
FI91488B (fi) Seula
DK24289A (da) Taetning
DK165304C (da) Taetningsindretning
FR2569435B1 (fr) Batardeau souple
DE8809318U1 (de) Schichtsystem
NO863443D0 (no) Herdbare silikon-kautsjukmasser.
KR900010254U (ko) 블라인드
KR890020661U (ko) 도마
DK589689A (da) Benzocyklobuten-baserede organosilanadhaesionshjaelpemidler
ATA213488A (de) Mauerwerk
DK131388D0 (da) Spaltehakker
SE8802672D0 (sv) Permanent forband
KR900012354U (ko) 봉인구
SE8902280D0 (sv) Skiktsystem
BR6801964U (pt) Fecho
BR6702050U (pt) Chaise-longue orientavel

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid